TY - CHAP A1 - Schmid, Maximilian A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Automatic transient thermal impedance tester for quality inspection of soldered and sintered power electronic devices on panel and tile level T2 - 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) UR - https://doi.org/10.1109/ECTC.2019.00320 KW - reliability KW - thermal KW - silver sintering KW - MOSFET KW - measurment equipment Y1 - 2019 UR - https://doi.org/10.1109/ECTC.2019.00320 SN - 978-1-7281-1499-6 SP - 2324 EP - 2330 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Schmid, Maximilian A1 - Hermann, Joseph A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Reliability of SAC Solders under Low and High Stress Conditions T2 - 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) UR - https://doi.org/10.1109/ESTC55720.2022.9939394 KW - reliability KW - solder joint cracking KW - SAC solder KW - transient thermal analysis KW - SAM Y1 - 2022 UR - https://doi.org/10.1109/ESTC55720.2022.9939394 SN - 978-1-6654-8947-8 SP - 553 EP - 559 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Liu, E A1 - Bhogaraju, Sri Krishna A1 - Lux, Kerstin A1 - Elger, Gordon A1 - Mou, Rokeya Mumtahana T1 - Investigation Of Stress Generated By Interconnection Processes With Micro-Raman Spectroscopy (μRS) T2 - Proceedings IEEE 72nd Electronic Components and Technology Conference: ECTC 2022 UR - https://doi.org/10.1109/ECTC51906.2022.00123 KW - component KW - μ-Raman Spectroscopy KW - Au80Sn20 KW - Cu sintering KW - finite element simultion Y1 - 2022 UR - https://doi.org/10.1109/ECTC51906.2022.00123 SN - 978-1-6654-7943-1 SP - 739 EP - 745 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Saccon, Rodolfo A1 - Benin, Alice A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Effect of binders on the performance of copper sintering pastes T2 - 2022 International Conference on Electronics Packaging (ICEP 2022) UR - https://doi.org/10.23919/ICEP55381.2022.9795555 KW - copper sintering KW - binders KW - nanoparticles KW - reduction KW - alcohols, polyols Y1 - 2022 UR - https://doi.org/10.23919/ICEP55381.2022.9795555 SN - 978-4-9911911-3-8 SP - 71 EP - 72 PB - IEEE CY - Piscataway (NJ) ER - TY - CHAP A1 - Hanss, Alexander A1 - Schmid, Maximilian A1 - Bhogaraju, Sri Krishna A1 - Conti, Fosca A1 - Elger, Gordon T1 - Reliability of sintered and soldered high power chip size packages and flip chip LEDs T2 - ECTC - The 2018 IEEE 68th Electronic Components and Technology Conference: Proceedings UR - https://doi.org/10.1109/ECTC.2018.00312 Y1 - 2018 UR - https://doi.org/10.1109/ECTC.2018.00312 SN - 978-1-5386-5000-4 SP - 2080 EP - 2088 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Mokhtari, Omid A1 - Pascucci, Jacopo A1 - Hanss, Alexander A1 - Schmid, Maximilian A1 - Conti, Fosca A1 - Elger, Gordon T1 - Hybrid Cu particle paste with surface-modified particles for high temperature electronics packaging T2 - Proceedings 22nd European Microelectronics and Packaging Conference, EMPC UR - https://doi.org/10.23919/EMPC44848.2019.8951887 Y1 - 2020 UR - https://doi.org/10.23919/EMPC44848.2019.8951887 SN - 978-1-7281-6291-1 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Hanss, Alexander A1 - Schmid, Maximilian A1 - Bhogaraju, Sri Krishna A1 - Conti, Fosca A1 - Elger, Gordon T1 - Process development and reliability of sintered high power chip size packages and flip chip LEDs T2 - 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) UR - https://doi.org/10.23919/ICEP.2018.8374351 KW - LED KW - Reliability KW - Sintering KW - Transient Thermal Testing Y1 - 2018 UR - https://doi.org/10.23919/ICEP.2018.8374351 SN - 978-4-9902-1885-0 SP - 479 EP - 484 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Hanss, Alexander A1 - Schmid, Maximilian A1 - Elger, Gordon A1 - Conti, Fosca T1 - Evaluation of silver and