TY - JOUR A1 - Kleiner, Jan A1 - Komsiyska, Lidiya A1 - Elger, Gordon A1 - Endisch, Christian T1 - Thermal modelling of a prismatic lithium-ion cell in a battery electric vehicle environment BT - influences of the experimental validation setup JF - Energies N2 - In electric vehicles with lithium-ion battery systems, the temperature of the battery cells has a great impact on performance, safety, and lifetime. Therefore, developing thermal models of lithium-ion batteries to predict and investigate the temperature development and its impact is crucial. Commonly, models are validated with experimental data to ensure correct model behaviour. However, influences of experimental setups or comprehensive validation concepts are often not considered, especially for the use case of prismatic cells in a battery electric vehicle. In this work, a 3D electro–thermal model is developed and experimentally validated to predict the cell’s temperature behaviour for a single prismatic cell under battery electric vehicle (BEV) boundary conditions. One focus is on the development of a single cell’s experimental setup and the investigation of the commonly neglected influences of an experimental setup on the cell’s thermal behaviour. Furthermore, a detailed validation is performed for the laboratory BEV scenario for spatially resolved temperatures and heat generation. For validation, static and dynamic loads are considered as well as the detected experimental influences. The validated model is used to predict the temperature within the cell in the BEV application for constant current and Worldwide harmonized Light vehicles Test Procedure (WLTP) load profile. UR - https://doi.org/10.3390/en13010062 KW - Lithium-Ionen-Batterie KW - Elektrofahrzeug Y1 - 2019 UR - https://doi.org/10.3390/en13010062 UR - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:bvb:573-7532 SN - 1996-1073 VL - 13 IS - 1 PB - MDPI CY - Basel ER - TY - JOUR A1 - Liu, E A1 - Conti, Fosca A1 - Bhogaraju, Sri Krishna A1 - Signorini, Raffaella A1 - Pedron, Danilo A1 - Wunderle, Bernhard A1 - Elger, Gordon T1 - Thermomechanical stress in GaN-LEDs soldered onto Cu substrates studied using finite element method and Raman spectroscopy JF - Journal of Raman Spectroscopy N2 - Local thermomechanical stress can cause failures in semiconductor packages during long-time operation under harsh environmental conditions. This study helps to explain the packaging-induced stress in blue GaN-LEDs soldered onto copper substrates using AuSn alloy as lead-free interconnect material. Based on the finite element method, a virtual prototype is developed to simulate the thermomechanical behavior and stress in the LED and in the complete LED/AuSn/Cu assembly considering plastic and viscoplastic strain. The investigations were performed by varying the temperature between −50°C and 180°C. To validate the model, the simulation results are compared to experimental data collected with Raman spectroscopy. Studies of the urn:x-wiley:03770486:media:jrs5947:jrs5947-math-0003 phonon mode of GaN semiconductor are elaborated to understand the induced thermomechanical stress. The model enables evaluation of the stress in the interfaces of the assembly, which otherwise cannot be accessed by measurements. It serves to predict how assemblies would perform, before committing resources to build a physical prototype. UR - https://doi.org/10.1002/jrs.5947 KW - finite element method KW - gallium nitride (GaN) KW - LED KW - semiconductor KW - thermomechanical stress Y1 - 2020 UR - https://doi.org/10.1002/jrs.5947 UR - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:bvb:573-9438 SN - 1097-4555 VL - 51 IS - 10 SP - 2083 EP - 2094 PB - Wiley CY - Chichester ER - TY - CHAP A1 - Agrawal, Shiva A1 - Elger, Gordon T1 - Concept of infrastructure based environment perception for IN2Lab test field for automated driving T2 - 2021 IEEE International Smart Cities Conference (ISC2) UR - https://doi.org/10.1109/ISC253183.2021.9562894 KW - RSU KW - Radar KW - Lidar KW - Camera KW - Intelligent Infrastructure KW - Autonomous Driving KW - Sensor fusion Y1 - 2021 UR - https://doi.org/10.1109/ISC253183.2021.9562894 SN - 978-1-6654-4919-9 SN - 2687-8860 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Liu, E A1 - Conti, Fosca A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Simulations and experiments to analyze stress phenomena in soldered and sintered interconnections between silicon nitride chips and copper substrates T2 - 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) UR - https://doi.org/10.1109/EuroSimE52062.2021.9410869 KW - Performance evaluation