TY - JOUR A1 - Bhogaraju, Sri Krishna A1 - Conti, Fosca A1 - Kotadia, Hiren R. A1 - Keim, Simon A1 - Tetzlaff, Ulrich A1 - Elger, Gordon T1 - Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging JF - Journal of Alloys and Compounds UR - https://doi.org/10.1016/j.jallcom.2020.156043 KW - Metals and alloys KW - Microstructure KW - Surfaces and interfaces KW - Sintering Y1 - 2020 UR - https://doi.org/10.1016/j.jallcom.2020.156043 SN - 1873-4669 VL - 2020 IS - 844 PB - Elsevier CY - Amsterdam ER - TY - JOUR A1 - Mokhtari, Omid A1 - Conti, Fosca A1 - Bhogaraju, Sri Krishna A1 - Meier, Markus A1 - Schweigart, Helmut A1 - Tetzlaff, Ulrich A1 - Elger, Gordon T1 - Characterization of tin-oxides and tin-formate crystals obtained from SnAgCu solder alloy under formic acid vapor JF - New Journal of Chemistry UR - https://doi.org/10.1039/C9NJ02135C Y1 - 2019 UR - https://doi.org/10.1039/C9NJ02135C SN - 1369-9261 VL - 43 IS - 26 SP - 10227 EP - 10231 PB - RSC CY - London ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Conti, Fosca A1 - Schmid, Maximilian A1 - Meier, Markus A1 - Schweigart, Helmut A1 - Elger, Gordon T1 - Development of sinter paste with surface modified copper alloy particles for die-attach bonding T2 - ETG-Fachbericht 161, CIPS 2020, 11th International Conference on Integrated Power Electronics Systems Y1 - 2020 UR - https://www.vde-verlag.de/proceedings-de/455225100.html SN - 978-3-8007-5226-3 SN - 978-3-8007-5225-6 N1 - Auch veröffentlicht auf IEEE: https://ieeexplore.ieee.org/document/9097746 SP - 582 EP - 587 PB - VDE Verlag CY - Berlin ER - TY - CHAP A1 - Elger, Gordon A1 - Liu, E A1 - Conti, Fosca A1 - Signorini, Raffaella A1 - Brugnolotto, Enrico A1 - Bhogaraju, Sri Krishna T1 - Modelling Thermo-Mechanical Stress in GaN-LEDs Soldered on Copper Substrate with Simulations Validated by Raman Experiments T2 - 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) UR - https://doi.org/10.1109/EuroSimE.2019.8724533 KW - Conferences KW - Microelectronics KW - Micromechanical devices Y1 - 2019 UR - https://doi.org/10.1109/EuroSimE.2019.8724533 SN - 978-1-5386-8040-7 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Elger, Gordon A1 - Mokhtari, Omid A1 - Bhogaraju, Sri Krishna A1 - Conti, Fosca A1 - Meier, Markus A1 - Schweigart, Helmut T1 - Analyse der Reaktionsprodukte von Metall-Formiaten im rückstandfreien Lötprozess T2 - GMM-Fb. 94: EBL 2020 – Elektronische Baugruppen und Leiterplatten UR - https://www.vde-verlag.de/proceedings-de/455185053.html Y1 - 2020 UR - https://www.vde-verlag.de/proceedings-de/455185053.html SN - 978-3-8007-5185-3 SN - 978-3-8007-5186-0 PB - VDE Verlag CY - Berlin ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Mokhtari, Omid A1 - Pascucci, Jacopo A1 - Conti, Fosca A1 - Kotadia, Hiren R. A1 - Elger, Gordon T1 - A multi-pronged approach to low-pressure Cu sintering using surface-modified particles, substrate and chip metallization T2 - International Symposium on Microelectronics UR - https://doi.org/10.4071/2380-4505-2019.1.000387 Y1 - 2019 UR - https://doi.org/10.4071/2380-4505-2019.1.000387 SN - 2380-4505 SN - 1085-8024 VL - 2019 IS - 1 SP - 387 EP - 392 PB - IMAPS CY - Pittsburgh ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Mokhtari, Omid A1 - Pascucci, Jacopo A1 - Conti, Fosca A1 - Elger, Gordon T1 - Improved sinterability of particles to substrates by surface modifications on substrate metallization T2 - Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) UR - https://doi.org/10.4071/2380-4491.2019.HiTen.000066 Y1 - 2019 UR - https://doi.org/10.4071/2380-4491.2019.HiTen.000066 SN - 2380-4491 VL - 2019 IS - HiTen SP - 66 EP - 70 PB - IMAPS CY - Pittsburgh (PA) ER - TY - CHAP A1 - Signorini, Raffaella A1 - Conti, Fosca A1 - Brugnolotto, Enrico A1 - Pedron, Danilo A1 - Liu, E A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon ED - Cheben, Pavel ED - Čtyroký, Jiří ED - Molina-Fernández, Iñigo T1 - Thermomechanical local stress in assembled GaN LEDs investigated by Raman optical spectroscopy T2 - Integrated Optics: Design, Devices, Systems, and Applications V UR - https://doi.org/10.1117/12.2520992 Y1 - 2019 UR - https://doi.org/10.1117/12.2520992 SN - 978-1-5106-2729-1 N1 - Presentation + Paper PB - SPIE CY - Bellingham ER - TY - CHAP A1 - Brugnolotto, Enrico A1 - Bhogaraju, Sri Krishna A1 - Liu, E A1 - Conti, Fosca A1 - Pedron, Danilo A1 - Signorini, Raffaella A1 - Elger, Gordon T1 - Investigation of thermomechanical local stress induced in assembled GaN LEDs T2 - 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) UR - https://doi.org/10.1109/THERMINIC.2019.8923629 Y1 - 2019 UR - https://doi.org/10.1109/THERMINIC.2019.8923629 SN - 978-1-7281-2078-2 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Hanss, Alexander A1 - Schmid, Maximilian A1 - Bhogaraju, Sri Krishna A1 - Conti, Fosca A1 - Elger, Gordon T1 - Reliability of sintered and soldered high power chip size packages and flip chip LEDs T2 - ECTC - The 2018 IEEE 68th Electronic Components and Technology Conference: Proceedings UR - https://doi.org/10.1109/ECTC.2018.00312 Y1 - 2018 UR - https://doi.org/10.1109/ECTC.2018.00312 SN - 978-1-5386-5000-4 SP - 2080 EP - 2088 PB - IEEE CY - Piscataway ER -