TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Schmid, Maximilian A1 - Liu, E A1 - Saccon, Rodolfo A1 - Elger, Gordon A1 - Klassen, Holger A1 - Müller, Klaus A1 - Pirzer, Georg T1 - Low cost copper based sintered interconnect material for optoelectronics packaging T2 - 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) UR - https://doi.org/10.1109/ECTC51906.2022.00270 KW - Cu sintering KW - flakes KW - PEG600 KW - reliability KW - encapsulation KW - oxidation KW - transient thermal analysis KW - Scanning acoustic microscopy KW - μ-Raman spectroscopy Y1 - 2022 UR - https://doi.org/10.1109/ECTC51906.2022.00270 SN - 978-1-6654-7943-1 SP - 1720 EP - 1725 PB - IEEE CY - Piscataway ER -