KW - Analytical models KW - Compressive stress KW - Thermomechanical processes KW - Data models KW - Microelectronics KW - Finite element analysis Y1 - 2021 UR - https://doi.org/10.1109/EuroSimE52062.2021.9410869 SN - 978-1-6654-1373-2 PB - IEEE CY - Piscataway ER - TY - JOUR A1 - Schmid, Maximilian A1 - Bhogaraju, Sri Krishna A1 - Liu, E A1 - Elger, Gordon T1 - Comparison of Nondestructive Testing Methods for Solder, Sinter, and Adhesive Interconnects in Power and Opto-Electronics JF - Applied Sciences N2 - Reliability is one of the major requirements for power and opto-electronic devices across all segments. High operation temperature and/or high thermomechanical stress cause defects and degradation of materials and interconnects, which may lead to malfunctions with costly or even life-threatening consequences. To avoid or at least reduce failures, nondestructive testing (NDT) methods are common within development and production of power and opto-electronics. Currently, the dominating NDT methods are X-ray, scanning acoustic microscopy (SAM), and transient thermal analysis (TTA). However, they have different strengths and weaknesses with respect to materials and mechanical designs. This paper compares these NDT methods for different interconnect technologies, i.e., reflow soldering, adhesive, and sintered interconnection. While X-ray provided adequate results for soldered interfaces, inspection of adhesives and sintered interconnects was not possible. With SAM, evaluation of adhesives and sintered interconnects was also feasible, but quality depended strongly on the sample under test. TTA enabled sufficiently detailed results for all the interconnect applications. Automated TTA equipment, as the in-house developed tester used within this investigation, enabled measurement times compatible with SAM and X-ray. In the investigations, all methods revealed their pros and cons, and their selection has to depend on the sample under tests and the required analysis depth and data details. In the paper, guidelines are formulated for an appropriate decision on the NDT method depending on sample and requirements. UR - https://doi.org/10.3390/app10238516 KW - reliability KW - nondestructive testing KW - power electronics KW - X-ray KW - scanning acoustic microscopy KW - transient thermal analysis KW - TTA KW - sintering KW - LED KW - MOSFET Y1 - 2020 UR - https://doi.org/10.3390/app10238516 UR - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:bvb:573-12518 SN - 2076-3417 VL - 10 IS - 23 PB - MDPI CY - Basel ER - TY - INPR A1 - Han, Longfei A1 - Xu, Qiuyu A1 - Kefferpütz, Klaus A1 - Elger, Gordon A1 - Beyerer, Jürgen T1 - Applying Extended Object Tracking for Self-Localization of Roadside Radar Sensors N2 - Intelligent Transportation Systems (ITS) can benefit from roadside 4D mmWave radar sensors for large-scale traffic monitoring due to their weatherproof functionality, long sensing range and low manufacturing cost. However, the localization method using external measurement devices has limitations in urban environments. Furthermore, if the sensor mount exhibits changes due to environmental influences, they cannot be corrected when the measurement is performed only during the installation. In this paper, we propose self-localization of roadside radar data using Extended Object Tracking (EOT). The method analyses both the tracked trajectories of the vehicles observed by the sensor and the aerial laser scan of city streets, assigns labels of driving behaviors such as "straight ahead", "left turn", "right turn" to trajectory sections and road segments, and performs Semantic Iterative Closest Points (SICP) algorithm to register the point cloud. The method exploits the result from a down stream task -- object tracking -- for localization. We demonstrate high accuracy in the sub-meter range along with very low orientation error. The method also shows good data efficiency. The evaluation is done in both simulation and real-world tests. UR - https://doi.org/10.48550/arXiv.2407.03084 Y1 - 2024 UR - https://doi.org/10.48550/arXiv.2407.03084 UR - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:bvb:573-58361 PB - arXiv CY - Ithaca ER - TY - CHAP A1 - Meess, Henri A1 - Gerner, Jeremias A1 - Hein, Daniel A1 - Schmidtner, Stefanie A1 - Elger, Gordon T1 - Reinforcement Learning for Traffic Signal Control Optimization: A Concept for Real-World Implementation T2 - AAMAS '22: Proceedings of the 21st International Conference on Autonomous Agents and Multiagent Systems UR - https://dl.acm.org/doi/10.5555/3535850.3536081 KW - Multi-Agent Reinforcement Learning in real-world