TY - THES A1 - Hufnagel, Elias T1 - Automatisierte Charakterisierung von Leistungs-MOSFETs zur Qualitätssicherung Y1 - 2023 UR - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:bvb:573-32938 CY - Ingolstadt ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Schmid, Maximilian A1 - Hufnagel, Elias A1 - Conti, Fosca A1 - Kotadia, Hiren R. A1 - Elger, Gordon T1 - Low temperature and low pressure die-attach bonding of high power light emitting diodes with self reducing copper complex paste T2 - IEEE 71st Electronic Components and Technology Conference ECTC 2021, Proceedings UR - https://doi.org/10.1109/ECTC32696.2021.00094 KW - low temperature sintering KW - rapid sintering KW - Cu(II) formate KW - reducing binder KW - low pressure sintering KW - high bond strength Y1 - 2021 UR - https://doi.org/10.1109/ECTC32696.2021.00094 SN - 978-1-6654-4097-4 SP - 526 EP - 531 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Zippelius, Andreas A1 - Hufnagel, Elias A1 - Shah, Jainam A1 - Schmid, Maximilian A1 - Elger, Gordon T1 - Reliability of High-Power LEDs Under Varying Thermal Aging Conditions T2 - 2025 31st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) UR - https://doi.org/10.1109/THERMINIC65879.2025.11216869 Y1 - 2025 UR - https://doi.org/10.1109/THERMINIC65879.2025.11216869 SN - 979-8-3315-9486-2 PB - IEEE CY - Piscataway ER -