TY - CHAP A1 - Schmid, Maximilian A1 - Bhogaraju, Sri Krishna A1 - Riedel, Andreas A1 - Elger, Gordon T1 - Development of an in-line capable transient thermal analysis equipment for a power module with five half bridges T2 - 2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) UR - https://doi.org/10.1109/THERMINIC49743.2020.9420493 KW - MOSFET KW - Power measurement KW - Pulse measurements KW - Current measurement KW - Multichip modules KW - Time measurement KW - Thermal analysis Y1 - 2021 UR - https://doi.org/10.1109/THERMINIC49743.2020.9420493 SN - 978-1-7281-7643-7 SP - 268 EP - 273 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Conti, Fosca A1 - Liu, E A1 - Bhogaraju, Sri Krishna A1 - Lenz, Christoph A1 - Seitz, Roland A1 - Elger, Gordon T1 - Stress evaluations of silicon nitride chips bonded onto copper substrates via SAC soldering, AuSn soldering, and copper sintering T2 - 2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) UR - https://doi.org/10.1109/THERMINIC49743.2020.9420523 KW - Creep KW - Thermomechanical processes KW - Silicon nitride KW - Copper KW - Plastics KW - Microstructure KW - Soldering Y1 - 2021 UR - https://doi.org/10.1109/THERMINIC49743.2020.9420523 SN - 978-1-7281-7643-7 SP - 204 EP - 208 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Keim, Simon A1 - Tetzlaff, Ulrich A1 - Elger, Gordon T1 - The influence of different-sized Ni micro- and nanopowders on the processing and microstructural properties of Sn-Ag-Cu-solder with low Ag content T2 - Proceedings: IEEE 70th Electronic Components and Technology Conference, ECTC 2020 UR - https://doi.org/10.1109/ECTC32862.2020.00312 KW - Composites KW - Soldering KW - Porosity KW - Microstructure KW - Intermetallics KW - Phase interfaces Y1 - 2020 UR - https://doi.org/10.1109/ECTC32862.2020.00312 SN - 978-1-7281-6180-8 SN - 2377-5726 SP - 2005 EP - 2012 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Conti, Fosca A1 - Elger, Gordon T1 - Copper die bonding using copper formate based pastes with α-terpineol, amino-2-propanol and hexylamine as binders T2 - 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) UR - https://doi.org/10.1109/ESTC48849.2020.9229801 KW - copper inks KW - sintering KW - low temperature KW - copper nano particles KW - copper formate KW - binder KW - terpineol KW - hexylamine KW - amino-2-propanol Y1 - 2020 UR - https://doi.org/10.1109/ESTC48849.2020.9229801 SN - 978-1-7281-6293-5 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Conti, Fosca A1 - Liu, E A1 - Bhogaraju, Sri Krishna A1 - Wunderle, Bernhard A1 - Elger, Gordon T1 - Finite Element simulations and Raman measurements to investigate thermomechanical stress in GaN-LEDs T2 - 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) UR - https://doi.org/10.1109/ESTC48849.2020.9229843 KW - finite element method KW - gallium nitride (GaN) KW - LED KW - Raman spectroscopy KW - semiconductor KW - thermomechanical stress Y1 - 2020 UR - https://doi.org/10.1109/ESTC48849.2020.9229843 SN - 978-1-7281-6293-5 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Kühn, Stephan A1 - Pandey, Amit A1 - Zippelius, Andreas A1 - Schneider, Klaus A1 - Erdogan, Hüseyin A1 - Elger, Gordon T1 - Analysis of package design of optic modules for automotive cameras to realize reliable image sharpness T2 - 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) UR - https://doi.org/10.1109/ESTC48849.2020.9229786 KW - Condition Monitoring KW - Health Indicator KW - Change in Sharpness KW - Through Focus Y1 - 2020 UR - https://doi.org/10.1109/ESTC48849.2020.9229786 SN - 978-1-7281-6293-5 PB - IEEE CY - Piscataway ER - TY - JOUR A1 - Hanzl, Christian A1 - Hartmann, Christoph A1 - Hölzle, Markus A1 - Liebhart, Bernhard A1 - Schmid, Michael A1 - Endisch, Christian T1 - Current commutation in a switched lithium-ion cell used in cascaded half-bridge multilevel inverters JF - IET Power Electronics N2 - In order to improve the efficiency of battery electric vehicles, the utilization of reconfigurable batteries and multilevel inverters based on low-voltage Si MOSFETs gains growing