TY - CHAP A1 - Conti, Fosca A1 - Liu, E A1 - Bhogaraju, Sri Krishna A1 - Lenz, Christoph A1 - Seitz, Roland A1 - Elger, Gordon T1 - Stress evaluations of silicon nitride chips bonded onto copper substrates via SAC soldering, AuSn soldering, and copper sintering T2 - 2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) UR - https://doi.org/10.1109/THERMINIC49743.2020.9420523 KW - Creep KW - Thermomechanical processes KW - Silicon nitride KW - Copper KW - Plastics KW - Microstructure KW - Soldering Y1 - 2021 UR - https://doi.org/10.1109/THERMINIC49743.2020.9420523 SN - 978-1-7281-7643-7 SP - 204 EP - 208 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Gabor, Thomas A1 - Sünkel, Leo A1 - Ritz, Fabian A1 - Phan, Thomy A1 - Belzner, Lenz A1 - Roch, Christoph A1 - Feld, Sebastian A1 - Linnhoff-Popien, Claudia T1 - The Holy Grail of Quantum Artificial Intelligence: Major Challenges in Accelerating the Machine Learning Pipeline T2 - ICSEW'20 : Proceedings of the IEEE/ACM 42nd International Conference on Software Engineering Workshops UR - https://doi.org/10.1145/3387940.3391469 KW - quantum computing KW - artificial intelligence KW - software engineering Y1 - 2020 UR - https://doi.org/10.1145/3387940.3391469 SN - 978-1-4503-7963-2 SP - 456 EP - 461 PB - ACM CY - New York ER - TY - CHAP A1 - Conti, Fosca A1 - Lux, Kerstin A1 - Bhogaraju, Sri Krishna A1 - Liu, E A1 - Lenz, Christoph A1 - Seitz, Roland A1 - Elger, Gordon ED - Baldini, Francesco ED - Homola, Jiri ED - Lieberman, Robert A. T1 - Raman spectroscopy to investigate gallium nitride light emitting diodes after assembling onto copper substrates T2 - Optical Sensors 2021 UR - https://doi.org/10.1117/12.2591947 Y1 - 2021 UR - https://doi.org/10.1117/12.2591947 SN - 978-1-5106-4379-6 N1 - Poster + Paper PB - SPIE CY - Bellingham ER -