KW - MARL KW - traffic optimization KW - multimodal traffic KW - DRL Y1 - 2022 UR - https://dl.acm.org/doi/10.5555/3535850.3536081 SN - 978-1-4503-9213-6 SP - 1699 EP - 1701 PB - International Foundation for Autonomous Agents and Multiagent Systems CY - Richland ER - TY - CHAP A1 - Agrawal, Shiva A1 - Song, Rui A1 - Doycheva, Kristina A1 - Knoll, Alois A1 - Elger, Gordon ED - Klein, Cornel ED - Jarke, Matthias ED - Ploeg, Jeroen ED - Helfert, Markus ED - Berns, Karsten ED - Gusikhin, Oleg T1 - Intelligent Roadside Infrastructure for Connected Mobility T2 - Smart Cities, Green Technologies, and Intelligent Transport Systems: 11th International Conference, SMARTGREENS 2022 and 8th International Conference, VEHITS 2022: Revised Selected Papers UR - https://doi.org/10.1007/978-3-031-37470-8_6 Y1 - 2023 UR - https://doi.org/10.1007/978-3-031-37470-8_6 UR - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:bvb:573-41761 SN - 978-3-031-37470-8 SN - 1865-0937 SP - 134 EP - 157 PB - Springer CY - Cham ER - TY - CHAP A1 - Agrawal, Shiva A1 - Bhanderi, Savankumar A1 - Amanagi, Sumit A1 - Doycheva, Kristina A1 - Elger, Gordon ED - Vinel, Alexey ED - Ploeg, Jeroen ED - Berns, Karsten ED - Gusikhin, Oleg T1 - Instance Segmentation and Detection of Children to Safeguard Vulnerable Traffic User by Infrastructure T2 - Proceedings of the 9th International Conference on Vehicle Technology and Intelligent Transport Systems N2 - Cameras mounted on intelligent roadside infrastructure units and vehicles can detect humans on the road using state-of-the-art perception algorithms, but these algorithms are presently not trained to distinguish between human and adult. However, this is a crucial requirement from a safety perspective because a child may not follow all the traffic rules, particularly while crossing the road. Moreover, a child may stop or may start playing on the road. In such situations, the separation of a child from an adult is necessary. The work in this paper targets to solve this problem by applying a transfer-learning-based neural network approach to classify child and adult separately in camera images. The described work is comprised of image data collection, data annotation, transfer learning-based model development, and evaluation. For the work, Mask-RCNN (region-based convolutional neural network) with different backbone architectures and two different baselines are investigated and the perception precision of the architectures after transfer-learning is compared. The results reveal that the best performing trained model is able to detect and classify children and adults separately in different road scenarios with segmentation mask AP (average precision) of 85% and bounding box AP of 92%. UR - https://doi.org/10.5220/0011825400003479 KW - Child and Adult Detection KW - Classification KW - Intelligent Roadside Infrastructure KW - Image Segmentation KW - Mask-RCNN KW - Traffic Flow Optimization KW - Transfer Learning Y1 - 2023 UR - https://doi.org/10.5220/0011825400003479 UR - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:bvb:573-41785 SN - 978-989-758-652-1 SN - 2184-495X SP - 206 EP - 214 PB - SciTePress CY - Setúbal ER - TY - JOUR A1 - Agrawal, Shiva A1 - Bhanderi, Savankumar A1 - Elger, Gordon T1 - Infra-3DRC-FusionNet: Deep Fusion of Roadside Mounted RGB Mono Camera and Three-Dimensional Automotive Radar for Traffic User Detection JF - Sensors N2 - Mono RGB cameras and automotive radar sensors provide a complementary information set that makes them excellent candidates for sensor data fusion to obtain robust traffic user detection. This has been widely used in the vehicle domain and recently introduced in roadside-mounted smart infrastructure-based road user detection. However, the performance of the most commonly used late fusion methods often degrades when the camera fails to detect road users in adverse environmental conditions. The solution is to fuse the data using deep neural networks at the early stage of the fusion pipeline to use the complete data provided by both sensors. Research has been carried out in this area, but is limited to vehicle-based sensor setups. Hence, this work proposes a novel deep neural network to jointly fuse RGB mono-camera images and 3D automotive radar point cloud data to obtain enhanced traffic user detection for the roadside-mounted smart infrastructure setup. Projected radar points are first used to generate anchors in image regions with a high likelihood of road users, including areas not visible to the camera. These anchors guide the prediction of 2D bounding boxes, object categories, and confidence