TY - CHAP A1 - Liu, E A1 - Conti, Fosca A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Simulations and experiments to analyze stress phenomena in soldered and sintered interconnections between silicon nitride chips and copper substrates T2 - 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) UR - https://doi.org/10.1109/EuroSimE52062.2021.9410869 KW - Performance evaluation KW - Analytical models KW - Compressive stress KW - Thermomechanical processes KW - Data models KW - Microelectronics KW - Finite element analysis Y1 - 2021 UR - https://doi.org/10.1109/EuroSimE52062.2021.9410869 SN - 978-1-6654-1373-2 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Pascucci, Jacopo A1 - Conti, Fosca A1 - Bhogaraju, Sri Krishna A1 - Signorini, Raffaella A1 - Liu, E A1 - Pedron, Danilo A1 - Elger, Gordon ED - Cheben, Pavel ED - Čtyroký, Jiří ED - Molina-Fernández, Iñigo T1 - Micro-Raman to detect stress phenomena in Si-chips bonded onto Cu substrates T2 - Integrated Optics: Design, Devices, Systems and Applications VI UR - https://doi.org/10.1117/12.2576414 Y1 - 2021 UR - https://doi.org/10.1117/12.2576414 SN - 978-1-5106-4385-7 N1 - Poster + Paper PB - SPIE CY - Bellingham ER - TY - CHAP A1 - Conti, Fosca A1 - Liu, E A1 - Bhogaraju, Sri Krishna A1 - Wunderle, Bernhard A1 - Elger, Gordon T1 - Finite Element simulations and Raman measurements to investigate thermomechanical stress in GaN-LEDs T2 - 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) UR - https://doi.org/10.1109/ESTC48849.2020.9229843 KW - finite element method KW - gallium nitride (GaN) KW - LED KW - Raman spectroscopy KW - semiconductor KW - thermomechanical stress Y1 - 2020 UR - https://doi.org/10.1109/ESTC48849.2020.9229843 SN - 978-1-7281-6293-5 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Conti, Fosca A1 - Liu, E A1 - Bhogaraju, Sri Krishna A1 - Lenz, Christoph A1 - Seitz, Roland A1 - Elger, Gordon T1 - Stress evaluations of silicon nitride chips bonded onto copper substrates via SAC soldering, AuSn soldering, and copper sintering T2 - 2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) UR - https://doi.org/10.1109/THERMINIC49743.2020.9420523 KW - Creep KW - Thermomechanical processes KW - Silicon nitride KW - Copper KW - Plastics KW - Microstructure KW - Soldering Y1 - 2021 UR - https://doi.org/10.1109/THERMINIC49743.2020.9420523 SN - 978-1-7281-7643-7 SP - 204 EP - 208 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Liu, E A1 - Schmid, Maximilian A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Advanced location resolved transient thermal analysis T2 - 2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) UR - https://doi.org/10.1109/THERMINIC49743.2020.9420538 KW - Temperature measurement KW - Semiconductor device measurement KW - Thermal resistance KW - Thermal conductivity KW - Dielectric measurement KW - Thermal analysis KW - Dielectrics Y1 - 2021 UR - https://doi.org/10.1109/THERMINIC49743.2020.9420538 SN - 978-1-7281-7643-7 SP - 191 EP - 196 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Zippelius, Andreas A1 - Hanss, Alexander A1 - Liu, E A1 - Schmid, Maximilian A1 - Pérez-Velázquez, Judith A1 - Elger, Gordon T1 - Comparing prediction methods for LED failure measured with Transient Thermal Analysis T2 - 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) UR - https://doi.org/10.1109/EuroSimE48426.2020.9152657 KW - Temperature measurement KW - Artificial neural networks KW - Light emitting diodes KW - Aging KW - Current measurement KW - Training KW - Heating systems Y1 - 2020 UR - https://doi.org/10.1109/EuroSimE48426.2020.9152657 SN - 978-1-7281-6049-8 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Hanss, Alexander A1 - Liu, E A1 - Abdullah, Muhammad Rizwan A1 - Elger, Gordon T1 - Failure Identification in LED packages by Transient Thermal Analysis and Calibrated FE Models T2 - 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) UR - https://doi.org/10.1109/EuroSimE.2019.8724558 KW - Conferences KW - Microelectronics KW - Micromechanical devices KW - Light emitting diodes KW - Aluminum nitride KW - III-V semiconductor materials Y1 - 2019 UR - https://doi.org/10.1109/EuroSimE.2019.8724558 SN - 978-1-5386-8040-7 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Elger, Gordon A1 - Liu, E A1 - Conti, Fosca A1 - Signorini, Raffaella A1 - Brugnolotto, Enrico A1 - Bhogaraju, Sri