attention. Focusing on the half-bridge as basic switching unit, this paper examines voltage and current waveforms during switching. It is shown that the current commutation speed depends on various factors such as sign and amplitude of the current as well as the particular switching scenario. For instance, turning off a positive cell current takes 0.21 𝜇s while turning it on takes 0.9 𝜇s. In addition, it is revealed that depending on the switching scenario and current direction, the lithium-ion cell supports or opposes the remagnetization of the parasitic inductances and therefore the switching losses of the MOSFETs. Switching a positive load current of 125 A from active to bypass converts 276 𝜇J into heat while switching from bypass to active converts merely 32.5 𝜇J into heat. UR - https://doi.org/10.1049/pel2.12088 Y1 - 2021 UR - https://doi.org/10.1049/pel2.12088 UR - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:bvb:573-13364 SN - 1755-4543 VL - 14 IS - 6 SP - 1073 EP - 1088 PB - Wiley CY - Hoboken ER - TY - JOUR A1 - Schmid, Michael A1 - Kneidinger, Hans-Georg A1 - Endisch, Christian T1 - Data-driven fault diagnosis in battery systems through cross-cell monitoring JF - IEEE Sensors Journal UR - https://doi.org/10.1109/JSEN.2020.3017812 KW - Battery systems KW - data-driven fault diagnosis KW - fault isolation KW - recursive principal component analysis KW - signal processing Y1 - 2020 UR - https://doi.org/10.1109/JSEN.2020.3017812 SN - 1558-1748 SN - 1530-437X SN - 2379-9153 VL - 21 IS - 2 SP - 1829 EP - 1837 PB - IEEE CY - New York ER - TY - CHAP A1 - Kleiner, Jan A1 - Heider, Alexander A1 - Hanzl, Christian A1 - Komsiyska, Lidiya A1 - Elger, Gordon A1 - Endisch, Christian T1 - Thermal behavior of an intelligent li-ion cell under vehicle conditions T2 - Proceedings: IECON 2020 The 46th Annual Conference of the IEEE Industrial Electronics Society UR - https://doi.org/10.1109/IECON43393.2020.9254336 KW - Li-ion KW - electro-thermal model KW - intelligent battery KW - reconfigurable system KW - smart cell Y1 - 2020 UR - https://doi.org/10.1109/IECON43393.2020.9254336 SN - 978-1-7281-5414-5 SN - 2577-1647 SP - 2081 EP - 2086 PB - IEEE CY - Piscataway ER - TY - JOUR A1 - Sequeira, Gerald Joy A1 - Brandmeier, Thomas T1 - Evaluation and characterization of crash-pulses for head-on collisions with varying overlap crash scenarios JF - Transportation Research Procedia N2 - Activation time for activating the occupant restraint systems (airbag and seatbelt) is very critical for an optimal safety action. A crash-pulse is the deceleration of the vehicle measured during in a crash. The shape, slope, maximum deceleration and duration of the crash-pulse provides significant information over the nature of occupant motions during in-crash phase and hence the crash severity. The above parameters of the crash-pulse not only depend on the mass and impact velocity but also on the crash configuration (position of impact, overlap, relative approach angle etc.). This study focuses on analysis and characterization of crash-pulses in head-on collision cases with varying overlap configurations. The paper describes causes for occupant injuries during a crash, crash-pulse and its important physical parameters, and different methodologies used to analyse the crash-pulse. Finite element simulation method is used to study the crash-pulses from different crash configurations. A new severity index that has direct influence on the occupant kinematics is defined. The results show that the steep decrease of crash-pulse for small overlap configurations (less than 25 percent of vehicle width) lags by 20 to 25 milliseconds as compared to configurations with large overlaps. The shape of the crash-pulse also changes for crash scenarios with different overlap configurations. The results, discussion and conclusion sections of this paper provide a summary of crash behaviour of varying overlap crash scenarios and insights that can be used for deployment of restraint systems. UR - https://doi.org/10.1016/j.trpro.2020.08.156 KW - Crash severity