scores. Valid detections are then used to segment radar points by instance, and the results are post-processed to produce final road user detections in the ground plane. The trained model is evaluated for different light and weather conditions using ground truth data from a lidar sensor. It provides a precision of 92%, recall of 78%, and F1-score of 85%. The proposed deep fusion methodology has 33%, 6%, and 21% absolute improvement in precision, recall, and F1-score, respectively, compared to object-level spatial fusion output. UR - https://doi.org/10.3390/s25113422 Y1 - 2025 UR - https://doi.org/10.3390/s25113422 UR - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:bvb:573-59421 SN - 1424-8220 VL - 25 IS - 11 PB - MDPI CY - Basel ER - TY - JOUR A1 - Da Rosa Zanatta, Mateus A1 - Carvalho Lustosa da Costa, Joao Paulo A1 - Antreich, Felix A1 - Haardt, Martin A1 - Elger, Gordon A1 - Lopes de Mendonça, Fábio Lúcio A1 - de Sousa Junior, Rafael Timóteo T1 - Tensor-based framework with model order selection and high accuracy factor decomposition for time-delay estimation in dynamic multipath scenarios JF - IEEE Access N2 - Global Navigation Satellite Systems (GNSS) are crucial for applications that demand very accurate positioning. Tensor-based time-delay estimation methods, such as CPD-GEVD, DoA/KRF, and SECSI, combined with the GPS3 L1C signal, are capable of, significantly, mitigating the positioning degradation caused by multipath components. However, even though these schemes require an estimated model order, they assume that the number of multipath components is constant. In GNSS applications, the number of multipath components is time-varying in dynamic scenarios. Thus, in this paper, we propose a tensor-based framework with model order selection and high accuracy factor decomposition for time-delay estimation in dynamic multipath scenarios. Our proposed approach exploits the estimates of the model order for each slice by grouping the data tensor slices into sub-tensors to provide high accuracy factor decomposition. We further enhance the proposed approach by incorporating the tensor-based Multiple Denoising (MuDe). UR - https://doi.org/10.1109/ACCESS.2020.3024597 KW - Global navigation satellite systems (GNSS) KW - global positioning system (GPS) KW - GPS3 KW - time-delay estimation (TDE) KW - multipath components KW - model order selection (MOS) Y1 - 2020 UR - https://doi.org/10.1109/ACCESS.2020.3024597 UR - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:bvb:573-9528 SN - 2169-3536 VL - 8 SP - 174931 EP - 174942 PB - IEEE CY - New York ER - TY - JOUR A1 - Mohan, Nihesh A1 - Ahuir-Torres, Juan Ignacio A1 - Kotadia, Hiren R. A1 - Elger, Gordon T1 - Laser sintering of Cu particle-free inks for high-performance printed electronics JF - npj Flexible Electronics N2 - This study investigates laser sintering of Cu particle-free ink (Cu formate tetrahydrate—amino-2-propanol complex) as an alternative to conventional sintering in an oven (under inert/reducing atmosphere). Utilizing benefits of high-speed localized heating using laser, substrate damage can be prevented for low-melting substrates such as Polyethylene Terephthalate (PET). Firstly, a suitable sintering process window is achieved based on energy density for two different flexible polymeric susbtrates: Polyimide and PET using different laser parameters (laser power, scan rate and spot diameter). Subsequently, characterization of laser sintered traces are also made using different laser optic profiles (Gaussian and top hat). Different methodologies for fabrication of metallized Cu layer were also demonstrated. A very low bulk resistivity of 3.24 µΩcm (1.87 times of bulk Cu) was achieved on trace thickness of 0.85 ± 0.15 µm exhibiting good adherence to polymeric substrates. A promising fabrication process of low-cost and reliable flexible printed electronic devices is demonstrated. UR - https://doi.org/10.1038/s41528-025-00389-5 Y1 - 2025 UR - https://doi.org/10.1038/s41528-025-00389-5 UR - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:bvb:573-58266 SN - 2397-4621 VL - 9 IS - 1 PB - Springer CY - London ER - TY - JOUR A1 - Theissler, Andreas A1 - Pérez-Velázquez, Judith A1 - Kettelgerdes, Marcel A1 - Elger, Gordon T1 - Predictive maintenance enabled by machine learning: Use cases and challenges in the automotive industry JF - Reliability Engineering & System Safety N2 - Recent developments in maintenance modelling fuelled by data-based approaches such as machine learning (ML), have enabled a broad range of applications. In the automotive industry, ensuring the functional safety over the