TY - CHAP A1 - Saccon, Rodolfo A1 - Benin, Alice A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Effect of binders on the performance of copper sintering pastes T2 - 2022 International Conference on Electronics Packaging (ICEP 2022) UR - https://doi.org/10.23919/ICEP55381.2022.9795555 KW - copper sintering KW - binders KW - nanoparticles KW - reduction KW - alcohols, polyols Y1 - 2022 UR - https://doi.org/10.23919/ICEP55381.2022.9795555 SN - 978-4-9911911-3-8 SP - 71 EP - 72 PB - IEEE CY - Piscataway (NJ) ER - TY - CHAP A1 - Hanss, Alexander A1 - Schmid, Maximilian A1 - Bhogaraju, Sri Krishna A1 - Conti, Fosca A1 - Elger, Gordon T1 - Reliability of sintered and soldered high power chip size packages and flip chip LEDs T2 - ECTC - The 2018 IEEE 68th Electronic Components and Technology Conference: Proceedings UR - https://doi.org/10.1109/ECTC.2018.00312 Y1 - 2018 UR - https://doi.org/10.1109/ECTC.2018.00312 SN - 978-1-5386-5000-4 SP - 2080 EP - 2088 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Mokhtari, Omid A1 - Pascucci, Jacopo A1 - Hanss, Alexander A1 - Schmid, Maximilian A1 - Conti, Fosca A1 - Elger, Gordon T1 - Hybrid Cu particle paste with surface-modified particles for high temperature electronics packaging T2 - Proceedings 22nd European Microelectronics and Packaging Conference, EMPC UR - https://doi.org/10.23919/EMPC44848.2019.8951887 Y1 - 2020 UR - https://doi.org/10.23919/EMPC44848.2019.8951887 SN - 978-1-7281-6291-1 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Hanss, Alexander A1 - Schmid, Maximilian A1 - Bhogaraju, Sri Krishna A1 - Conti, Fosca A1 - Elger, Gordon T1 - Process development and reliability of sintered high power chip size packages and flip chip LEDs T2 - 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) UR - https://doi.org/10.23919/ICEP.2018.8374351 KW - LED KW - Reliability KW - Sintering KW - Transient Thermal Testing Y1 - 2018 UR - https://doi.org/10.23919/ICEP.2018.8374351 SN - 978-4-9902-1885-0 SP - 479 EP - 484 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Hanss, Alexander A1 - Schmid, Maximilian A1 - Elger, Gordon A1 - Conti, Fosca T1 - Evaluation of silver and copper sintering of first level interconnects for high power LEDs T2 - 2018 7th Electronic System-Integration Technology Conference (ESTC) UR - https://doi.org/10.1109/ESTC.2018.8546499 KW - transient thermal analysis KW - pressureless silver sintering KW - pressureless copper sintering KW - bonding atmosphere KW - particle size KW - binder chemistry Y1 - 2018 UR - https://doi.org/10.1109/ESTC.2018.8546499 SN - 978-1-5386-6814-6 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Schmid, Maximilian A1 - Liu, E A1 - Saccon, Rodolfo A1 - Elger, Gordon A1 - Klassen, Holger A1 - Müller, Klaus A1 - Pirzer, Georg T1 - Low cost copper based sintered interconnect material for optoelectronics packaging T2 - 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) UR - https://doi.org/10.1109/ECTC51906.2022.00270 KW - Cu sintering KW - flakes KW - PEG600 KW - reliability KW - encapsulation KW - oxidation KW - transient thermal analysis KW - Scanning acoustic microscopy KW - μ-Raman spectroscopy Y1 - 2022 UR - https://doi.org/10.1109/ECTC51906.2022.00270 SN - 978-1-6654-7943-1 SP - 1720 EP - 1725 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Signorini, Raffaella A1 - Pedron, Danilo A1 - Conti, Fosca A1 - Hanss, Alexander A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Thermomechanical Stress in GaN LED Soldered on Copper Substrate Evaluated by Raman Measurements and Computer Modelling T2 - 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) UR - https://doi.org/10.1109/THERMINIC.2018.8593304 KW - Stress KW - Light emitting diodes KW - Gallium nitride KW - Phonons KW - Substrates KW - Temperature measurement KW - Silicon Y1 - 2018 UR - https://doi.org/10.1109/THERMINIC.2018.8593304 SN - 978-1-5386-6759-0 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Mohan, Nihesh A1 - Bhogaraju, Sri Krishna A1 - Lysien, Mateusz A1 - Schneider, Ludovic A1 - Granek, Filip A1 - Lux, Kerstin A1 - Elger, Gordon T1 - Drop feature optimization for fine trace inkjet printing T2 - 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC): Technical Papers UR - https://doi.org/10.23919/EMPC53418.2021.9585004 KW - inkjet printing KW - Ag nanoparticles KW - fine trace KW - surface interactions KW - drop feature KW - ink properties KW - sintering Y1 - 2021 UR - https://doi.org/10.23919/EMPC53418.2021.9585004 SN - 978-0-9568086-7-7 