KW - Head-on collision KW - Frontal crash KW - Crash-pulse characterization Y1 - 2020 UR - https://doi.org/10.1016/j.trpro.2020.08.156 UR - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:bvb:573-13319 SN - 2352-1465 VL - 2020 IS - 48 SP - 1306 EP - 1315 PB - Elsevier CY - Amsterdam ER - TY - CHAP A1 - Schmid, Maximilian A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Characterization of copper sintered interconnects by transient thermal analysis T2 - 2021 International Conference on Electronics Packaging (ICEP 2021) UR - https://doi.org/10.23919/ICEP51988.2021.9451966 KW - copper sintering KW - transient thermal analysis (TTA) KW - thermal impedance (Zth) KW - non-destructive testing (NDT) KW - scanning acoustic microscopy (SAM) Y1 - 2021 UR - https://doi.org/10.23919/ICEP51988.2021.9451966 SN - 978-4-9911-9111-4 SP - 71 EP - 72 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Schmid, Maximilian A1 - Hufnagel, Elias A1 - Conti, Fosca A1 - Kotadia, Hiren R. A1 - Elger, Gordon T1 - Low temperature and low pressure die-attach bonding of high power light emitting diodes with self reducing copper complex paste T2 - IEEE 71st Electronic Components and Technology Conference ECTC 2021, Proceedings UR - https://doi.org/10.1109/ECTC32696.2021.00094 KW - low temperature sintering KW - rapid sintering KW - Cu(II) formate KW - reducing binder KW - low pressure sintering KW - high bond strength Y1 - 2021 UR - https://doi.org/10.1109/ECTC32696.2021.00094 SN - 978-1-6654-4097-4 SP - 526 EP - 531 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Pascucci, Jacopo A1 - Conti, Fosca A1 - Bhogaraju, Sri Krishna A1 - Signorini, Raffaella A1 - Liu, E A1 - Pedron, Danilo A1 - Elger, Gordon ED - Cheben, Pavel ED - Čtyroký, Jiří ED - Molina-Fernández, Iñigo T1 - Micro-Raman to detect stress phenomena in Si-chips bonded onto Cu substrates T2 - Integrated Optics: Design, Devices, Systems and Applications VI UR - https://doi.org/10.1117/12.2576414 Y1 - 2021 UR - https://doi.org/10.1117/12.2576414 SN - 978-1-5106-4385-7 N1 - Poster + Paper PB - SPIE CY - Bellingham ER - TY - CHAP A1 - Conti, Fosca A1 - Lux, Kerstin A1 - Bhogaraju, Sri Krishna A1 - Liu, E A1 - Lenz, Christoph A1 - Seitz, Roland A1 - Elger, Gordon ED - Baldini, Francesco ED - Homola, Jiri ED - Lieberman, Robert A. T1 - Raman spectroscopy to investigate gallium nitride light emitting diodes after assembling onto copper substrates T2 - Optical Sensors 2021 UR - https://doi.org/10.1117/12.2591947 Y1 - 2021 UR - https://doi.org/10.1117/12.2591947 SN - 978-1-5106-4379-6 N1 - Poster + Paper PB - SPIE CY - Bellingham ER - TY - CHAP A1 - Tavakolibasti, M. A1 - Meszmer, P. A1 - Böttger, Gunnar A1 - Kettelgerdes, Marcel A1 - Elger, Gordon A1 - Erdogan, Hüseyin A1 - Seshaditya, A. A1 - Wunderle, Bernhard T1 - Thermo-mechanical-optical coupling within a digital twin development for automotive LiDAR T2 - 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) UR - https://doi.org/10.1109/EuroSimE52062.2021.9410831 KW - Couplings KW - Laser radar KW - Digital twin KW - Thermomechanical processes KW - Adaptive optics KW - Optical coupling KW - Real-time systems Y1 - 2021 UR - https://doi.org/10.1109/EuroSimE52062.2021.9410831 SN - 978-1-6654-1373-2 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Liu, E A1 - Conti, Fosca A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Simulations and experiments to analyze stress phenomena in soldered and sintered interconnections between silicon nitride chips and copper substrates T2 - 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) UR - https://doi.org/10.1109/EuroSimE52062.2021.9410869 KW - Performance evaluation KW - Analytical models KW - Compressive stress KW - Thermomechanical processes KW - Data models KW - Microelectronics KW - Finite element analysis Y1 - 2021 UR - https://doi.org/10.1109/EuroSimE52062.2021.9410869 SN - 978-1-6654-1373-2 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Agrawal, Shiva A1 - Elger, Gordon T1 - Concept of infrastructure based environment perception for IN2Lab test field for