<?xml version="1.0" encoding="utf-8"?>
<export-example>
  <doc>
    <id>5826</id>
    <completedYear/>
    <publishedYear>2025</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>10</pageNumber>
    <edition/>
    <issue>1</issue>
    <volume>9</volume>
    <articleNumber>18</articleNumber>
    <type>article</type>
    <publisherName>Springer</publisherName>
    <publisherPlace>London</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>2025-04-14</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Laser sintering of Cu particle-free inks for high-performance printed electronics</title>
    <abstract language="eng">This study investigates laser sintering of Cu particle-free ink (Cu formate tetrahydrate—amino-2-propanol complex) as an alternative to conventional sintering in an oven (under inert/reducing atmosphere). Utilizing benefits of high-speed localized heating using laser, substrate damage can be prevented for low-melting substrates such as Polyethylene Terephthalate (PET). Firstly, a suitable sintering process window is achieved based on energy density for two different flexible polymeric susbtrates: Polyimide and PET using different laser parameters (laser power, scan rate and spot diameter). Subsequently, characterization of laser sintered traces are also made using different laser optic profiles (Gaussian and top hat). Different methodologies for fabrication of metallized Cu layer were also demonstrated. A very low bulk resistivity of 3.24 µΩcm (1.87 times of bulk Cu) was achieved on trace thickness of 0.85 ± 0.15 µm exhibiting good adherence to polymeric substrates. A promising fabrication process of low-cost and reliable flexible printed electronic devices is demonstrated.</abstract>
    <parentTitle language="eng">npj Flexible Electronics</parentTitle>
    <identifier type="issn">2397-4621</identifier>
    <identifier type="urn">urn:nbn:de:bvb:573-58266</identifier>
    <enrichment key="opus_doi_flag">true</enrichment>
    <enrichment key="opus_import_data">{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,3,5]],"date-time":"2025-03-05T05:40:35Z","timestamp":1741153235611,"version":"3.38.0"},"reference-count":73,"publisher":"Springer Science and Business Media LLC","issue":"1","license":[{"start":{"date-parts":[[2025,3,4]],"date-time":"2025-03-04T00:00:00Z","timestamp":1741046400000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0"},{"start":{"date-parts":[[2025,3,4]],"date-time":"2025-03-04T00:00:00Z","timestamp":1741046400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0"}],"content-domain":{"domain":["link.springer.com"],"crossmark-restriction":false},"short-container-title":["npj Flex Electron"],"abstract":"&lt;jats:title&gt;Abstract&lt;\/jats:title&gt;\n          &lt;jats:p&gt;This study investigates laser sintering of Cu particle-free ink (Cu formate tetrahydrate\u2014amino-2-propanol complex) as an alternative to conventional sintering in an oven (under inert\/reducing atmosphere). Utilizing benefits of high-speed localized heating using laser, substrate damage can be prevented for low-melting substrates such as Polyethylene Terephthalate (PET). Firstly, a suitable sintering process window is achieved based on energy density for two different flexible polymeric susbtrates: Polyimide and PET using different laser parameters (laser power, scan rate and spot diameter). Subsequently, characterization of laser sintered traces are also made using different laser optic profiles (Gaussian and top hat). Different methodologies for fabrication of metallized Cu layer were also demonstrated. A very low bulk resistivity of 3.24\u2009\u00b5\u2126cm (1.87 times of bulk Cu) was achieved on trace thickness of 0.85\u2009\u00b1\u20090.15\u2009\u00b5m exhibiting good adherence to polymeric substrates. A promising fabrication process of low-cost and reliable flexible printed electronic devices is demonstrated.&lt;\/jats:p&gt;","DOI":"10.1038\/s41528-025-00389-5","type":"journal-article","created":{"date-parts":[[2025,3,4]],"date-time":"2025-03-04T04:42:48Z","timestamp":1741063368000},"update-policy":"https:\/\/doi.org\/10.1007\/springer_crossmark_policy","source":"Crossref","is-referenced-by-count":0,"title":["Laser sintering of Cu particle-free inks for high-performance printed electronics"],"prefix":"10.1038","volume":"9","author":[{"given":"Nihesh","family":"Mohan","sequence":"first","affiliation":[]},{"given":"Juan Ignacio","family":"Ahuir-Torres","sequence":"additional","affiliation":[]},{"given":"Hiren R.","family":"Kotadia","sequence":"additional","affiliation":[]},{"given":"Gordon","family":"Elger","sequence":"additional","affiliation":[]}],"member":"297","published-online":{"date-parts":[[2025,3,4]]},"reference":[{"key":"389_CR1","doi-asserted-by":"publisher","first-page":"1905279","DOI":"10.1002\/adma.201905279","volume":"32","author":"Y Khan","year":"2020","unstructured":"Khan, Y. et al. A new frontier of printed electronics: flexible hybrid electronics. Adv. Mater. 32, 1905279 (2020).","journal-title":"Adv. Mater."},{"key":"389_CR2","doi-asserted-by":"crossref","unstructured":"Cruz, S. M. F., Rocha, L. A. &amp; Viana, J. C. Printing technologies on flexible substrates for printed electronics. In Flexible Electronics (IntechOpen, 2018).","DOI":"10.5772\/intechopen.76161"},{"key":"389_CR3","doi-asserted-by":"publisher","DOI":"10.1002\/adfm.202213744","volume":"33","author":"P Martins","year":"2023","unstructured":"Martins, P. et al. Advances in printing and electronics: from engagement to commitment. Adv. Funct. Mater. 33, 2213744 (2023).","journal-title":"Adv. Funct. Mater."},{"key":"389_CR4","doi-asserted-by":"publisher","first-page":"2971","DOI":"10.1039\/C7TC00038C","volume":"5","author":"M Gao","year":"2017","unstructured":"Gao, M., Li, L. &amp; Song, Y. Inkjet printing wearable electronic devices. J. Mater. Chem. C 5, 2971\u20132993 (2017).","journal-title":"J. Mater. Chem. C"},{"key":"389_CR5","doi-asserted-by":"publisher","first-page":"523","DOI":"10.1021\/acs.accounts.8b00500","volume":"52","author":"W Gao","year":"2019","unstructured":"Gao, W., Ota, H., Kiriya, D., Takei, K. &amp; Javey, A. Flexible electronics toward wearable sensing. Acc. Chem. Res. 52, 523\u2013533 (2019).","journal-title":"Acc. Chem. Res."},{"key":"389_CR6","doi-asserted-by":"publisher","first-page":"344","DOI":"10.1109\/JDT.2010.2096650","volume":"7","author":"R Ramakrishnan","year":"2011","unstructured":"Ramakrishnan, R., Saran, N. &amp; Petcavich, R. J. Selective inkjet printing of conductors for displays and flexible printed electronics. J. Disp. Technol. 7, 344\u2013347 (2011).","journal-title":"J. Disp. Technol."},{"key":"389_CR7","doi-asserted-by":"publisher","first-page":"3164","DOI":"10.1109\/JSEN.2014.2375203","volume":"15","author":"S Khan","year":"2014","unstructured":"Khan, S., Lorenzelli, L. &amp; Dahiya, R. S. Technologies for printing sensors and electronics over large flexible substrates: a review. IEEE Sens. J. 15, 3164\u20133185 (2014).","journal-title":"IEEE Sens. J."},{"key":"389_CR8","doi-asserted-by":"publisher","first-page":"406","DOI":"10.1039\/D2TC03736J","volume":"11","author":"W Yang","year":"2023","unstructured":"Yang, W. et al. Design, fabrication and applications of flexible RFID antennas based on printed electronic materials and technologies. J. Mater. Chem. C. 11, 406\u2013425 (2023).","journal-title":"J. Mater. Chem. C."