TY - JOUR A1 - Schwan, Hannes A1 - Mohan, Nihesh A1 - Schmid, Maximilian A1 - Saha, Rocky Kumar A1 - Klassen, Holger A1 - Müller, Klaus A1 - Elger, Gordon T1 - Sintering for High Power Optoelectronic Devices JF - Micromachines N2 - Residual-free eutectic Au80Sn20 soldering is still the dominant assembly technology for optoelectronic devices such as high-power lasers, LEDs, and photodiodes. Due to the high cost of gold, alternatives are desirable. This paper investigates the thermal performance of copper-based sintering for optoelectronic submodules on first and second level to obtain thermally efficient thin bondlines. Sintered interconnects obtained by a new particle-free copper ink, based on complexed copper salt, are compared with copper flake and silver nanoparticle sintered interconnects and benchmarked against AuSn solder interconnects. The copper ink is dispensed and predried at 130 °C to facilitate in situ generation of Cu nanoparticles by thermal decomposition of the metal salt before sintering. Submounts are then sintered at 275 °C for 15 min under nitrogen with 30 MPa pressure, forming uniform 2–5 µm copper layers achieving shear strengths above 31 MPa. Unpackaged LEDs are bonded on first level using the copper ink but applying only 10 MPa to avoid damaging the semiconductor dies. Thermal performance is evaluated via transient thermal analysis. Results show that copper ink interfaces approach the performance of thin AuSn joints and match silver interconnects at second level. However, at first level, AuSn and sintered interconnects of commercial silver and copper pastes remained superior due to the relative inhomogeneous thickness of the thin Cu copper layer after predrying, requiring higher bonding pressure to equalize surface inhomogeneities. UR - https://doi.org/10.3390/mi16101164 Y1 - 2025 UR - https://doi.org/10.3390/mi16101164 UR - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:bvb:573-64984 SN - 2072-666X VL - 16 IS - 10 PB - MDPI CY - Basel ER - TY - THES A1 - Schwan, Hannes T1 - Entwicklung und Verifikation einer Betriebsstrategie für ein hocheffizientes Push-Pull ZCS Class E² induktives Energieübertragungssystem für automobile Anwendungen N2 - In dieser Arbeit wird unter der Berücksichtigung des Einflusses der relativen Position der Übertragungsspulen eines Push-Pull ZCS Class E2 induktiven Energieübertragungssystems für die automobile Anwendung eine Betriebsstrategie entwickelt und experimentell untersucht, ob diese optimales Verhalten unabhängig des Betriebspunktes gewährleisten kann. Y1 - 2021 UR - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:bvb:573-8550 CY - Ingolstadt ER - TY - CHAP A1 - Schwan, Hannes A1 - Schmid, Maximilian A1 - Elger, Gordon T1 - Layer Resolved Thermal Impedance Measurement with Laser Stimulated Transient Thermal Analysis of Semiconductor Modules T2 - THERMINIC 2024: Proceedings of 2024, 30th International Workshop on Thermal Investigations of ICs and Systems UR - https://doi.org/10.1109/THERMINIC62015.2024.10732233 Y1 - 2024 UR - https://doi.org/10.1109/THERMINIC62015.2024.10732233 SN - 979-8-3503-8782-7 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Schwan, Hannes A1 - Pforr, Johannes A1 - Elger, Gordon ED - Mesago Messe Frankfurt GmbH, T1 - ZVS Class E2 Wireless Power Transfer System with Self-Resonant Transmission Coils for the Biomedical Application T2 - PCIM Europe 2022: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management UR - https://doi.org/10.30420/565822107 Y1 - 2022 UR - https://doi.org/10.30420/565822107 SN - 978-3-8007-5822-7 PB - VDE Verlag CY - Berlin ER - TY - CHAP A1 - Schwan, Hannes A1 - Schmid, Maximilian A1 - Elger, Gordon T1 - Laser Stimulated Transient Thermal Analysis of Semiconductors T2 - THERMINIC 2022: Proceedings 2022 UR - https://doi.org/10.1109/THERMINIC57263.2022.9950672 KW - transient thermal analysis KW - laser KW - thermal resistance KW - reliability KW - LED Y1 - 2022 UR - https://doi.org/10.1109/THERMINIC57263.2022.9950672 SN - 978-1-6654-9229-4 PB - IEEE CY - Piscataway ER -