product life cycle while limiting maintenance costs has become a major challenge. One crucial approach to achieve this, is predictive maintenance (PdM). Since modern vehicles come with an enormous amount of operating data, ML is an ideal candidate for PdM. While PdM and ML for automotive systems have both been covered in numerous review papers, there is no current survey on ML-based PdM for automotive systems. The number of publications in this field is increasing — underlining the need for such a survey. Consequently, we survey and categorize papers and analyse them from an application and ML perspective. Following that, we identify open challenges and discuss possible research directions. We conclude that (a) publicly available data would lead to a boost in research activities, (b) the majority of papers rely on supervised methods requiring labelled data, (c) combining multiple data sources can improve accuracies, (d) the use of deep learning methods will further increase but requires efficient and interpretable methods and the availability of large amounts of (labelled) data. UR - https://doi.org/10.1016/j.ress.2021.107864 KW - predictive maintenance KW - artificial intelligence KW - machine learning KW - deep learning KW - vehicle KW - automotive KW - reliability KW - lifetime prediction KW - condition monitoring Y1 - 2021 UR - https://doi.org/10.1016/j.ress.2021.107864 UR - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:bvb:573-9673 SN - 0951-8320 VL - 2021 IS - 215 PB - Elsevier CY - Amsterdam ER - TY - JOUR A1 - Agrawal, Shiva A1 - Bhanderi, Savankumar A1 - Elger, Gordon T1 - Semi-Automatic Annotation of 3D Radar and Camera for Smart Infrastructure-Based Perception JF - IEEE Access N2 - Environment perception using camera, radar, and/or lidar sensors has significantly improved in the last few years because of deep learning-based methods. However, a large group of these methods fall into the category of supervised learning, which requires a considerable amount of annotated data. Due to uncertainties in multi-sensor data, automating the data labeling process is extremely challenging; hence, it is performed manually to a large extent. Even though full automation of such a process is difficult, semiautomation can be a significant step to ease this process. However, the available work in this regard is still very limited; hence, in this paper, a novel semi-automatic annotation methodology is developed for labeling RGB camera images and 3D automotive radar point cloud data using a smart infrastructure-based sensor setup. This paper also describes a new method for 3D radar background subtraction to remove clutter and a new object category, GROUP, for radar-based object detection for closely located vulnerable road users. To validate the work, a dataset named INFRA-3DRC is created using this methodology, where 75% of the labels are automatically generated. In addition, a radar cluster classifier and an image classifier are developed, trained, and tested on this dataset, achieving accuracy of 98.26% and 94.86%, respectively. The dataset and Python scripts are available at https://fraunhoferivi.github.io/INFRA-3DRC-Dataset/. UR - https://doi.org/10.1109/ACCESS.2024.3373310 Y1 - 2024 UR - https://doi.org/10.1109/ACCESS.2024.3373310 UR - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:bvb:573-46180 SN - 2169-3536 VL - 12 SP - 34325 EP - 34341 PB - IEEE CY - New York ER - TY - JOUR A1 - Mohan, Nihesh A1 - Steinberger, Fabian A1 - Wächter, Sonja A1 - Erdogan, Hüseyin A1 - Elger, Gordon T1 - Additive Manufacturing for Automotive Radar Sensors Using Copper Inks and Pastes JF - Applied Sciences N2 - Radar sensors are critical for obstacle detection and navigation, especially for automated driving. Using the use-case “printing of heating coils on the inside of the front housing (primary radome)” needed for de-icing in winter, it is demonstrated that additive manufacturing (AM) can provide economic and functional benefits for manufacturing of the sensors. AM will allow significant cost reduction by eliminating parts and simplifying the manufacturing process. Different AM technologies for the coils were investigated, first, by applying the conductive traces by fused deposition modeling (FDM), and, second, by printing copper particle-free inks and pastes. The metal layers were electrically and mechanically characterized using a profilometer to measure the trace dimension and a four-point probe to measure the resistance. It was revealed that low-cost conductive filaments with low resistivity and current carrying capacity are commercially still not available. The