},{"key":"389_CR9","doi-asserted-by":"publisher","first-page":"9912","DOI":"10.1002\/er.5664","volume":"44","author":"PGV Sampaio","year":"2020","unstructured":"Sampaio, P. G. V. et al. Overview of printing and coating techniques in the production of organic photovoltaic cells. Int. J. Energy Res. 44, 9912\u20139931 (2020).","journal-title":"Int. J. Energy Res."},{"key":"389_CR10","doi-asserted-by":"publisher","first-page":"3844","DOI":"10.1109\/JSEN.2022.3142328","volume":"22","author":"LY Ma","year":"2022","unstructured":"Ma, L. Y. &amp; Soin, N. Recent progress in printed physical sensing electronics for wearable health-monitoring devices: a review. IEEE Sens. J. 22, 3844\u20133859 (2022).","journal-title":"IEEE Sens. J."},{"key":"389_CR11","doi-asserted-by":"publisher","first-page":"1800546","DOI":"10.1002\/admt.201800546","volume":"4","author":"Q Huang","year":"2019","unstructured":"Huang, Q. &amp; Zhu, Y. Printing conductive nanomaterials for flexible and stretchable electronics: a review of materials, processes, and applications. Adv. Mater. Technol. 4, 1800546 (2019).","journal-title":"Adv. Mater. Technol."},{"key":"389_CR12","doi-asserted-by":"publisher","first-page":"704","DOI":"10.3390\/ma13030704","volume":"13","author":"V Beedasy","year":"2020","unstructured":"Beedasy, V. &amp; Smith, P. J. Printed electronics as prepared by inkjet printing. Materials 13, 704 (2020).","journal-title":"Materials"},{"key":"389_CR13","doi-asserted-by":"publisher","first-page":"2124","DOI":"10.3390\/ijms20092124","volume":"20","author":"L Mo","year":"2019","unstructured":"Mo, L. et al. Silver nanoparticles based ink with moderate sintering in flexible and printed electronics. Int. J. Mol. Sci. 20, 2124 (2019).","journal-title":"Int. J. Mol. Sci."},{"key":"389_CR14","doi-asserted-by":"publisher","first-page":"1622","DOI":"10.1039\/C3NR05479A","volume":"6","author":"W Shen","year":"2014","unstructured":"Shen, W., Zhang, X., Huang, Q., Xu, Q. &amp; Song, W. Preparation of solid silver nanoparticles for inkjet printed flexible electronics with high conductivity. Nanoscale 6, 1622\u20131628 (2014).","journal-title":"Nanoscale"},{"key":"389_CR15","doi-asserted-by":"publisher","first-page":"17226","DOI":"10.1021\/acsami.7b02573","volume":"9","author":"P Chantal","year":"2017","unstructured":"Chantal, P. et al. Versatile molecular silver ink platform for printed flexible electronics. ACS Appl Mater Interfaces 9, 17226\u201317237 (2017).","journal-title":"ACS Appl Mater Interfaces"},{"key":"389_CR16","doi-asserted-by":"publisher","first-page":"35","DOI":"10.1016\/j.colsurfa.2010.01.023","volume":"358","author":"W Cui","year":"2010","unstructured":"Cui, W. et al. Gold nanoparticle ink suitable for electric-conductive pattern fabrication using in ink-jet printing technology. Colloids Surf. A Physicochem. Eng. Asp. 358, 35\u201341 (2010).","journal-title":"Colloids Surf. A Physicochem. Eng. Asp."},{"key":"389_CR17","doi-asserted-by":"publisher","first-page":"106918","DOI":"10.1016\/j.elecom.2021.106918","volume":"123","author":"S Mekhmouken","year":"2021","unstructured":"Mekhmouken, S. et al. Gold nanoparticle-based eco-friendly ink for electrode patterning on flexible substrates. Electrochem. Commun. 123, 106918 (2021).","journal-title":"Electrochem. Commun."},{"key":"389_CR18","doi-asserted-by":"publisher","first-page":"100451","DOI":"10.1016\/j.apmt.2019.100451","volume":"18","author":"W Li","year":"2020","unstructured":"Li, W. et al. The rise of conductive copper inks: challenges and perspectives. Appl. Mater. Today 18, 100451 (2020).","journal-title":"Appl. Mater. Today"},{"key":"389_CR19","doi-asserted-by":"publisher","first-page":"1689","DOI":"10.3390\/nano10091689","volume":"10","author":"D Tomotoshi","year":"2020","unstructured":"Tomotoshi, D. &amp; Kawasaki, H. Surface and interface designs in copper-based conductive inks for printed\/flexible electronics. Nanomaterials 10, 1689 (2020).","journal-title":"Nanomaterials"},{"key":"389_CR20","doi-asserted-by":"publisher","first-page":"1","DOI":"10.1007\/s11051-013-1949-y","volume":"15","author":"W Li","year":"2013","unstructured":"Li, W., Chen, M., Wei, J., Li, W. &amp; You, C. Synthesis and characterization of air-stable Cu nanoparticles for conductive pattern drawing directly on paper substrates. J. Nanopart. Res. 15, 1\u201310 (2013).","journal-title":"J. Nanopart. Res."},{"key":"389_CR21","doi-asserted-by":"publisher","first-page":"82","DOI":"10.1016\/j.matchemphys.2014.02.045","volume":"146","author":"W Li","year":"2014","unstructured":"Li, W., Li, W., Wei, J., Tan, J. &amp; Chen, M. Preparation of conductive Cu patterns by directly writing using nano-Cu ink. Mater. Chem. Phys. 146, 82\u201387 (2014).","journal-title":"Mater. Chem. Phys."},{"key":"389_CR22","doi-asserted-by":"publisher","first-page":"2508","DOI":"10.1021\/acs.iecr.7b04248","volume":"57","author":"X Dai","year":"2018","unstructured":"Dai, X., Xu, W., Zhang, T. &amp; Wang, T. Self-reducible Cu nanoparticles for conductive inks. Ind. Eng. Chem. Res. 57, 2508\u20132516 (2018).","journal-title":"Ind. Eng. Chem. Res."},{"key":"389_CR23","doi-asserted-by":"publisher","first-page":"13416","DOI":"10.1021\/acsomega.0c01678","volume":"5","author":"X Dai","year":"2020","unstructured":"Dai, X., Zhang, T., Shi, H., Zhang, Y. &amp; Wang, T. Reactive sintering of Cu nanoparticles at ambient conditions for printed electronics. ACS Omega 5, 13416\u201313423 (2020).","journal-title":"ACS Omega"},{"key":"389_CR24","doi-asserted-by":"publisher","first-page":"2704","DOI":"10.1039\/c3tc00904a","volume":"1","author":"S Jeong","year":"2013","unstructured":"Jeong, S. et al. Air-stable, surface-oxide free Cu nanoparticles for highly conductive Cu ink and their application to printed graphene transistors. J. Mater. Chem. C 1, 2704\u20132710 (2013).","journal-title":"J. Mater. Chem. C"},{"key":"389_CR25","doi-asserted-by":"publisher","first-page":"15098","DOI":"10.1039\/C9TC05463D","volume":"7","author":"W Yang","year":"2019","unstructured":"Yang, W., List-Kratochvil, E. J. &amp; Wang, C. Metal particle-free inks for printed flexible electronics. J. Mater. Chem. C. 7, 15098\u201315117 (2019).","journal-title":"J. Mater. Chem. C."},{"key":"389_CR26","doi-asserted-by":"publisher","DOI":"10.1002\/adma.201905527","volume":"32","author":"J Shin","year":"2020","unstructured":"Shin, J. et al. Sensitive wearable temperature sensor with seamless monolithic integration. Adv. Mater. 32, 1905527 (2020).","journal-title":"Adv. Mater."},{"key":"389_CR27","doi-asserted-by":"publisher","first-page":"151179","DOI":"10.1016\/j.apsusc.2021.151179","volume":"570","author":"VB Nam","year":"2021","unstructured":"Nam, V. B., Giang, T. T. &amp; Lee, D. Laser digital patterning of finely-structured flexible copper electrodes using copper oxide nanoparticle ink produced by a scalable synthesis method. Appl. Surf. Sci. 570, 151179 (2021).","journal-title":"Appl. Surf. Sci."},{"key":"389_CR28","doi-asserted-by":"publisher","DOI":"10.1002\/admt.201600222","volume":"2","author":"J Kwon","year":"2017","unstructured":"Kwon, J. et al. Flexible and transparent Cu electronics by low\u2010temperature acid\u2010assisted laser processing of Cu nanoparticles. Adv. Mater. Technol. 2, 1600222 (2017).","journal-title":"Adv. Mater. Technol."