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Schmid, Maximilian A1 - Kotadia, Hiren R. A1 - Conti, Fosca A1 - Elger, Gordon T1 - Highly reliable die-attach bonding with etched brass flakes T2 - 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC): Technical Papers UR - https://doi.org/10.23919/EMPC53418.2021.9584967 KW - sintering KW - etched brass KW - flakes KW - reliability KW - LED KW - die-attach KW - in-situ copper oxide reduction KW - transient thermal analysis Y1 - 2021 UR - https://doi.org/10.23919/EMPC53418.2021.9584967 SN - 978-0-9568086-7-7 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Steinberger, Fabian A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Correlation between the characteristics of printed sinter paste and the quality of sintered interconnects through non-destructive analysis techniques T2 - NordPac 2023 Annual Microelectronics and Packaging Conference and Exhibition: Reviewed Papers UR - https://doi.org/10.23919/NordPac58023.2023.10186250 KW - profilometry KW - sinter paste KW - interconnect KW - SAM Y1 - 2023 UR - https://doi.org/10.23919/NordPac58023.2023.10186250 SN - 978-91-89821-06-4 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Mohan, Nihesh A1 - Ahuir-Torres, Juan Ignacio A1 - Bhogaraju, Sri Krishna A1 - Kotadia, Hiren R. A1 - Elger, Gordon T1 - Rapid Sintering of Inkjet Printed Cu Complex Inks Using Laser in Air T2 - 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) UR - https://doi.org/10.23919/EMPC55870.2023.10418323 Y1 - 2024 UR - https://doi.org/10.23919/EMPC55870.2023.10418323 SN - 978-0-9568086-9-1 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Ugolini, Francesco A1 - Belponer, Federico A1 - Greci, Alessio A1 - Elger, Gordon T1 - Reliability of Copper Sintered Interconnects Under Extreme Thermal Shock Conditions T2 - 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) UR - https://doi.org/10.23919/EMPC55870.2023.10418348 Y1 - 2024 UR - https://doi.org/10.23919/EMPC55870.2023.10418348 SN - 978-0-9568086-9-1 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Mohan, Nihesh A1 - Steinberger, Fabian A1 - Erdogan, Hüseyin A1 - Hadrava, Philipp A1 - Elger, Gordon T1 - Novel Low Temperature and Low Pressure Sintering of ADAS Radar Sensor Antenna Stack T2 - 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) UR - https://doi.org/10.23919/EMPC55870.2023.10418277 Y1 - 2024 UR - https://doi.org/10.23919/EMPC55870.2023.10418277 SN - 978-0-9568086-9-1 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Ahuir-Torres, Juan Ignacio A1 - Bhogaraju, Sri Krishna A1 - West, Geoff A1 - Elger, Gordon A1 - Kotadia, Hiren R. T1 - Understanding Cu Sintering and Its Role on Corrosion Behaviour for High-Temperature Microelectronic Application T2 - 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) UR - https://doi.org/10.23919/EMPC55870.2023.10418365 Y1 - 2024 UR - https://doi.org/10.23919/EMPC55870.2023.10418365 SN - 978-0-9568086-9-1 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Paret, Paul A1 - Bhogaraju, Sri Krishna A1 - Busse, Dirk A1 - Dahlbüdding, Alexander A1 - Elger, Gordon A1 - Narumanchi, Sreekant T1 - Thermomechanical Degradation of Sintered Copper under High-Temperature Thermal Shock T2 - Proceedings: IEEE 74th Electronic Components and Technology Conference, ECTC 2024 UR - https://doi.org/10.1109/ECTC51529.2024.00196 Y1 - 2024 UR - https://doi.org/10.1109/ECTC51529.2024.00196 SN - 979-8-3503-7598-5 SP - 1219 EP - 1224 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Conti, Fosca A1 - Lux, Kerstin A1 - Bhogaraju, Sri Krishna A1 - Liu, E A1 - Lenz, Christoph A1 - Seitz, Roland A1 - Elger, Gordon ED - Baldini, Francesco ED - Homola, Jiri ED - Lieberman, Robert A. T1 - Raman spectroscopy to investigate gallium nitride light emitting diodes after assembling onto copper substrates T2 - Optical Sensors 2021 UR - https://doi.org/10.1117/12.2591947 Y1 - 2021 UR - https://doi.org/10.1117/12.2591947 SN - 978-1-5106-4379-6 N1 - Poster + Paper PB - SPIE CY - Bellingham ER - TY - CHAP A1 - Pandey, Amit A1 - Bhogaraju, Sri Krishna A1 - Lux, Kerstin A1 - Elger, Gordon T1 - Analysis of stress in spherically bent thinned image sensors T2 - 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) UR - https://doi.org/10.1109/EuroSimE54907.2022.9758847 KW - image sensors KW - semiconductor device measurement KW - spectroscopy KW - compressive stress KW - bending KW - silicon KW - bonding Y1 - 2022 UR - https://doi.org/10.1109/EuroSimE54907.2022.9758847 SN - 978-1-6654-5836-8 PB - IEEE CY - Piscataway, NJ ER -