best option sourced was a copper–polyester-based filament with 6000 µΩcm after printing. Therefore, low-cost particle-free copper inks and commercial copper flake paste were selected to print the heating coil. The Cu particle-free inks were amine-based Cu (II) formate complexes, where the Cu exists in an ionic form. Using contactless printing processes such as ink-jet printing or pneumatic dispensing, the traces could be deposited onto the low-melting temperature (225 °C) polymeric radome structure. After printing, the material needed to be sintered to form the conductive copper traces. To avoid damaging the polymer radome during sintering, two different processes were investigated: low-temperature (<150 °C) sintering in an oven for 30 min or fast laser sintering. The sintered Cu layers achieved the following specific electric resistivities when slowly sintered in the oven: paste 4 µΩcm and ink 8.8 µΩcm. Using laser sintering, the ink achieved 3.2 µΩcm because the locally high temperature provides better sintering. Also, the adhesion was significantly increased to (5 B). Therefore, laser sintering is the preferred technology. In addition, it allows fast processing directly after printing. Commercial equipment is available where printing and laser sintering is integrated. The potential of low-cost copper material and the integration in additive manufacturing of electronic systems using radar sensors as an example are demonstrated in this paper. UR - https://doi.org/10.3390/app15052676 Y1 - 2025 UR - https://doi.org/10.3390/app15052676 UR - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:bvb:573-58065 SN - 2076-3417 VL - 15 IS - 5 PB - MDPI CY - Basel ER - TY - CHAP A1 - Kettelgerdes, Marcel A1 - Böhm, Lena A1 - Elger, Gordon T1 - Correlating Intrinsic Parameters and Sharpness for Condition Monitoring of Automotive Imaging Sensors T2 - 2021 5th International Conference on System Reliability and Safety (ICSRS) UR - https://doi.org/10.1109/ICSRS53853.2021.9660665 Y1 - 2021 UR - https://doi.org/10.1109/ICSRS53853.2021.9660665 SN - 978-1-6654-0049-7 SP - 298 EP - 306 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Tavakolibasti, M. A1 - Meszmer, P. A1 - Böttger, Gunnar A1 - Kettelgerdes, Marcel A1 - Elger, Gordon A1 - Erdogan, Hüseyin A1 - Seshaditya, A. A1 - Wunderle, Bernhard T1 - Thermo-mechanical-optical coupling within a digital twin development for automotive LiDAR T2 - 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) UR - https://doi.org/10.1109/EuroSimE52062.2021.9410831 KW - Couplings KW - Laser radar KW - Digital twin KW - Thermomechanical processes KW - Adaptive optics KW - Optical coupling KW - Real-time systems Y1 - 2021 UR - https://doi.org/10.1109/EuroSimE52062.2021.9410831 SN - 978-1-6654-1373-2 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Pascucci, Jacopo A1 - Conti, Fosca A1 - Bhogaraju, Sri Krishna A1 - Signorini, Raffaella A1 - Liu, E A1 - Pedron, Danilo A1 - Elger, Gordon ED - Cheben, Pavel ED - Čtyroký, Jiří ED - Molina-Fernández, Iñigo T1 - Micro-Raman to detect stress phenomena in Si-chips bonded onto Cu substrates T2 - Integrated Optics: Design, Devices, Systems and Applications VI UR - https://doi.org/10.1117/12.2576414 Y1 - 2021 UR - https://doi.org/10.1117/12.2576414 SN - 978-1-5106-4385-7 N1 - Poster + Paper PB - SPIE CY - Bellingham ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Schmid, Maximilian A1 - Hufnagel, Elias A1 - Conti, Fosca A1 - Kotadia, Hiren R. A1 - Elger, Gordon T1 - Low temperature and low pressure die-attach bonding of high power light emitting diodes with self reducing copper complex paste T2 - IEEE 71st Electronic Components and Technology Conference ECTC 2021, Proceedings UR - https://doi.org/10.1109/ECTC32696.2021.00094 KW - low temperature sintering KW - rapid sintering KW - Cu(II) formate KW - reducing binder KW - low pressure sintering KW - high bond strength Y1 - 2021 UR - https://doi.org/10.1109/ECTC32696.2021.00094 SN - 978-1-6654-4097-4 SP - 526 EP - 531 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Schmid, Maximilian A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Characterization of copper sintered interconnects by transient thermal analysis T2 - 2021 International Conference on Electronics Packaging (ICEP 2021) UR - https://doi.org/10.23919/ICEP51988.2021.9451966 KW - copper sintering KW - transient thermal analysis (TTA) KW - thermal impedance (Zth) KW - non-destructive testing (NDT) KW - scanning acoustic microscopy (SAM) Y1 - 2021 UR - https://doi.org/10.23919/ICEP51988.2021.9451966 SN - 978-4-9911-9111-4 SP - 71 EP - 72 PB - IEEE CY - Piscataway ER -