<?xml version="1.0" encoding="utf-8"?>
<export-example>
  <doc>
    <id>1900</id>
    <completedYear/>
    <publishedYear>2019</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>7</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <articleNumber/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace>Piscataway</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>2022-03-10</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Failure Identification in LED packages by Transient Thermal Analysis and Calibrated FE Models</title>
    <parentTitle language="eng">2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</parentTitle>
    <identifier type="isbn">978-1-5386-8040-7</identifier>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.1109/EuroSimE.2019.8724558</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <enrichment key="THI_conferenceName">2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Hannover (Germany), 24.-27.03.2019</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <author>
      <first_name>Alexander</first_name>
      <last_name>Hanss</last_name>
    </author>
    <author>
      <first_name>E</first_name>
      <last_name>Liu</last_name>
    </author>
    <author>
      <first_name>Muhammad Rizwan</first_name>
      <last_name>Abdullah</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Conferences</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Microelectronics</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Micromechanical devices</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Light emitting diodes</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Aluminum nitride</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>III-V semiconductor materials</value>
    </subject>
    <collection role="institutes" number="15984">Fakultät Elektrotechnik und Informatik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
  </doc>
</export-example>
