TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Mokhtari, Omid A1 - Pascucci, Jacopo A1 - Hanss, Alexander A1 - Schmid, Maximilian A1 - Conti, Fosca A1 - Elger, Gordon T1 - Hybrid Cu particle paste with surface-modified particles for high temperature electronics packaging T2 - Proceedings 22nd European Microelectronics and Packaging Conference, EMPC UR - https://doi.org/10.23919/EMPC44848.2019.8951887 Y1 - 2020 UR - https://doi.org/10.23919/EMPC44848.2019.8951887 SN - 978-1-7281-6291-1 PB - IEEE CY - Piscataway ER - TY - JOUR A1 - Hanss, Alexander A1 - Schmid, Maximilian A1 - Liu, E A1 - Elger, Gordon T1 - Transient thermal analysis as measurement method for IC package structural integrity JF - Chinese Physics B UR - https://doi.org/10.1088/1674-1056/24/6/068105 Y1 - 2015 UR - https://doi.org/10.1088/1674-1056/24/6/068105 SN - 2058-3834 SN - 1674-1056 VL - 24 IS - 6 PB - IOP Publishing CY - Bristol ER - TY - JOUR A1 - Hanss, Alexander A1 - Elger, Gordon T1 - Residual free solder process for fluxless solder pastes JF - Soldering & Surface Mount Technology UR - https://doi.org/10.1108/SSMT-10-2017-0030 KW - Reflow soldering KW - LED KW - Fluxless KW - Solder process Y1 - 2018 UR - https://doi.org/10.1108/SSMT-10-2017-0030 SN - 0954-0911 VL - 30 IS - 2 SP - 118 EP - 128 PB - Emerald CY - Bingley ER - TY - CHAP A1 - Hanss, Alexander A1 - Schmid, Maximilian A1 - Bhogaraju, Sri Krishna A1 - Conti, Fosca A1 - Elger, Gordon T1 - Process development and reliability of sintered high power chip size packages and flip chip LEDs T2 - 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) UR - https://doi.org/10.23919/ICEP.2018.8374351 KW - LED KW - Reliability KW - Sintering KW - Transient Thermal Testing Y1 - 2018 UR - https://doi.org/10.23919/ICEP.2018.8374351 SN - 978-4-9902-1885-0 SP - 479 EP - 484 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Hanss, Alexander A1 - Schmid, Maximilian A1 - Elger, Gordon A1 - Conti, Fosca T1 - Evaluation of silver and copper sintering of first level interconnects for high power LEDs T2 - 2018 7th Electronic System-Integration Technology Conference (ESTC) UR - https://doi.org/10.1109/ESTC.2018.8546499 KW - transient thermal analysis KW - pressureless silver sintering KW - pressureless copper sintering KW - bonding atmosphere KW - particle size KW - binder chemistry Y1 - 2018 UR - https://doi.org/10.1109/ESTC.2018.8546499 SN - 978-1-5386-6814-6 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Schmid, Maximilian A1 - Elger, Gordon T1 - Measurement of the transient thermal impedance of MOSFETs over the sensitivity of the threshold voltage T2 - EPE'18 ECCE Europe KW - Reliability KW - MOSFET KW - Thermal stress KW - Thermal design KW - Measurement Y1 - 2018 UR - https://ieeexplore.ieee.org/document/8515480 SN - 978-9-0758-1528-3 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Elger, Gordon A1 - Hanss, Alexander A1 - Schmid, Maximilian T1 - Transient Thermal Analysis as In-Situ Method in Accelerated Stress Tests to Access Package Integrity of LEDs T2 - 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) UR - https://doi.org/10.1109/THERMINIC.2018.8593278 KW - Temperature measurement KW - Conferences KW - Integrated circuits KW - Light emitting diodes KW - Transient analysis KW - Temperature dependence KW - Thermal analysis Y1 - 2018 UR - https://doi.org/10.1109/THERMINIC.2018.8593278 SN - 978-1-5386-6759-0 PB - IEEE CY - Piscataway ER - TY - JOUR A1 - Conti, Fosca A1 - Hanss, Alexander A1 - Mokhtari, Omid A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Formation of tin-based crystals from a SnAgCu alloy under formic acid vapor JF - New Journal of Chemistry UR - https://doi.org/10.1039/C8NJ04173C Y1 - 2018 UR - https://doi.org/10.1039/C8NJ04173C SN - 1369-9261 VL - 42 IS - 23 SP - 19232 EP - 19236 PB - RSC CY - London ER - TY - CHAP A1 - Hanss, Alexander A1 - Schmid, Maximilian A1 - Elger, Gordon T1 - Combined Accelerated Stress Test with In-Situ Thermal Impedance Monitoring to Access LED Reliability T2 - Proceedings 2018 20th International Conference on Electronic Materials and Packaging (EMAP) UR - https://doi.org/10.1109/EMAP.2018.8660833 KW - Temperature measurement KW - Light emitting diodes KW - Temperature KW - Electronic