<?xml version="1.0" encoding="utf-8"?>
<export-example>
  <doc>
    <id>2965</id>
    <completedYear/>
    <publishedYear>2022</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>566</pageFirst>
    <pageLast>575</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <articleNumber/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace>Piscataway</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>2022-11-15</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Predicting thermal resistance of solder joints based on Scanning Acoustic Microscopy using Artificial Neural Networks</title>
    <parentTitle language="eng">2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)</parentTitle>
    <identifier type="isbn">978-1-6654-8947-8</identifier>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.1109/ESTC55720.2022.9939465</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <enrichment key="THI_conferenceName">2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), Sibiu (Romania), 13.-16.09.2022</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <author>
      <first_name>Andreas</first_name>
      <last_name>Zippelius</last_name>
    </author>
    <author>
      <first_name>Tobias</first_name>
      <last_name>Strobl</last_name>
    </author>
    <author>
      <first_name>Maximilian</first_name>
      <last_name>Schmid</last_name>
    </author>
    <author>
      <first_name>Joseph</first_name>
      <last_name>Hermann</last_name>
    </author>
    <author>
      <first_name>Alwin</first_name>
      <last_name>Hoffmann</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Solder Joints</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>LED</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>non-destructive testing</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Machine Learning</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Scanning Acoustic Microscopy (SAM)</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Transient Thermal Analysis (TTA), Convolutional Neural Network (CNN)</value>
    </subject>
    <collection role="institutes" number="19311">Fakultät Elektro- und Informationstechnik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
    <collection role="institutes" number="19569">Fraunhofer-Anwendungszentrum "Vernetzte Mobilität und Infrastruktur"</collection>
    <collection role="persons" number="26880">Schmid, Maximilian</collection>
  </doc>
</export-example>