},{"key":"389_CR29","doi-asserted-by":"publisher","first-page":"15773","DOI":"10.1021\/acsami.9b01893","volume":"11","author":"J Jung","year":"2019","unstructured":"Jung, J. et al. Moir\u00e9-free imperceptible and flexible random metal grid electrodes with large figure-of-merit by photonic sintering control of copper nanoparticles. ACS Appl. Mater. Interfaces 11, 15773\u201315780 (2019).","journal-title":"ACS Appl. Mater. Interfaces"},{"key":"389_CR30","doi-asserted-by":"publisher","first-page":"6530","DOI":"10.1016\/j.tsf.2011.04.112","volume":"519","author":"A Yabuki","year":"2011","unstructured":"Yabuki, A., Arriffin, N. &amp; Yanase, M. Low-temperature synthesis of copper conductive film by thermal decomposition of copper\u2013amine complexes. Thin Solid Films 519, 6530\u20136533 (2011).","journal-title":"Thin Solid Films"},{"key":"389_CR31","doi-asserted-by":"publisher","first-page":"3312","DOI":"10.1021\/am4036306","volume":"6","author":"DH Shin","year":"2014","unstructured":"Shin, D. H. et al. A self-reducible and alcohol-soluble copper-based metal\u2013organic decomposition ink for printed electronics. ACS Appl. Mater. Interfaces 6, 3312\u20133319 (2014).","journal-title":"ACS Appl. Mater. Interfaces"},{"key":"389_CR32","doi-asserted-by":"publisher","first-page":"1587","DOI":"10.1039\/C4CC08749F","volume":"51","author":"Y Farraj","year":"2015","unstructured":"Farraj, Y., Grouchko, M. &amp; Magdassi, S. Self-reduction of a copper complex MOD ink for inkjet printing conductive patterns on plastics. Chem. Commun. 51, 1587\u20131590 (2015).","journal-title":"Chem. Commun."},{"key":"389_CR33","doi-asserted-by":"publisher","first-page":"138248","DOI":"10.1016\/j.cplett.2020.138248","volume":"763","author":"S Kang","year":"2021","unstructured":"Kang, S., Tasaka, K., Lee, J. H. &amp; Yabuki, A. Self-reducible copper complex inks with two amines for copper conductive films via calcination below 100\u00b0 C. Chem. Phys. Lett. 763, 138248 (2021).","journal-title":"Chem. Phys. Lett."},{"key":"389_CR34","doi-asserted-by":"publisher","first-page":"2218","DOI":"10.3390\/ma14092218","volume":"14","author":"NS Shabanov","year":"2021","unstructured":"Shabanov, N. S. et al. Water-soluble copper ink for the inkjet fabrication of flexible electronic components. Materials 14, 2218 (2021).","journal-title":"Materials"},{"key":"389_CR35","doi-asserted-by":"publisher","first-page":"16101","DOI":"10.1021\/acs.langmuir.9b02281","volume":"35","author":"W Marchal","year":"2019","unstructured":"Marchal, W. et al. Effectiveness of ligand denticity-dependent oxidation protection in copper MOD inks. Langmuir 35, 16101\u201316110 (2019).","journal-title":"Langmuir"},{"key":"389_CR36","doi-asserted-by":"publisher","first-page":"6911","DOI":"10.1039\/C7NR08891D","volume":"10","author":"C Paquet","year":"2018","unstructured":"Paquet, C. et al. The role of amine ligands in governing film morphology and electrical properties of copper films derived from copper formate-based molecular inks. Nanoscale 10, 6911\u20136921 (2018).","journal-title":"Nanoscale"},{"key":"389_CR37","doi-asserted-by":"publisher","first-page":"4635","DOI":"10.1021\/acsaelm.3c00774","volume":"5","author":"S Nabi","year":"2023","unstructured":"Nabi, S. et al. Key aspects of the processes of thermal decomposition of complex compounds of copper formate for low-temperature printed electronics. II. The solvent effect. ACS Appl. Electron. Mater. 5, 4635\u20134642 (2023).","journal-title":"ACS Appl. Electron. Mater."},{"key":"389_CR38","doi-asserted-by":"publisher","first-page":"4107","DOI":"10.1016\/j.materresbull.2012.08.052","volume":"47","author":"A Yabuki","year":"2012","unstructured":"Yabuki, A. &amp; Tanaka, S. Electrically conductive copper film prepared at low temperature by thermal decomposition of copper amine complexes with various amines. Mater. Res. Bull. 47, 4107\u20134111 (2012).","journal-title":"Mater. Res. Bull."},{"key":"389_CR39","doi-asserted-by":"publisher","first-page":"8101","DOI":"10.1021\/acs.langmuir.5b01207","volume":"31","author":"YH Choi","year":"2015","unstructured":"Choi, Y. H. &amp; Hong, S. H. Effect of the Amine concentration on phase evolution and densification in printed films using Cu (II) complex ink. Langmuir 31, 8101\u20138110 (2015).","journal-title":"Langmuir"},{"key":"389_CR40","doi-asserted-by":"publisher","first-page":"82","DOI":"10.1021\/acs.langmuir.6b03668","volume":"33","author":"W Xu","year":"2017","unstructured":"Xu, W. &amp; Wang, T. Synergetic effect of blended alkylamines for copper complex ink to form conductive copper films. Langmuir 33, 82\u201390 (2017).","journal-title":"Langmuir"},{"key":"389_CR41","doi-asserted-by":"publisher","first-page":"7095","DOI":"10.1021\/acs.langmuir.4c00221","volume":"40","author":"W Yang","year":"2024","unstructured":"Yang, W., Guo, Z., Zhao, X., Zhang, X. &amp; List-Kratochvil, E. J. Insight into the types of alkanolamines on the properties of copper (II) formate-based conductive ink. Langmuir 40, 7095\u20137105 (2024).","journal-title":"Langmuir"},{"key":"389_CR42","doi-asserted-by":"publisher","first-page":"6796","DOI":"10.1039\/D3NJ05185D","volume":"48","author":"N Mohan","year":"2024","unstructured":"Mohan, N. et al. Decomposition mechanism and morphological evolution of in situ realized Cu nanoparticles in Cu complex inks. N. J. Chem. 48, 6796\u20136808 (2024).","journal-title":"N. J. Chem."},{"key":"389_CR43","doi-asserted-by":"publisher","first-page":"025501","DOI":"10.1088\/0022-3727\/47\/2\/025501","volume":"47","author":"M Zenou","year":"2013","unstructured":"Zenou, M., Ermak, O., Saar, A. &amp; Kotler, Z. Laser sintering of copper nanoparticles. J. Phys. D Appl. Phys. 47, 025501 (2013).","journal-title":"J. Phys. D Appl. Phys."},{"key":"389_CR44","doi-asserted-by":"publisher","first-page":"40","DOI":"10.4236\/opj.2013.34A007","volume":"3","author":"E Halonen","year":"2013","unstructured":"Halonen, E., Heinonen, E. &amp; M\u00e4ntysalo, M. The effect of laser sintering process parameters on Cu nanoparticle ink in room conditions. Opt. Photonics J. 3, 40\u201344 (2013).","journal-title":"Opt. Photonics J."},{"key":"389_CR45","doi-asserted-by":"publisher","first-page":"11192","DOI":"10.1021\/la402026r","volume":"29","author":"T Araki","year":"2013","unstructured":"Araki, T. et al. Cu salt ink formulation for printed electronics using photonic sintering. Langmuir 29, 11192\u201311197 (2013).","journal-title":"Langmuir"},{"key":"389_CR46","doi-asserted-by":"publisher","first-page":"131","DOI":"10.1016\/j.orgel.2015.06.026","volume":"25","author":"S Norita","year":"2015","unstructured":"Norita, S. et al. Inkjet-printed copper electrodes using photonic sintering and their application to organic thin-film transistors. Org. Electron. 25, 131\u2013134 (2015).","journal-title":"Org. Electron."},{"key":"389_CR47","doi-asserted-by":"publisher","first-page":"521","DOI":"10.1016\/j.apsusc.2011.08.076","volume":"258","author":"M Joo","year":"2011","unstructured":"Joo, M., Lee, B., Jeong, S. &amp; Lee, M. Laser sintering of Cu paste film printed on polyimide substrate. Appl. Surf. Sci. 258, 521\u2013524 (2011).","journal-title":"Appl. Surf. Sci."},{"key":"389_CR48","doi-asserted-by":"publisher","first-page":"1261","DOI":"10.1166\/jnn.2019.16233","volume":"19","author":"JH Yu","year":"2019","unstructured":"Yu, J. H., Jung, H. S., Jeong, J. K. &amp; Kang, K. T. Sintering behavior of copper nanoparticle ink by laser in air. J. Nanosci. Nanotechnol. 19, 1261\u20131268 (2019).","journal-title":"J. Nanosci. Nanotechnol."},{"key":"389_CR49","doi-asserted-by":"publisher","first-page":"035203","DOI":"10.1088\/0957-4484\/27\/3\/035203","volume":"27","author":"A Soltani","year":"2015","unstructured":"Soltani, A., Vahed, B. K., Mardoukhi, A. &amp; M\u00e4ntysalo, M. Laser sintering of copper nanoparticles on top of silicon substrates. Nanotechnology 27, 035203 (2015).","journal-title":"Nanotechnology"},{"key":"389_CR50","first-page":"103527","volume":"69","author":"X Chen","year":"2023","unstructured":"Chen, X., Zhang, M., Zhu, J., Tao, Z. &amp; Qiu, L. Laser sintering of Cu nanoparticles deposited on ceramic substrates: experiments and modeling. Addit. Manuf. 