TY - CHAP A1 - Liu, E A1 - Bhogaraju, Sri Krishna A1 - Lux, Kerstin A1 - Elger, Gordon A1 - Mou, Rokeya Mumtahana T1 - Investigation Of Stress Generated By Interconnection Processes With Micro-Raman Spectroscopy (μRS) T2 - Proceedings IEEE 72nd Electronic Components and Technology Conference: ECTC 2022 UR - https://doi.org/10.1109/ECTC51906.2022.00123 KW - component KW - μ-Raman Spectroscopy KW - Au80Sn20 KW - Cu sintering KW - finite element simultion Y1 - 2022 UR - https://doi.org/10.1109/ECTC51906.2022.00123 SN - 978-1-6654-7943-1 SP - 739 EP - 745 PB - IEEE CY - Piscataway ER - TY - JOUR A1 - Hanss, Alexander A1 - Schmid, Maximilian A1 - Liu, E A1 - Elger, Gordon T1 - Transient thermal analysis as measurement method for IC package structural integrity JF - Chinese Physics B UR - https://doi.org/10.1088/1674-1056/24/6/068105 Y1 - 2015 UR - https://doi.org/10.1088/1674-1056/24/6/068105 SN - 2058-3834 SN - 1674-1056 VL - 24 IS - 6 PB - IOP Publishing CY - Bristol ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Schmid, Maximilian A1 - Liu, E A1 - Saccon, Rodolfo A1 - Elger, Gordon A1 - Klassen, Holger A1 - Müller, Klaus A1 - Pirzer, Georg T1 - Low cost copper based sintered interconnect material for optoelectronics packaging T2 - 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) UR - https://doi.org/10.1109/ECTC51906.2022.00270 KW - Cu sintering KW - flakes KW - PEG600 KW - reliability KW - encapsulation KW - oxidation KW - transient thermal analysis KW - Scanning acoustic microscopy KW - μ-Raman spectroscopy Y1 - 2022 UR - https://doi.org/10.1109/ECTC51906.2022.00270 SN - 978-1-6654-7943-1 SP - 1720 EP - 1725 PB - IEEE CY - Piscataway ER - TY - JOUR A1 - Liu, E A1 - Bhogaraju, Sri Krishna A1 - Wunderle, Bernhard A1 - Elger, Gordon T1 - Investigation of stress relaxation in SAC305 with micro-Raman spectroscopy JF - Microelectronics Reliability UR - https://doi.org/10.1016/j.microrel.2022.114664 Y1 - 2022 UR - https://doi.org/10.1016/j.microrel.2022.114664 SN - 0026-2714 VL - 2022 IS - 138 PB - Elsevier CY - Amsterdam ER - TY - CHAP A1 - Conti, Fosca A1 - Lux, Kerstin A1 - Bhogaraju, Sri Krishna A1 - Liu, E A1 - Lenz, Christoph A1 - Seitz, Roland A1 - Elger, Gordon ED - Baldini, Francesco ED - Homola, Jiri ED - Lieberman, Robert A. T1 - Raman spectroscopy to investigate gallium nitride light emitting diodes after assembling onto copper substrates T2 - Optical Sensors 2021 UR - https://doi.org/10.1117/12.2591947 Y1 - 2021 UR - https://doi.org/10.1117/12.2591947 SN - 978-1-5106-4379-6 N1 - Poster + Paper PB - SPIE CY - Bellingham ER - TY - CHAP A1 - Liu, E A1 - Mohd, Zubair Akhtar A1 - Steinberger, Fabian A1 - Wunderle, Bernhard A1 - Elger, Gordon T1 - Using µ-RAMAN Spectroscopy to Inspect Sintered Interconnects T2 - 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), Proceedings UR - https://doi.org10.1109/ESTC60143.2024.10712149 Y1 - 2024 UR - https://doi.org10.1109/ESTC60143.2024.10712149 SN - 979-8-3503-9036-0 PB - IEEE CY - Piscataway ER -