TY - JOUR A1 - Mohan, Nihesh A1 - Ahuir-Torres, Juan Ignacio A1 - Kotadia, Hiren R. A1 - Elger, Gordon T1 - Laser sintering of Cu particle-free inks for high-performance printed electronics JF - npj Flexible Electronics N2 - This study investigates laser sintering of Cu particle-free ink (Cu formate tetrahydrate—amino-2-propanol complex) as an alternative to conventional sintering in an oven (under inert/reducing atmosphere). Utilizing benefits of high-speed localized heating using laser, substrate damage can be prevented for low-melting substrates such as Polyethylene Terephthalate (PET). Firstly, a suitable sintering process window is achieved based on energy density for two different flexible polymeric susbtrates: Polyimide and PET using different laser parameters (laser power, scan rate and spot diameter). Subsequently, characterization of laser sintered traces are also made using different laser optic profiles (Gaussian and top hat). Different methodologies for fabrication of metallized Cu layer were also demonstrated. A very low bulk resistivity of 3.24 µΩcm (1.87 times of bulk Cu) was achieved on trace thickness of 0.85 ± 0.15 µm exhibiting good adherence to polymeric substrates. A promising fabrication process of low-cost and reliable flexible printed electronic devices is demonstrated. UR - https://doi.org/10.1038/s41528-025-00389-5 Y1 - 2025 UR - https://doi.org/10.1038/s41528-025-00389-5 UR - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:bvb:573-58266 SN - 2397-4621 VL - 9 IS - 1 PB - Springer CY - London ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Schmid, Maximilian A1 - Hufnagel, Elias A1 - Conti, Fosca A1 - Kotadia, Hiren R. A1 - Elger, Gordon T1 - Low temperature and low pressure die-attach bonding of high power light emitting diodes with self reducing copper complex paste T2 - IEEE 71st Electronic Components and Technology Conference ECTC 2021, Proceedings UR - https://doi.org/10.1109/ECTC32696.2021.00094 KW - low temperature sintering KW - rapid sintering KW - Cu(II) formate KW - reducing binder KW - low pressure sintering KW - high bond strength Y1 - 2021 UR - https://doi.org/10.1109/ECTC32696.2021.00094 SN - 978-1-6654-4097-4 SP - 526 EP - 531 PB - IEEE CY - Piscataway ER - TY - JOUR A1 - Bhogaraju, Sri Krishna A1 - Kotadia, Hiren R. A1 - Conti, Fosca A1 - Mauser, Armin A1 - Rubenbauer, Thomas A1 - Bruetting, Robert A1 - Schneider-Ramelow, Martin A1 - Elger, Gordon T1 - Die-attach bonding with etched micro brass metal pigment flakes for high-power electronics packaging JF - ACS Applied Electronic Materials UR - https://doi.org/10.1021/acsaelm.1c00721 KW - sintering KW - brass flakes KW - nanostructured materials KW - self-reducing KW - etching KW - surface modifications Y1 - 2021 UR - https://doi.org/10.1021/acsaelm.1c00721 SN - 2637-6113 VL - 3 IS - 10 SP - 4587 EP - 4603 PB - ACS Publications CY - Washington ER - TY - JOUR A1 - Bhogaraju, Sri Krishna A1 - Conti, Fosca A1 - Kotadia, Hiren R. A1 - Keim, Simon A1 - Tetzlaff, Ulrich A1 - Elger, Gordon T1 - Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging JF - Journal of Alloys and Compounds UR - https://doi.org/10.1016/j.jallcom.2020.156043 KW - Metals and alloys KW - Microstructure KW - Surfaces and interfaces KW - Sintering Y1 - 2020 UR - https://doi.org/10.1016/j.jallcom.2020.156043 SN - 1873-4669 VL - 2020 IS - 844 PB - Elsevier CY - Amsterdam ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Mokhtari, Omid A1 - Pascucci, Jacopo A1 - Conti, Fosca A1 - Kotadia, Hiren R. A1 - Elger, Gordon T1 - A multi-pronged approach to low-pressure Cu sintering using surface-modified particles, substrate and chip metallization T2 - International Symposium on Microelectronics UR - https://doi.org/10.4071/2380-4505-2019.1.000387 Y1 - 2019 UR - https://doi.org/10.4071/2380-4505-2019.1.000387 SN - 2380-4505 SN - 1085-8024 VL - 2019 IS - 1 SP - 387 EP - 392 PB - IMAPS CY - Pittsburgh ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Schmid, Maximilian A1 - Kotadia, Hiren R. A1 - Conti, Fosca A1 - Elger, Gordon T1 - Highly reliable die-attach bonding with etched brass flakes T2 - 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC): Technical Papers UR - https://doi.org/10.23919/EMPC53418.2021.9584967 KW - sintering KW - etched brass KW - flakes KW - reliability KW - LED KW - die-attach KW - in-situ copper oxide reduction KW - transient thermal analysis Y1 - 2021 UR - https://doi.org/10.23919/EMPC53418.2021.9584967 SN - 978-0-9568086-7-7 PB - IEEE CY - Piscataway ER - TY - JOUR A1 - Mohan, Nihesh A1 - Ahuir-Torres, Juan Ignacio A1 - Bhogaraju, Sri Krishna A1 - Webler, Ralf A1 - Kotadia, Hiren R. A1 - Erdogan, Hüseyin A1 - Elger, Gordon T1 - Decomposition mechanism and morphological evolution of in situ realized Cu nanoparticles in Cu complex inks JF - New Journal of Chemistry UR - https://doi.org/10.1039/D3NJ05185D Y1 - 2024 UR - https://doi.org/10.1039/D3NJ05185D SN - 1369-9261 VL - 48 IS - 15 SP - 6796 EP - 6808 PB - RSC CY - London ER - TY - CHAP A1 - Mohan, Nihesh A1 - Ahuir-Torres, Juan Ignacio A1 - Bhogaraju, Sri Krishna A1 - Kotadia, Hiren R. A1 - Elger, Gordon T1 - Rapid Sintering of Inkjet Printed Cu Complex Inks Using Laser in Air T2 - 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) UR - https://doi.org/10.23919/EMPC55870.2023.10418323 Y1 - 2024 UR - https://doi.org/10.23919/EMPC55870.2023.10418323 SN - 978-0-9568086-9-1 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Ahuir-Torres, Juan Ignacio A1 - Bhogaraju, Sri Krishna A1 - West, Geoff A1 - Elger, Gordon A1 - Kotadia, Hiren R. T1 - Understanding Cu Sintering and Its Role on Corrosion Behaviour for High-Temperature Microelectronic Application T2 - 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) UR - https://doi.org/10.23919/EMPC55870.2023.10418365 Y1 - 2024 UR - https://doi.org/10.23919/EMPC55870.2023.10418365 SN - 978-0-9568086-9-1 PB - IEEE CY - Piscataway ER -