69, 103527 (2023).","journal-title":"Addit. Manuf."},{"key":"389_CR51","doi-asserted-by":"publisher","first-page":"010903","DOI":"10.1115\/1.4038455","volume":"6","author":"NK Roy","year":"2018","unstructured":"Roy, N. K. et al. A comprehensive study of the sintering of copper nanoparticles using femtosecond, nanosecond, and continuous wave lasers. J. Micro Nano Manuf. 6, 010903 (2018).","journal-title":"J. Micro Nano Manuf."},{"key":"389_CR52","doi-asserted-by":"publisher","first-page":"2018","DOI":"10.1109\/TCPMT.2014.2363032","volume":"4","author":"J Niittynen","year":"2014","unstructured":"Niittynen, J. &amp; M\u00e4ntysalo, M. Characterization of laser sintering of copper nanoparticle ink by FEM and experimental testing. IEEE Trans. Compon. Packaging Manuf. Technol. 4, 2018\u20132025 (2014).","journal-title":"IEEE Trans. Compon. Packaging Manuf. Technol."},{"key":"389_CR53","doi-asserted-by":"publisher","first-page":"303","DOI":"10.1007\/s11465-019-0562-x","volume":"15","author":"JC Hernandez-Castaneda","year":"2020","unstructured":"Hernandez-Castaneda, J. C., Lok, B. K. &amp; Zheng, H. Laser sintering of Cu nanoparticles on PET polymer substrate for printed electronics at different wavelengths and process conditions. Front. Mech. Eng. 15, 303\u2013318 (2020).","journal-title":"Front. Mech. Eng."},{"key":"389_CR54","doi-asserted-by":"publisher","first-page":"42","DOI":"10.1016\/j.apsusc.2014.03.127","volume":"307","author":"J Lee","year":"2014","unstructured":"Lee, J., Lee, B., Jeong, S., Kim, Y. &amp; Lee, M. Microstructure and electrical property of laser-sintered Cu complex ink. Appl. Surf. Sci. 307, 42\u201345 (2014).","journal-title":"Appl. Surf. Sci."},{"key":"389_CR55","doi-asserted-by":"publisher","first-page":"264","DOI":"10.1016\/j.tsf.2014.06.005","volume":"564","author":"J Lee","year":"2014","unstructured":"Lee, J., Lee, B., Jeong, S., Kim, Y. &amp; Lee, M. Enhanced surface coverage and conductivity of Cu complex ink-coated films by laser sintering. Thin Solid Films 564, 264\u2013268 (2014).","journal-title":"Thin Solid Films"},{"key":"389_CR56","doi-asserted-by":"publisher","first-page":"333","DOI":"10.1007\/s40684-015-0040-9","volume":"2","author":"JH Yu","year":"2015","unstructured":"Yu, J. H., Rho, Y., Kang, H., Jung, H. S. &amp; Kang, K. T. Electrical behavior of laser-sintered Cu based metal-organic decomposition ink in air environment and application as current collectors in supercapacitor. Int. J. Precis. Eng. Manuf. Green. Technol. 2, 333\u2013337 (2015).","journal-title":"Int. J. Precis. Eng. Manuf. Green. Technol."},{"key":"389_CR57","doi-asserted-by":"publisher","first-page":"128","DOI":"10.1016\/j.optlastec.2016.09.021","volume":"88","author":"H Min","year":"2017","unstructured":"Min, H., Lee, B., Jeong, S. &amp; Lee, M. Fabrication of 10 \u00b5m-scale conductive Cu patterns by selective laser sintering of Cu complex ink. Opt. Laser Technol. 88, 128\u2013133 (2017).","journal-title":"Opt. Laser Technol."},{"key":"389_CR58","doi-asserted-by":"crossref","unstructured":"Mohan, N., Ahuir-Torres, J. I., Bhogaraju, S. K., Kotadia, H., &amp; Elger, G. Rapid Sintering of Inkjet Printed Cu Complex Inks Using Laser in Air. In Proc. 24th European Microelectronics and Packaging Conference &amp; Exhibition (EMPC) 1\u20137 (IEEE, 2023).","DOI":"10.23919\/EMPC55870.2023.10418323"},{"key":"389_CR59","doi-asserted-by":"publisher","first-page":"387","DOI":"10.3390\/nano12030387","volume":"12","author":"JH Park","year":"2022","unstructured":"Park, J. H. et al. Direct laser interference ink printing using copper metal\u2013organic decomposition ink for nanofabrication. Nanomaterials 12, 387 (2022).","journal-title":"Nanomaterials"},{"key":"389_CR60","doi-asserted-by":"publisher","first-page":"6406","DOI":"10.1039\/C8TC01849A","volume":"6","author":"Y Dong","year":"2018","unstructured":"Dong, Y. et al. A low temperature and air-sinterable copper\u2013diamine complex-based metal organic decomposition ink for printed electronics. J. Mater. Chem. C. 6, 6406\u20136415 (2018).","journal-title":"J. Mater. Chem. C."},{"key":"389_CR61","unstructured":"Mohan, N., Saccon, R., Bhogaraju, S. K., &amp; Elger, G. Cu complex inks for printed electronics application-challenges and solutions. In Mikro-Nano-Integration; 9. GMM-Workshop 1\u20135 (VDE, 2022)."},{"key":"389_CR62","doi-asserted-by":"publisher","first-page":"2910","DOI":"10.1002\/app.30329","volume":"113","author":"VE Beal","year":"2009","unstructured":"Beal, V. E., Paggi, R. A., Salmoria, G. V. &amp; Lago, A. Statistical evaluation of laser energy density effect on mechanical properties of polyamide parts manufactured by selective laser sintering. J. Appl. Polym. Sci. 113, 2910\u20132919 (2009).","journal-title":"J. Appl. Polym. Sci."},{"key":"389_CR63","doi-asserted-by":"publisher","first-page":"023111","DOI":"10.1063\/1.4976134","volume":"24","author":"L Torrisi","year":"2017","unstructured":"Torrisi, L. Advanced polymer targets for TNSA regime producing 6 MeV protons at 1016 W\/cm2 laser intensity. Phys. Plasmas. 24, 023111 (2017).","journal-title":"Phys. Plasmas."},{"key":"389_CR64","first-page":"33","volume":"1","author":"P Ana","year":"2018","unstructured":"Ana, P., Bortoleto, J., Cruz, N., Rangel, E. &amp; Durrant, S. Surface properties of PET polymer treated by plasma immersion techniques for food packaging. Int. J. Nano Res 1, 33\u201341 (2018).","journal-title":"Int. J. Nano Res"},{"key":"389_CR65","doi-asserted-by":"publisher","first-page":"103","DOI":"10.21315\/jps2019.30.s2.9","volume":"30","author":"N Ibrahim","year":"2019","unstructured":"Ibrahim, N., Riduwan, M. &amp; Rusli, A. Synthesis of siloxane-polyimide copolymer with low birefringence and low loss for optical waveguide. J. Phys. Sci. 30, 103\u2013113 (2019).","journal-title":"J. Phys. Sci."},{"key":"389_CR66","doi-asserted-by":"publisher","first-page":"588","DOI":"10.1016\/j.apsusc.2017.10.200","volume":"434","author":"Q Du","year":"2018","unstructured":"Du, Q., Chen, T., Liu, J. &amp; Zeng, X. Surface microstructure and chemistry of polyimide by single pulse ablation of picosecond laser. Appl. Surf. Sci. 434, 588\u2013595 (2018).","journal-title":"Appl. Surf. Sci."},{"key":"389_CR67","doi-asserted-by":"publisher","first-page":"180","DOI":"10.1109\/84.767114","volume":"8","author":"K Kurabayashi","year":"1999","unstructured":"Kurabayashi, K., Asheghi, M., Touzelbaev, M. &amp; Goodson, K. E. Measurement of the thermal conductivity anisotropy in polyimide films. J. Microelectromechanical Syst. 8, 180\u2013191 (1999).","journal-title":"J. Microelectromechanical Syst."},{"key":"389_CR68","doi-asserted-by":"publisher","first-page":"637","DOI":"10.1016\/j.polymertesting.2004.01.013","volume":"23","author":"CM Lopes","year":"2004","unstructured":"Lopes, C. M. &amp; Felisberti, M. I. Thermal conductivity of PET\/(LDPE\/AI) composites determined by MDSC. Polym. Test. 23, 637\u2013643 (2004).","journal-title":"Polym. Test."},{"key":"389_CR69","doi-asserted-by":"crossref","unstructured":"B\u00eerc\u0103, A., Gherasim, O., Grumezescu, V., &amp; Grumezescu, A. M. Introduction in thermoplastic and thermosetting polymers. In Materials for Biomedical Engineering 1\u201328 (Elsevier, 2019).","DOI":"10.1016\/B978-0-12-816874-5.00001-3"},{"key":"389_CR70","doi-asserted-by":"publisher","first-page":"309","DOI":"10.2961\/jlmn.2013.03.0021","volume":"8","author":"S Rung","year":"2013","unstructured":"Rung, S., Rexhepi, M., Bischoff, C. &amp; Hellmann, R. Laserscribing of thin films using top-hat laser beam profiles. J. Laser Micro Nanoeng. 