copper sintering of first level interconnects for high power LEDs T2 - 2018 7th Electronic System-Integration Technology Conference (ESTC) UR - https://doi.org/10.1109/ESTC.2018.8546499 KW - transient thermal analysis KW - pressureless silver sintering KW - pressureless copper sintering KW - bonding atmosphere KW - particle size KW - binder chemistry Y1 - 2018 UR - https://doi.org/10.1109/ESTC.2018.8546499 SN - 978-1-5386-6814-6 PB - IEEE CY - Piscataway ER - TY - JOUR A1 - Conti, Fosca A1 - Hanss, Alexander A1 - Mokhtari, Omid A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Formation of tin-based crystals from a SnAgCu alloy under formic acid vapor JF - New Journal of Chemistry UR - https://doi.org/10.1039/C8NJ04173C Y1 - 2018 UR - https://doi.org/10.1039/C8NJ04173C SN - 1369-9261 VL - 42 IS - 23 SP - 19232 EP - 19236 PB - RSC CY - London ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Schmid, Maximilian A1 - Liu, E A1 - Saccon, Rodolfo A1 - Elger, Gordon A1 - Klassen, Holger A1 - Müller, Klaus A1 - Pirzer, Georg T1 - Low cost copper based sintered interconnect material for optoelectronics packaging T2 - 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) UR - https://doi.org/10.1109/ECTC51906.2022.00270 KW - Cu sintering KW - flakes KW - PEG600 KW - reliability KW - encapsulation KW - oxidation KW - transient thermal analysis KW - Scanning acoustic microscopy KW - μ-Raman spectroscopy Y1 - 2022 UR - https://doi.org/10.1109/ECTC51906.2022.00270 SN - 978-1-6654-7943-1 SP - 1720 EP - 1725 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Signorini, Raffaella A1 - Pedron, Danilo A1 - Conti, Fosca A1 - Hanss, Alexander A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Thermomechanical Stress in GaN LED Soldered on Copper Substrate Evaluated by Raman Measurements and Computer Modelling T2 - 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) UR - https://doi.org/10.1109/THERMINIC.2018.8593304 KW - Stress KW - Light emitting diodes KW - Gallium nitride KW - Phonons KW - Substrates KW - Temperature measurement KW - Silicon Y1 - 2018 UR - https://doi.org/10.1109/THERMINIC.2018.8593304 SN - 978-1-5386-6759-0 PB - IEEE CY - Piscataway ER - TY - JOUR A1 - Liu, E A1 - Bhogaraju, Sri Krishna A1 - Wunderle, Bernhard A1 - Elger, Gordon T1 - Investigation of stress relaxation in SAC305 with micro-Raman spectroscopy JF - Microelectronics Reliability UR - https://doi.org/10.1016/j.microrel.2022.114664 Y1 - 2022 UR - https://doi.org/10.1016/j.microrel.2022.114664 SN - 0026-2714 VL - 2022 IS - 138 PB - Elsevier CY - Amsterdam ER - TY - CHAP A1 - Mohan, Nihesh A1 - Bhogaraju, Sri Krishna A1 - Lysien, Mateusz A1 - Schneider, Ludovic A1 - Granek, Filip A1 - Lux, Kerstin A1 - Elger, Gordon T1 - Drop feature optimization for fine trace inkjet printing T2 - 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC): Technical Papers UR - https://doi.org/10.23919/EMPC53418.2021.9585004 KW - inkjet printing KW - Ag nanoparticles KW - fine trace KW - surface interactions KW - drop feature KW - ink properties KW - sintering Y1 - 2021 UR - https://doi.org/10.23919/EMPC53418.2021.9585004 SN - 978-0-9568086-7-7 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Schmid, Maximilian A1 - Kotadia, Hiren R. A1 - Conti, Fosca A1 - Elger, Gordon T1 - Highly reliable die-attach bonding with etched brass flakes T2 - 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC): Technical Papers UR - https://doi.org/10.23919/EMPC53418.2021.9584967 KW - sintering KW - etched brass KW - flakes KW - reliability KW - LED KW - die-attach KW - in-situ copper oxide reduction KW - transient thermal analysis Y1 - 2021 UR - https://doi.org/10.23919/EMPC53418.2021.9584967 SN - 978-0-9568086-7-7 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Steinberger, Fabian A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Correlation