packaging thermal management KW - Temperature sensors KW - Transient analysis KW - Sensitivity Y1 - 2019 UR - https://doi.org/10.1109/EMAP.2018.8660833 SN - 978-1-5386-5642-6 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Elger, Gordon A1 - Biberger, M. A1 - Meier, M. A1 - Schweigart, Helmut A1 - Schneider, Klaus A1 - Erdogan, Hüseyin T1 - Technische Sauberkeit von Radarbaugruppen T2 - Elektronische Baugruppen und Leiterplatten EBL 2018: Multifunktionale Aufbau- und Verbindungstechnik – Beherrschung der Vielfalt Y1 - 2018 UR - https://www.dvs-media.eu/de/buecher/dvs-berichte/3644/elektronische-baugruppen-und-leiterplatten-ebl-2018 SN - 978-3-96144-026-9 SP - 339 EP - 349 PB - DVS Media GmbH CY - Düsseldorf ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Schmid, Maximilian A1 - Liu, E A1 - Saccon, Rodolfo A1 - Elger, Gordon A1 - Klassen, Holger A1 - Müller, Klaus A1 - Pirzer, Georg T1 - Low cost copper based sintered interconnect material for optoelectronics packaging T2 - 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) UR - https://doi.org/10.1109/ECTC51906.2022.00270 KW - Cu sintering KW - flakes KW - PEG600 KW - reliability KW - encapsulation KW - oxidation KW - transient thermal analysis KW - Scanning acoustic microscopy KW - μ-Raman spectroscopy Y1 - 2022 UR - https://doi.org/10.1109/ECTC51906.2022.00270 SN - 978-1-6654-7943-1 SP - 1720 EP - 1725 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Signorini, Raffaella A1 - Pedron, Danilo A1 - Conti, Fosca A1 - Hanss, Alexander A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Thermomechanical Stress in GaN LED Soldered on Copper Substrate Evaluated by Raman Measurements and Computer Modelling T2 - 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) UR - https://doi.org/10.1109/THERMINIC.2018.8593304 KW - Stress KW - Light emitting diodes KW - Gallium nitride KW - Phonons KW - Substrates KW - Temperature measurement KW - Silicon Y1 - 2018 UR - https://doi.org/10.1109/THERMINIC.2018.8593304 SN - 978-1-5386-6759-0 PB - IEEE CY - Piscataway ER - TY - JOUR A1 - Liu, E A1 - Bhogaraju, Sri Krishna A1 - Wunderle, Bernhard A1 - Elger, Gordon T1 - Investigation of stress relaxation in SAC305 with micro-Raman spectroscopy JF - Microelectronics Reliability UR - https://doi.org/10.1016/j.microrel.2022.114664 Y1 - 2022 UR - https://doi.org/10.1016/j.microrel.2022.114664 SN - 0026-2714 VL - 2022 IS - 138 PB - Elsevier CY - Amsterdam ER - TY - CHAP A1 - Mohan, Nihesh A1 - Bhogaraju, Sri Krishna A1 - Lysien, Mateusz A1 - Schneider, Ludovic A1 - Granek, Filip A1 - Lux, Kerstin A1 - Elger, Gordon T1 - Drop feature optimization for fine trace inkjet printing T2 - 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC): Technical Papers UR - https://doi.org/10.23919/EMPC53418.2021.9585004 KW - inkjet printing KW - Ag nanoparticles KW - fine trace KW - surface interactions KW - drop feature KW - ink properties KW - sintering Y1 - 2021 UR - https://doi.org/10.23919/EMPC53418.2021.9585004 SN - 978-0-9568086-7-7 PB - IEEE CY - Piscataway ER - TY - JOUR A1 - Kettelgerdes, Marcel A1 - Elger, Gordon T1 - In-Field Measurement and Methodology for Modeling and Validation of Precipitation Effects on Solid-State LiDAR Sensors JF - IEEE Journal of Radio Frequency Identification UR - https://doi.org/10.1109/JRFID.2023.3234999 KW - LiDAR KW - adverse weather KW - sensor model KW - automotive KW - simulation KW - virtual validation KW - ROS KW - ADAS Y1 - 2023 UR - https://doi.org/10.1109/JRFID.2023.3234999 SN - 2469-7281 VL - 7 SP - 192 EP - 202 PB - Institute of Electrical and Electronics Engineers (IEEE) CY - New York ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Schmid, Maximilian A1 - Kotadia, Hiren R. A1 - Conti, Fosca A1 - Elger, Gordon T1 - Highly reliable die-attach bonding with etched brass flakes T2 - 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC): Technical Papers UR - https://doi.org/10.23919/EMPC53418.2021.9584967 KW - sintering KW - etched brass KW - flakes KW - reliability KW - LED KW - die-attach KW - in-situ copper oxide reduction KW - transient thermal analysis Y1 - 2021 UR - https://doi.org/10.23919/EMPC53418.2021.9584967 SN - 978-0-9568086-7-7 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Steinberger, Fabian