8, 309 (2013).","journal-title":"J. Laser Micro Nanoeng."},{"key":"389_CR71","doi-asserted-by":"publisher","first-page":"221","DOI":"10.3390\/mi11020221","volume":"11","author":"H Le","year":"2020","unstructured":"Le, H. et al. Effects of top-hat laser beam processing and scanning strategies in laser micro-structuring. Micromachines 11, 221 (2020).","journal-title":"Micromachines"},{"key":"389_CR72","doi-asserted-by":"publisher","unstructured":"ASTM International. ASTM D3359-23: Standard test methods for rating adhesion by tape test. ASTM International. https:\/\/doi.org\/10.1520\/D3359-23 (2023).","DOI":"10.1520\/D3359-23"},{"key":"389_CR73","doi-asserted-by":"publisher","first-page":"100129","DOI":"10.1016\/j.mne.2022.100129","volume":"15","author":"A Apostolakis","year":"2022","unstructured":"Apostolakis, A. et al. Resistivity study of inkjet-printed structures and electrical interfacing on flexible substrates. Micro Nano Eng. 15, 100129 (2022).","journal-title":"Micro Nano Eng."}],"container-title":["npj Flexible Electronics"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.nature.com\/articles\/s41528-025-00389-5.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/www.nature.com\/articles\/s41528-025-00389-5","content-type":"text\/html","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/www.nature.com\/articles\/s41528-025-00389-5.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,3,4]],"date-time":"2025-03-04T16:22:48Z","timestamp":1741105368000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.nature.com\/articles\/s41528-025-00389-5"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,3,4]]},"references-count":73,"journal-issue":{"issue":"1","published-online":{"date-parts":[[2025,12]]}},"alternative-id":["389"],"URL":"https:\/\/doi.org\/10.1038\/s41528-025-00389-5","relation":{},"ISSN":["2397-4621"],"issn-type":[{"value":"2397-4621","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,3,4]]},"assertion":[{"value":"15 October 2024","order":1,"name":"received","label":"Received","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"15 February 2025","order":2,"name":"accepted","label":"Accepted","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"4 March 2025","order":3,"name":"first_online","label":"First Online","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"The authors declare no competing interests.","order":1,"name":"Ethics","group":{"name":"EthicsHeading","label":"Competing interests"}}],"article-number":"18"}}</enrichment>
    <enrichment key="local_crossrefDocumentType">journal-article</enrichment>
    <enrichment key="local_crossrefLicence">https://creativecommons.org/licenses/by/4.0</enrichment>
    <enrichment key="local_import_origin">crossref</enrichment>
    <enrichment key="local_doiImportPopulated">PersonAuthorFirstName_1,PersonAuthorLastName_1,PersonAuthorFirstName_2,PersonAuthorLastName_2,PersonAuthorFirstName_3,PersonAuthorLastName_3,PersonAuthorFirstName_4,PersonAuthorLastName_4,PublisherName,TitleMain_1,Language,TitleAbstract_1,TitleParent_1,ArticleNumber,Issue,Volume,CompletedYear,IdentifierIssn,Enrichmentlocal_crossrefLicence</enrichment>
    <enrichment key="opus.source">doi-import</enrichment>
    <enrichment key="THI_DownloadUrl">https://static-content.springer.com/esm/art%3A10.1038%2Fs41528-025-00389-5/MediaObjects/41528_2025_389_MOESM1_ESM.pdf</enrichment>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.1038/s41528-025-00389-5</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <enrichment key="THI_openaccess">ja</enrichment>
    <enrichment key="THI_articleversion">published</enrichment>
    <enrichment key="opus.doi.autoCreate">false</enrichment>
    <enrichment key="opus.urn.autoCreate">true</enrichment>
    <licence>Creative Commons BY 4.0</licence>
    <author>
      <first_name>Nihesh</first_name>
      <last_name>Mohan</last_name>
    </author>
    <author>
      <first_name>Juan Ignacio</first_name>
      <last_name>Ahuir-Torres</last_name>
    </author>
    <author>
      <first_name>Hiren R.</first_name>
      <last_name>Kotadia</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <collection role="open_access" number="">open_access</collection>
    <collection role="institutes" number="19311">Fakultät Elektro- und Informationstechnik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
    <thesisPublisher>Technische Hochschule Ingolstadt</thesisPublisher>
    <file>https://opus4.kobv.de/opus4-haw/files/5826/s41528-025-00389-5.pdf</file>
  </doc>
  <doc>
    <id>1328</id>
    <completedYear/>
    <publishedYear>2021</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>526</pageFirst>
    <pageLast>531</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <articleNumber/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace>Piscataway</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>2022-02-21</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Low temperature and low pressure die-attach bonding of high power light emitting diodes with self reducing copper complex paste</title>
    <parentTitle language="eng">IEEE 71st Electronic Components and Technology Conference ECTC 2021, Proceedings</parentTitle>
    <identifier type="isbn">978-1-6654-4097-4</identifier>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.1109/ECTC32696.2021.00094</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <enrichment key="THI_conferenceName">2021 IEEE 71st Electronic Components and Technology Conference (ECTC), online, 01.06. - 04.07.2021</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <author>
      <first_name>Sri Krishna</first_name>
      <last_name>Bhogaraju</last_name>
    </author>
    <author>
      <first_name>Maximilian</first_name>
      <last_name>Schmid</last_name>
    </author>
    <author>
      <first_name>Elias</first_name>
      <last_name>Hufnagel</last_name>
    </author>
    <author>
      <first_name>Fosca</first_name>
      <last_name>Conti</last_name>
    </author>
    <author>
      <first_name>Hiren R.</first_name>
      <last_name>Kotadia</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>low temperature sintering</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>rapid sintering</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Cu(II) formate</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>reducing binder</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>low pressure sintering</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>high bond strength</value>
    </subject>
    <collection role="institutes" number="19311">Fakultät Elektro- und Informationstechnik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
    <collection role="persons" number="26880">Schmid, Maximilian</collection>
  </doc>
  <doc>
    <id>1189</id>
    <completedYear>2021</completedYear>
    <publishedYear>2021</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>4587</pageFirst>
    <pageLast>4603</pageLast>
    <pageNumber/>
    <edition/>
    <issue>10</issue>
    <volume>3</volume>
    <articleNumber/>
    <type>article</type>
    <publisherName>ACS Publications</publisherName>
    <publisherPlace>Washington</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>2022-02-11</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Die-attach bonding with etched micro brass metal pigment flakes for high-power electronics packaging</title>