automated driving T2 - 2021 IEEE International Smart Cities Conference (ISC2) UR - https://doi.org/10.1109/ISC253183.2021.9562894 KW - RSU KW - Radar KW - Lidar KW - Camera KW - Intelligent Infrastructure KW - Autonomous Driving KW - Sensor fusion Y1 - 2021 UR - https://doi.org/10.1109/ISC253183.2021.9562894 SN - 978-1-6654-4919-9 SN - 2687-8860 PB - IEEE CY - Piscataway ER - TY - JOUR A1 - Sequeira, Gerald Joy A1 - Patel, Akshay A1 - Afraj, Shahabaz A1 - Lugner, Robert A1 - Brandmeier, Thomas T1 - FEM-based methodology for crash severity estimation in frontal crash scenarios JF - IOP Conference Series: Materials Science and Engineering N2 - With the technological development of forward-looking sensors, researchers are exploring their use not only for advanced driver assistance systems but also to gain important pre-crash information. Based on this pre-crash information, if the occupant motion inside the vehicle structure can be predicted for the oncoming crash scenario, then an optimal restraint strategy can be planned before the crash. This paper introduces a two-step FEM simulation based methodology for predicting the occupant severity in head-on crash scenarios. In the first step, we simulate the vehicle level model with different impact positions and relative approach angles. The results of these simulations, linear velocities in the longitudinal and lateral direction and angular velocities (roll, pitch, and yaw) during in-crash phase are the loading conditions for next simulation step (occupant level). This step simulates the motion of the driver in different crash scenarios. In this paper, we investigate the head, neck, and chest injury risks from vehicle-to-vehicle crash both traveling at 50 kilometers per hour. Prediction of the head injury criterion, identifying the cases where additional deployment of side-airbags and discussion of injury criteria with contour plots are the main outcome of this paper. UR - https://doi.org/10.1088/1757-899X/831/1/012019 Y1 - 2020 UR - https://doi.org/10.1088/1757-899X/831/1/012019 UR - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:bvb:573-13159 SN - 1757-899X SN - 1757-8981 VL - 2020 IS - 831 PB - IOP CY - Bristol ER - TY - JOUR A1 - Geisbauer, Christian A1 - Wöhrl, Katharina A1 - Lott, Susanne A1 - Nebl, Christoph A1 - Schweiger, Hans-Georg A1 - Goertz, Roland A1 - Kubjatko, Tibor T1 - Scenarios involving accident-damaged electric vehicles JF - Transportation Research Procedia N2 - Electrically propelled cars will play a major role on the streets, not only in the far, but also in the near future. In this work, an overview on the possible risks arising from electric vehicles is given that involves electrical, chemical and thermal hazards. Additionally, an analysis on different scenarios involving damaged electric vehicles, the involved parties, as well as their risk assessment in terms of hazard rating is presented. Furthermore, two scenarios are explained and addressed with more detail. With the derived risks of the battery and with possible crash scenarios presented, the still existing uncertainties for handling damaged electric vehicles are addressed, followed by a discussion on ways to overcome this problem. UR - https://doi.org/10.1016/j.trpro.2021.07.136 KW - electromobility KW - batteries KW - lithium ion KW - electric vehicle KW - accident KW - rescue service KW - recycling Y1 - 2021 UR - https://doi.org/10.1016/j.trpro.2021.07.136 UR - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:bvb:573-13130 SN - 2352-1465 VL - 2021 IS - 55 SP - 1484 EP - 1489 PB - Elsevier CY - Amsterdam ER - TY - CHAP A1 - Ritz, Fabian A1 - Ratke, Daniel A1 - Phan, Thomy A1 - Belzner, Lenz A1 - Linnhoff-Popien, Claudia T1 - A sustainable ecosystem through emergent cooperation in multi-agent reinforcement learning T2 - Proceedings of the Artificial Life Conference 2021 UR - https://doi.org/10.1162/isal_a_00399 Y1 - 2021 UR - https://doi.org/10.1162/isal_a_00399 UR - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:bvb:573-12975 VL - 2021 PB - MIT Press CY - Cambridge ER -