A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Correlation between the characteristics of printed sinter paste and the quality of sintered interconnects through non-destructive analysis techniques T2 - NordPac 2023 Annual Microelectronics and Packaging Conference and Exhibition: Reviewed Papers UR - https://doi.org/10.23919/NordPac58023.2023.10186250 KW - profilometry KW - sinter paste KW - interconnect KW - SAM Y1 - 2023 UR - https://doi.org/10.23919/NordPac58023.2023.10186250 SN - 978-91-89821-06-4 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Kettelgerdes, Marcel A1 - Elger, Gordon T1 - Modeling Methodology and In-field Measurement Setup to Develop Empiric Weather Models for Solid-State LiDAR Sensors T2 - 2022 IEEE 2nd International Conference on Digital Twins and Parallel Intelligence (DTPI) UR - https://doi.org/10.1109/DTPI55838.2022.9998918 KW - LiDAR KW - adverse weather KW - sensor model KW - auto-motive KW - simulation KW - virtual validation KW - ROS KW - ADAS Y1 - 2022 UR - https://doi.org/10.1109/DTPI55838.2022.9998918 SN - 978-1-6654-9227-0 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Tavakolibasti, M. A1 - Meszmer, P. A1 - Kettelgerdes, Marcel A1 - Böttger, Gunnar A1 - Elger, Gordon A1 - Erdogan, Hüseyin A1 - Seshaditya, A. A1 - Wunderle, Bernhard T1 - Structural-thermal-optical-performance (STOP) analysis of a lens stack for realization of a digital twin of an automotive LiDAR T2 - 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) UR - https://doi.org/10.1109/EuroSimE54907.2022.9758897 KW - thermo-mechanical simulation KW - optical simulation KW - digital twin KW - structural thermal optical performance analysis Y1 - 2022 UR - https://doi.org/10.1109/EuroSimE54907.2022.9758897 SN - 978-1-6654-5836-8 PB - IEEE CY - Piscataway, NJ ER - TY - JOUR A1 - Senel, Numan A1 - Kefferpütz, Klaus A1 - Doycheva, Kristina A1 - Elger, Gordon T1 - Multi-Sensor Data Fusion for Real-Time Multi-Object Tracking JF - Processes N2 - Sensor data fusion is essential for environmental perception within smart traffic applications. By using multiple sensors cooperatively, the accuracy and probability of the perception are increased, which is crucial for critical traffic scenarios or under bad weather conditions. In this paper, a modular real-time capable multi-sensor fusion framework is presented and tested to fuse data on the object list level from distributed automotive sensors (cameras, radar, and LiDAR). The modular multi-sensor fusion architecture receives an object list (untracked objects) from each sensor. The fusion framework combines classical data fusion algorithms, as it contains a coordinate transformation module, an object association module (Hungarian algorithm), an object tracking module (unscented Kalman filter), and a movement compensation module. Due to the modular design, the fusion framework is adaptable and does not rely on the number of sensors or their types. Moreover, the method continues to operate because of this adaptable design in case of an individual sensor failure. This is an essential feature for safety-critical applications. The architecture targets environmental perception in challenging time-critical applications. The developed fusion framework is tested using simulation and public domain experimental data. Using the developed framework, sensor fusion is obtained well below 10 milliseconds of computing time using an AMD Ryzen 7 5800H mobile processor and the Python programming language. Furthermore, the object-level multi-sensor approach enables the detection of changes in the extrinsic calibration of the sensors and potential sensor failures. A concept was developed to use the multi-sensor framework to identify sensor malfunctions. This feature will become extremely important in ensuring the functional safety of the sensors for autonomous driving. UR - https://doi.org/10.3390/pr11020501 KW - environmental perception KW - sensor fusion KW - autonomous vehicle KW - unscented Kalman filter KW - object tracking KW - roadside units Y1 - 2023 UR - https://doi.org/10.3390/pr11020501 UR - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:bvb:573-31989 SN - 2227-9717 VL - 11 IS - 2 PB - MDPI CY - Basel ER -