    <parentTitle language="eng">ACS Applied Electronic Materials</parentTitle>
    <identifier type="issn">2637-6113</identifier>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.1021/acsaelm.1c00721</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <enrichment key="THI_articleversion">published</enrichment>
    <author>
      <first_name>Sri Krishna</first_name>
      <last_name>Bhogaraju</last_name>
    </author>
    <author>
      <first_name>Hiren R.</first_name>
      <last_name>Kotadia</last_name>
    </author>
    <author>
      <first_name>Fosca</first_name>
      <last_name>Conti</last_name>
    </author>
    <author>
      <first_name>Armin</first_name>
      <last_name>Mauser</last_name>
    </author>
    <author>
      <first_name>Thomas</first_name>
      <last_name>Rubenbauer</last_name>
    </author>
    <author>
      <first_name>Robert</first_name>
      <last_name>Bruetting</last_name>
    </author>
    <author>
      <first_name>Martin</first_name>
      <last_name>Schneider-Ramelow</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>sintering</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>brass flakes</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>nanostructured materials</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>self-reducing</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>etching</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>surface modifications</value>
    </subject>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
  </doc>
  <doc>
    <id>1270</id>
    <completedYear>2020</completedYear>
    <publishedYear>2020</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber/>
    <edition/>
    <issue>844</issue>
    <volume>2020</volume>
    <articleNumber>156043</articleNumber>
    <type>article</type>
    <publisherName>Elsevier</publisherName>
    <publisherPlace>Amsterdam</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>2022-02-16</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging</title>
    <parentTitle language="eng">Journal of Alloys and Compounds</parentTitle>
    <identifier type="issn">1873-4669</identifier>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.1016/j.jallcom.2020.156043</enrichment>
    <enrichment key="THI_articleversion">published</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <author>
      <first_name>Sri Krishna</first_name>
      <last_name>Bhogaraju</last_name>
    </author>
    <author>
      <first_name>Fosca</first_name>
      <last_name>Conti</last_name>
    </author>
    <author>
      <first_name>Hiren R.</first_name>
      <last_name>Kotadia</last_name>
    </author>
    <author>
      <first_name>Simon</first_name>
      <last_name>Keim</last_name>
    </author>
    <author>
      <first_name>Ulrich</first_name>
      <last_name>Tetzlaff</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Metals and alloys</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Microstructure</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Surfaces and interfaces</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Sintering</value>
    </subject>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
    <collection role="persons" number="26484">Tetzlaff, Ulrich</collection>
  </doc>
  <doc>
    <id>1859</id>
    <completedYear/>
    <publishedYear>2019</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>387</pageFirst>
    <pageLast>392</pageLast>
    <pageNumber/>
    <edition/>
    <issue>1</issue>
    <volume>2019</volume>
    <articleNumber/>
    <type>conferenceobject</type>
    <publisherName>IMAPS</publisherName>
    <publisherPlace>Pittsburgh</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>2022-03-09</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">A multi-pronged approach to low-pressure Cu sintering using surface-modified particles, substrate and chip metallization</title>
    <parentTitle language="eng">International Symposium on Microelectronics</parentTitle>
    <identifier type="issn">2380-4505</identifier>
    <identifier type="issn">1085-8024</identifier>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.4071/2380-4505-2019.1.000387</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <enrichment key="THI_conferenceName">52nd International Symposium on Microelectronics, Boston (USA), 30.09.-03.10.2019</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <author>
      <first_name>Sri Krishna</first_name>
      <last_name>Bhogaraju</last_name>
    </author>
    <author>
      <first_name>Omid</first_name>
      <last_name>Mokhtari</last_name>
    </author>
    <author>
      <first_name>Jacopo</first_name>
      <last_name>Pascucci</last_name>
    </author>
    <author>
      <first_name>Fosca</first_name>
      <last_name>Conti</last_name>
    </author>
    <author>
      <first_name>Hiren R.</first_name>
      <last_name>Kotadia</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <collection role="institutes" number="15984">Fakultät Elektrotechnik und Informatik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
  </doc>
  <doc>
    <id>3848</id>
    <completedYear/>
    <publishedYear>2021</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>6</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <articleNumber/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace>Piscataway</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Highly reliable die-attach bonding with etched brass flakes</title>
    <parentTitle language="eng">2021 23rd European Microelectronics and Packaging Conference &amp; Exhibition (EMPC): Technical Papers</parentTitle>
    <identifier type="isbn">978-0-9568086-7-7</identifier>
    <enrichment key="opus_doi_flag">true</enrichment>
    <enrichment key="opus_import_data">{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2022,7,13]],"date-time":"2022-07-13T14:34:53Z","timestamp":1657722893391},"reference-count":25,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2021,9,13]]},"DOI":"10.23919\/empc53418.2021.9584967","type":"proceedings-article","created":{"date-parts":[[2021,11,1]],"date-time":"2021-11-01T20:55:34Z","timestamp":1635800134000},"source":"Crossref","is-referenced-by-count":1,"title":["Highly reliable die-attach bonding with etched brass flakes"],"prefix":"10.23919","author":[{"given":"Sri Krishna","family":"Bhogaraju","sequence":"first","affiliation":[]},{"given":"Maximilian","family":"Schmid","sequence":"additional","affiliation":[]},{"given":"Hiren R","family":"Kotadia","sequence":"additional","affiliation":[]},{"given":"Fosca","family":"Conti","sequence":"additional","affiliation":[]},{"given":"Gordon","family":"Elger","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.4028\/www.scientific.net\/MSF.255-257.533"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1007\/s11664-013-2967-3"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2018.00312"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2012.2201940"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-99256-3"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1016\/j.jallcom.2021.158783"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.23919\/EMPC44848.2019.8951887"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1016\/j.jallcom.2020.156043"},{"key":"ref18","article-title":"Automatic Panel Level Transient Thermal Tester","author":"elger","year":"0","journal-title":"LED professional Symposium + Expo"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2020.3011818"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ESTC.2018.8546498"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1007\/s005420100103"},{"key":"ref6","first-page":"102488","article-title":"Effects of thermal aging on long-term reliability and failure modes of nano-silver sintered lap-shear joint","author":"tan","year":"2019","journal-title":"Int J Adhes Adhes"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2017.01.010"},{"key":"ref8","first-page":"191","article-title":"Stress Evaluations of Silicon Nitride Chips Bonded onto Copper Substrates via SAC Soldering, AuSn Soldering, and Copper Sintering","author":"conti","year":"2020","journal-title":"IEEE 25th International Workshop on thermal Investigations of ICs and systems (Therminic)"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1007\/s11664-020-08325-1"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1007\/s10854-015-3459-4"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/THERMINIC.2019.8923629"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.4271\/2014-01-1888"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.23919\/ICEP51988.2021.9451966"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1117\/12.2591947"},{"key":"ref21","year":"2020","journal-title":"ALLOY GUIDE - Strip &amp; Plate"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1063\/1.1521240"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1016\/j.jallcom.2020.156043"},{"key":"ref25","doi-asserted-by":"crossref","first-page":"3117","DOI":"10.1016\/j.actamat.2010.01.050","article-title":"The theoretical shear strength of fcc crystals under superimposed triaxial stress","volume":"58","author":"?ern\u00fd","year":"2010","journal-title":"Acta Mater"}],"event":{"name":"2021 23rd European Microelectronics and Packaging Conference &amp; Exhibition (EMPC)","location":"Gothenburg, Sweden","start":{"date-parts":[[2021,9,13]]},"end":{"date-parts":[[2021,9,16]]}},"container-title":["2021 23rd European Microelectronics and Packaging Conference &amp;amp; Exhibition (EMPC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9584450\/9584941\/09584967.pdf?arnumber=9584967","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,2,28]],"date-time":"2022-02-28T22:00:58Z","timestamp":1646085658000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9584967\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,9,13]]},"references-count":25,"URL":"http:\/\/dx.doi.org\/10.23919\/empc53418.2021.9584967","relation":{},"published":{"date-parts":[[2021,9,13]]}}}</enrichment>
    <enrichment key="local_crossrefDocumentType">proceedings-article</enrichment>
    <enrichment key="local_import_origin">crossref</enrichment>
    <enrichment key="local_doiImportPopulated">PersonAuthorFirstName_1,PersonAuthorLastName_1,PersonAuthorFirstName_2,PersonAuthorLastName_2,PersonAuthorFirstName_3,PersonAuthorLastName_3,PersonAuthorFirstName_4,PersonAuthorLastName_4,PersonAuthorFirstName_5,PersonAuthorLastName_5,Enrichmentconference_title,Enrichmentconference_place,PublisherName,TitleMain_1,TitleParent_1,CompletedYear</enrichment>
    <enrichment key="conference_title">2021 23rd European Microelectronics and Packaging Conference &amp; Exhibition (EMPC)</enrichment>
    <enrichment key="conference_place">Gothenburg, Sweden</enrichment>
    <enrichment key="opus.source">doi-import</enrichment>
    <enrichment key="THI_conferenceName">2021 23rd European Microelectronics and Packaging Conference, online, 13.-16.09.2021</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.23919/EMPC53418.2021.9584967</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <author>
      <first_name>Sri Krishna</first_name>
      <last_name>Bhogaraju</last_name>
    </author>
    <author>
      <first_name>Maximilian</first_name>
      <last_name>Schmid</last_name>
    </author>
    <author>
      <first_name>Hiren R.</first_name>
      <last_name>Kotadia</last_name>
    </author>
    <author>
      <first_name>Fosca</first_name>
      <last_name>Conti</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>sintering</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>etched brass</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>flakes</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>reliability</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>LED</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>die-attach</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>in-situ copper oxide reduction</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>transient thermal analysis</value>
    </subject>
    <collection role="institutes" number="19311">Fakultät Elektro- und Informationstechnik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
    <collection role="persons" number="26880">Schmid, Maximilian</collection>
  </doc>
  <doc>
    <id>4704</id>
    <completedYear/>
    <publishedYear>2024</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>6796</pageFirst>
    <pageLast>6808</pageLast>
    <pageNumber/>
    <edition/>
    <issue>15</issue>
    <volume>48</volume>
    <articleNumber/>
    <type>article</type>
    <publisherName>RSC</publisherName>
    <publisherPlace>London</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Decomposition mechanism and morphological evolution of in situ realized Cu nanoparticles in Cu complex inks</title>
    <parentTitle language="eng">New Journal of Chemistry</parentTitle>
    <identifier type="issn">1369-9261</identifier>
    <enrichment key="opus_doi_flag">true</enrichment>
    <enrichment key="opus_import_data">{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,4,16]],"date-time":"2024-04-16T00:18:25Z","timestamp":1713226705718},"reference-count":59,"publisher":"Royal Society of Chemistry (RSC)","issue":"15","license":[{"start":{"date-parts":[[2025,3,11]],"date-time":"2025-03-11T00:00:00Z","timestamp":1741651200000},"content-version":"am","delay-in-days":435,"URL":"http:\/\/rsc.li\/journals-terms-of-use"}],"funder":[{"DOI":"10.13039\/501100023430","name":"Bayerische Forschungsverb\u00fcnde","doi-asserted-by":"publisher","award":["DIE-2107-005\/\/DIE0159\/01"]}],"content-domain":{"domain":["rsc.org"],"crossmark-restriction":true},"short-container-title":["New J. Chem."],"abstract":"&lt;jats:p&gt;Controlling &lt;jats:italic&gt;in situ&lt;\/jats:italic&gt; nanoparticle formation and growth in Cu complex inks during decomposition and sintering process by modifying ink chemistry (complexing molar ratio, organic solvent) and influencing sintering parameters (temperature, ramp rate).