Krishna T1 - Modelling Thermo-Mechanical Stress in GaN-LEDs Soldered on Copper Substrate with Simulations Validated by Raman Experiments T2 - 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) UR - https://doi.org/10.1109/EuroSimE.2019.8724533 KW - Conferences KW - Microelectronics KW - Micromechanical devices Y1 - 2019 UR - https://doi.org/10.1109/EuroSimE.2019.8724533 SN - 978-1-5386-8040-7 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Signorini, Raffaella A1 - Conti, Fosca A1 - Brugnolotto, Enrico A1 - Pedron, Danilo A1 - Liu, E A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon ED - Cheben, Pavel ED - Čtyroký, Jiří ED - Molina-Fernández, Iñigo T1 - Thermomechanical local stress in assembled GaN LEDs investigated by Raman optical spectroscopy T2 - Integrated Optics: Design, Devices, Systems, and Applications V UR - https://doi.org/10.1117/12.2520992 Y1 - 2019 UR - https://doi.org/10.1117/12.2520992 SN - 978-1-5106-2729-1 N1 - Presentation + Paper PB - SPIE CY - Bellingham ER - TY - CHAP A1 - Brugnolotto, Enrico A1 - Bhogaraju, Sri Krishna A1 - Liu, E A1 - Conti, Fosca A1 - Pedron, Danilo A1 - Signorini, Raffaella A1 - Elger, Gordon T1 - Investigation of thermomechanical local stress induced in assembled GaN LEDs T2 - 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) UR - https://doi.org/10.1109/THERMINIC.2019.8923629 Y1 - 2019 UR - https://doi.org/10.1109/THERMINIC.2019.8923629 SN - 978-1-7281-2078-2 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Schmid, Maximilian A1 - Hermann, Joseph A1 - Liu, E A1 - Elger, Gordon T1 - Correlation of Scanning Acoustic Microscopy and Transient Thermal Analysis to Identify Crack Growth in Solder Joints T2 - Proceedings of the Twenty First InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems: ITherm 2022 UR - https://doi.org/10.1109/iTherm54085.2022.9899664 KW - reliability KW - transient thermal analysis (TTA) KW - scanning acoustic microscopy (SAM) KW - finite element simulation KW - finite element optimization KW - LED KW - solder KW - crack Y1 - 2022 UR - https://doi.org/10.1109/iTherm54085.2022.9899664 SN - 978-1-6654-8503-6 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Liu, E A1 - Bhogaraju, Sri Krishna A1 - Lux, Kerstin A1 - Elger, Gordon A1 - Mou, Rokeya Mumtahana T1 - Investigation Of Stress Generated By Interconnection Processes With Micro-Raman Spectroscopy (μRS) T2 - Proceedings IEEE 72nd Electronic Components and Technology Conference: ECTC 2022 UR - https://doi.org/10.1109/ECTC51906.2022.00123 KW - component KW - μ-Raman Spectroscopy KW - Au80Sn20 KW - Cu sintering KW - finite element simultion Y1 - 2022 UR - https://doi.org/10.1109/ECTC51906.2022.00123 SN - 978-1-6654-7943-1 SP - 739 EP - 745 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Schmid, Maximilian A1 - Liu, E A1 - Saccon, Rodolfo A1 - Elger, Gordon A1 - Klassen, Holger A1 - Müller, Klaus A1 - Pirzer, Georg T1 - Low cost copper based sintered interconnect material for optoelectronics packaging T2 - 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) UR - https://doi.org/10.1109/ECTC51906.2022.00270 KW - Cu sintering KW - flakes KW - PEG600 KW - reliability KW - encapsulation KW - oxidation KW - transient thermal analysis KW - Scanning acoustic microscopy KW - μ-Raman spectroscopy Y1 - 2022 UR - https://doi.org/10.1109/ECTC51906.2022.00270 SN - 978-1-6654-7943-1 SP - 1720 EP - 1725 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Conti, Fosca A1 - Lux, Kerstin A1 - Bhogaraju, Sri Krishna A1 - Liu, E A1 - Lenz, Christoph A1 - Seitz, Roland A1 - Elger, Gordon ED - Baldini, Francesco ED - Homola, Jiri ED - Lieberman, Robert A. T1 - Raman spectroscopy to investigate gallium nitride light emitting diodes after assembling onto copper substrates T2 - Optical Sensors 2021 UR - https://doi.org/10.1117/12.2591947 Y1 - 2021 UR - https://doi.org/10.1117/12.2591947 SN - 978-1-5106-4379-6 N1 - Poster + Paper PB - SPIE CY - Bellingham ER - TY - CHAP A1 - Liu, E A1 - Mohd, Zubair Akhtar A1 - Steinberger, Fabian A1 - Wunderle, Bernhard A1 - Elger, Gordon T1 - Using µ-RAMAN Spectroscopy to Inspect Sintered Interconnects T2 - 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), Proceedings UR - https://doi.org10.1109/ESTC60143.2024.10712149 Y1 - 2024 UR - https://doi.org10.1109/ESTC60143.2024.10712149 SN - 979-8-3503-9036-0 PB - IEEE CY - Piscataway ER -