between the characteristics of printed sinter paste and the quality of sintered interconnects through non-destructive analysis techniques T2 - NordPac 2023 Annual Microelectronics and Packaging Conference and Exhibition: Reviewed Papers UR - https://doi.org/10.23919/NordPac58023.2023.10186250 KW - profilometry KW - sinter paste KW - interconnect KW - SAM Y1 - 2023 UR - https://doi.org/10.23919/NordPac58023.2023.10186250 SN - 978-91-89821-06-4 PB - IEEE CY - Piscataway ER - TY - JOUR A1 - Mohan, Nihesh A1 - Ahuir-Torres, Juan Ignacio A1 - Bhogaraju, Sri Krishna A1 - Webler, Ralf A1 - Kotadia, Hiren R. A1 - Erdogan, Hüseyin A1 - Elger, Gordon T1 - Decomposition mechanism and morphological evolution of in situ realized Cu nanoparticles in Cu complex inks JF - New Journal of Chemistry UR - https://doi.org/10.1039/D3NJ05185D Y1 - 2024 UR - https://doi.org/10.1039/D3NJ05185D SN - 1369-9261 VL - 48 IS - 15 SP - 6796 EP - 6808 PB - RSC CY - London ER - TY - CHAP A1 - Mohan, Nihesh A1 - Ahuir-Torres, Juan Ignacio A1 - Bhogaraju, Sri Krishna A1 - Kotadia, Hiren R. A1 - Elger, Gordon T1 - Rapid Sintering of Inkjet Printed Cu Complex Inks Using Laser in Air T2 - 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) UR - https://doi.org/10.23919/EMPC55870.2023.10418323 Y1 - 2024 UR - https://doi.org/10.23919/EMPC55870.2023.10418323 SN - 978-0-9568086-9-1 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Ugolini, Francesco A1 - Belponer, Federico A1 - Greci, Alessio A1 - Elger, Gordon T1 - Reliability of Copper Sintered Interconnects Under Extreme Thermal Shock Conditions T2 - 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) UR - https://doi.org/10.23919/EMPC55870.2023.10418348 Y1 - 2024 UR - https://doi.org/10.23919/EMPC55870.2023.10418348 SN - 978-0-9568086-9-1 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Mohan, Nihesh A1 - Steinberger, Fabian A1 - Erdogan, Hüseyin A1 - Hadrava, Philipp A1 - Elger, Gordon T1 - Novel Low Temperature and Low Pressure Sintering of ADAS Radar Sensor Antenna Stack T2 - 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) UR - https://doi.org/10.23919/EMPC55870.2023.10418277 Y1 - 2024 UR - https://doi.org/10.23919/EMPC55870.2023.10418277 SN - 978-0-9568086-9-1 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Ahuir-Torres, Juan Ignacio A1 - Bhogaraju, Sri Krishna A1 - West, Geoff A1 - Elger, Gordon A1 - Kotadia, Hiren R. T1 - Understanding Cu Sintering and Its Role on Corrosion Behaviour for High-Temperature Microelectronic Application T2 - 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) UR - https://doi.org/10.23919/EMPC55870.2023.10418365 Y1 - 2024 UR - https://doi.org/10.23919/EMPC55870.2023.10418365 SN - 978-0-9568086-9-1 PB - IEEE CY - Piscataway ER - TY - JOUR A1 - Elger, Gordon A1 - Bhogaraju, Sri Krishna A1 - Schneider-Ramelow, Martin T1 - Hybrid Cu sinter paste for low temperature bonding of bare semiconductors JF - Materials Letters N2 - A novel hybrid copper paste was developed for low temperature sintering of bare semiconductors. Cu(II) formate (Cu(for)) is complexed in amino-2-propanol (A2P) and added to a paste of etched brass micro flakes. A two-step sintering process is applied: The paste is printed and dried at 120 °C under formic acid (FA) enriched N2 atmosphere (FAN2) for 5 min. Afterwards, bare semiconductors are placed and sintered at 250 °C for 5 min applying a bonding pressure of 20 MPa/10 MPa. By the thermal decomposition of the Cu(for) atomic Cu is released and forms in-situ Cu-nanoparticles. An interconnect is realized with shear strength >100 MPa. UR - https://doi.org/10.1016/j.matlet.2024.136973 Y1 - 2024 UR - https://doi.org/10.1016/j.matlet.2024.136973 UR - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:bvb:573-49138 SN - 1873-4979 VL - 2024 IS - 372 PB - Elsevier CY - New York ER -