<?xml version="1.0" encoding="utf-8"?>
<export-example>
  <doc>
    <id>2864</id>
    <completedYear/>
    <publishedYear>2022</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>71</pageFirst>
    <pageLast>72</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <articleNumber/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace>Piscataway (NJ)</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>2022-09-30</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Effect of binders on the performance of copper sintering pastes</title>
    <parentTitle language="eng">2022 International Conference on Electronics Packaging (ICEP 2022)</parentTitle>
    <identifier type="isbn">978-4-9911911-3-8</identifier>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.23919/ICEP55381.2022.9795555</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <enrichment key="THI_conferenceName">2022 International Conference on Electronics Packaging (ICEP), Sapporo (Japan), 11.-14.05.2022</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <author>
      <first_name>Rodolfo</first_name>
      <last_name>Saccon</last_name>
    </author>
    <author>
      <first_name>Alice</first_name>
      <last_name>Benin</last_name>
    </author>
    <author>
      <first_name>Sri Krishna</first_name>
      <last_name>Bhogaraju</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>copper sintering</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>binders</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>nanoparticles</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>reduction</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>alcohols, polyols</value>
    </subject>
    <collection role="institutes" number="19311">Fakultät Elektro- und Informationstechnik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
  </doc>
  <doc>
    <id>2544</id>
    <completedYear/>
    <publishedYear>2022</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>1720</pageFirst>
    <pageLast>1725</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <articleNumber/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace>Piscataway</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>2022-07-27</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Low cost copper based sintered interconnect material for optoelectronics packaging</title>
    <parentTitle language="eng">2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</parentTitle>
    <identifier type="isbn">978-1-6654-7943-1</identifier>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.1109/ECTC51906.2022.00270</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <enrichment key="THI_conferenceName">2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),  San Diego (USA), 31.05. - 03.06.2022</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <author>
      <first_name>Sri Krishna</first_name>
      <last_name>Bhogaraju</last_name>
    </author>
    <author>
      <first_name>Maximilian</first_name>
      <last_name>Schmid</last_name>
    </author>
    <author>
      <first_name>E</first_name>
      <last_name>Liu</last_name>
    </author>
    <author>
      <first_name>Rodolfo</first_name>
      <last_name>Saccon</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <author>
      <first_name>Holger</first_name>
      <last_name>Klassen</last_name>
    </author>
    <author>
      <first_name>Klaus</first_name>
      <last_name>Müller</last_name>
    </author>
    <author>
      <first_name>Georg</first_name>
      <last_name>Pirzer</last_name>
    </author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Cu sintering</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>flakes</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>PEG600</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>reliability</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>encapsulation</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>oxidation</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>transient thermal analysis</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Scanning acoustic microscopy</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>μ-Raman spectroscopy</value>
    </subject>
    <collection role="institutes" number="19311">Fakultät Elektro- und Informationstechnik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
    <collection role="persons" number="26880">Schmid, Maximilian</collection>
  </doc>
</export-example>