&lt;\/jats:p&gt;","DOI":"10.1039\/d3nj05185d","type":"journal-article","created":{"date-parts":[[2024,3,11]],"date-time":"2024-03-11T14:40:45Z","timestamp":1710168045000},"page":"6796-6808","update-policy":"http:\/\/dx.doi.org\/10.1039\/rsc_crossmark_policy","source":"Crossref","is-referenced-by-count":0,"title":["Decomposition mechanism and morphological evolution of &lt;i&gt;in situ&lt;\/i&gt; realized Cu nanoparticles in Cu complex inks"],"prefix":"10.1039","volume":"48","author":[{"ORCID":"http:\/\/orcid.org\/0000-0002-4601-979X","authenticated-orcid":false,"given":"Nihesh","family":"Mohan","sequence":"first","affiliation":[{"name":"Institute of Innovative Mobility, Technische Hochschule Ingolstadt, Esplanade 10, 85049, Ingolstadt, Germany"}]},{"ORCID":"http:\/\/orcid.org\/0000-0002-3160-0223","authenticated-orcid":false,"given":"Juan Ignacio","family":"Ahuir-Torres","sequence":"additional","affiliation":[{"name":"School of Engineering, Liverpool John Moores University, Liverpool, L3 3AF, UK"}]},{"ORCID":"http:\/\/orcid.org\/0000-0003-1077-976X","authenticated-orcid":false,"given":"Sri Krishna","family":"Bhogaraju","sequence":"additional","affiliation":[{"name":"Institute of Innovative Mobility, Technische Hochschule Ingolstadt, Esplanade 10, 85049, Ingolstadt, Germany"}]},{"given":"Ralf","family":"Webler","sequence":"additional","affiliation":[{"name":"Schlenk SE, Barnsdorfer Hauptstrasse 5, 91154 Roth-Barnsdorf, Germany"}]},{"ORCID":"http:\/\/orcid.org\/0000-0002-3466-4337","authenticated-orcid":false,"given":"Hiren R.","family":"Kotadia","sequence":"additional","affiliation":[{"name":"School of Engineering, Liverpool John Moores University, Liverpool, L3 3AF, UK"}]},{"given":"Huseyin","family":"Erdogan","sequence":"additional","affiliation":[{"name":"Conti Temic Microelectronic GmbH, Ringlerstrasse 17, 85057 Ingolstadt, Germany"}]},{"ORCID":"http:\/\/orcid.org\/0000-0002-7643-7327","authenticated-orcid":false,"given":"Gordon","family":"Elger","sequence":"additional","affiliation":[{"name":"Institute of Innovative Mobility, Technische Hochschule Ingolstadt, Esplanade 10, 85049, Ingolstadt, Germany"}]}],"member":"292","published-online":{"date-parts":[[2024]]},"reference":[{"key":"D3NJ05185D\/cit1\/1","doi-asserted-by":"crossref","DOI":"10.1007\/978-1-4614-9625-0","volume-title":"Introduction to Printed Electronics","author":"Sugunuma","year":"2014","unstructured":"K.Sugunuma ,  Introduction to Printed Electronics ,  Springer Science &amp; Business Media ,  New York ,  2014"},{"key":"D3NJ05185D\/cit2\/1","doi-asserted-by":"crossref","first-page":"704","DOI":"10.3390\/ma13030704","volume":"13","author":"Beedasy","year":"2020","journal-title":"Materials"},{"key":"D3NJ05185D\/cit3\/1","first-page":"42","volume-title":"IEEE Transactions on Circuits and Systems II: Express Briefs","author":"Ragonese","year":"2021","unstructured":"E.Ragonese ,  M.Fattori  and  E.Cantatore ,  IEEE Transactions on Circuits and Systems II: Express Briefs ,  2021 , vol. 68,  pp. 42\u201348"},{"key":"D3NJ05185D\/cit4\/1","doi-asserted-by":"crossref","first-page":"406","DOI":"10.1039\/D2TC03736J","volume":"11","author":"Yang","year":"2023","journal-title":"J. Mater. Chem. C"},{"key":"D3NJ05185D\/cit5\/1","doi-asserted-by":"crossref","first-page":"1","DOI":"10.1016\/j.partic.2011.12.001","volume":"10","author":"Grande","year":"2012","journal-title":"Particuology"},{"key":"D3NJ05185D\/cit6\/1","doi-asserted-by":"crossref","first-page":"655","DOI":"10.3390\/mi12060655","volume":"12","author":"Mirshojaeian Hosseini","year":"2021","journal-title":"Micromachines"},{"key":"D3NJ05185D\/cit7\/1","volume":"32","author":"Khan","year":"2019","journal-title":"Adv. Mater."},{"key":"D3NJ05185D\/cit8\/1","doi-asserted-by":"crossref","first-page":"1230","DOI":"10.3390\/s19051230","volume":"19","author":"Khan","year":"2019","journal-title":"Sensors"},{"key":"D3NJ05185D\/cit9\/1","doi-asserted-by":"crossref","first-page":"509","DOI":"10.1007\/978-94-009-0741-6_33","volume-title":"Sintering Key Papers","author":"Kuczynski","year":"1990","unstructured":"G. C.Kuczynski ,  Sintering Key Papers ,  1990 ,  pp. 509\u2013527"},{"key":"D3NJ05185D\/cit10\/1","doi-asserted-by":"crossref","first-page":"1800831","DOI":"10.1002\/aelm.201800831","volume":"5","author":"Tan","year":"2019","journal-title":"Adv. Electron. Mater."},{"key":"D3NJ05185D\/cit11\/1","first-page":"1","volume":"9","author":"Rajan","year":"2016","journal-title":"Nanotechnol., Sci. Appl."},{"key":"D3NJ05185D\/cit12\/1","doi-asserted-by":"crossref","first-page":"2124","DOI":"10.3390\/ijms20092124","volume":"20","author":"Mo","year":"2019","journal-title":"Int. J. Mol. Sci."},{"key":"D3NJ05185D\/cit13\/1","first-page":"1213","volume":"21","author":"Kang","year":"2010","journal-title":"J. Mater. Sci.: Mater. Electron."},{"key":"D3NJ05185D\/cit14\/1","doi-asserted-by":"crossref","first-page":"63985","DOI":"10.1039\/C5RA08205F","volume":"5","author":"Abhinav K","year":"2015","journal-title":"RSC Adv."},{"key":"D3NJ05185D\/cit15\/1","doi-asserted-by":"crossref","first-page":"100451","DOI":"10.1016\/j.apmt.2019.100451","volume":"18","author":"Li","year":"2020","journal-title":"Appl. Mater. Today"},{"issue":"20","key":"D3NJ05185D\/cit16\/1","doi-asserted-by":"crossref","first-page":"1901002","DOI":"10.1002\/admi.201901002","volume":"6","author":"Choi","year":"2019","journal-title":"Adv. Mater. Interfaces"},{"key":"D3NJ05185D\/cit17\/1","doi-asserted-by":"crossref","first-page":"15098","DOI":"10.1039\/C9TC05463D","volume":"7","author":"Yang","year":"2019","journal-title":"J. Mater. Chem. C"},{"key":"D3NJ05185D\/cit18\/1","doi-asserted-by":"crossref","first-page":"1587","DOI":"10.1039\/C4CC08749F","volume":"51","author":"Farraj","year":"2015","journal-title":"Chem. Commun."},{"key":"D3NJ05185D\/cit19\/1","doi-asserted-by":"crossref","first-page":"3312","DOI":"10.1021\/am4036306","volume":"6","author":"Shin","year":"2014","journal-title":"ACS Appl. Mater. Interfaces"},{"key":"D3NJ05185D\/cit20\/1","doi-asserted-by":"crossref","first-page":"6530","DOI":"10.1016\/j.tsf.2011.04.112","volume":"519","author":"Yabuki","year":"2011","journal-title":"Thin Solid Films"},{"key":"D3NJ05185D\/cit21\/1","doi-asserted-by":"crossref","first-page":"6911","DOI":"10.1039\/C7NR08891D","volume":"10","author":"Paquet","year":"2018","journal-title":"Nanoscale"},{"key":"D3NJ05185D\/cit22\/1","doi-asserted-by":"crossref","first-page":"6530","DOI":"10.1016\/j.tsf.2011.04.112","volume":"519","author":"Yabuki","year":"2011","journal-title":"Thin Solid Films"},{"key":"D3NJ05185D\/cit23\/1","doi-asserted-by":"crossref","first-page":"12048","DOI":"10.1039\/C5RA25058G","volume":"6","author":"Yonezawa","year":"2016","journal-title":"RSC Adv."},{"key":"D3NJ05185D\/cit24\/1","doi-asserted-by":"crossref","first-page":"1901550","DOI":"10.1002\/admi.201901550","volume":"7","author":"Zhang","year":"2019","journal-title":"Adv. Mater. Interfaces"},{"key":"D3NJ05185D\/cit25\/1","author":"Mohan","unstructured":"N.Mohan ,  R.Saccon ,  S. K.Bhogaraju  and  G.Elger , 9. GMM-Workshop - Mikro-Nano-Integration, 2022"},{"key":"D3NJ05185D\/cit26\/1","doi-asserted-by":"crossref","first-page":"e0239034","DOI":"10.1371\/journal.pone.0239034","volume":"15","author":"Martinez de la Torre","year":"2020","journal-title":"PLoS One"},{"key":"D3NJ05185D\/cit27\/1","doi-asserted-by":"crossref","first-page":"2731","DOI":"10.1016\/j.tsf.2011.11.056","volume":"520","author":"Kim","year":"2012","journal-title":"Thin Solid Films"},{"key":"D3NJ05185D\/cit28\/1","doi-asserted-by":"crossref","first-page":"4113","DOI":"10.1021\/am303268k","volume":"5","author":"Wang","year":"2013","journal-title":"ACS Appl. Mater. Interfaces"},{"key":"D3NJ05185D\/cit29\/1","doi-asserted-by":"crossref","first-page":"4107","DOI":"10.1016\/j.materresbull.2012.08.052","volume":"47","author":"Yabuki","year":"2012","journal-title":"Mater. Res. Bull."},{"key":"D3NJ05185D\/cit30\/1","doi-asserted-by":"crossref","first-page":"1400448","DOI":"10.1002\/admi.201400448","volume":"2","author":"Rosen","year":"2015","journal-title":"Adv. Mater. Interfaces"},{"key":"D3NJ05185D\/cit31\/1","doi-asserted-by":"crossref","first-page":"82","DOI":"10.1021\/acs.langmuir.6b03668","volume":"33","author":"Xu","year":"2016","journal-title":"Langmuir"},{"key":"D3NJ05185D\/cit32\/1","doi-asserted-by":"crossref","first-page":"1701285","DOI":"10.1002\/admi.201701285","volume":"5","author":"Farraj","year":"2018","journal-title":"Adv. Mater. Interfaces"},{"key":"D3NJ05185D\/cit33\/1","doi-asserted-by":"crossref","first-page":"44071","DOI":"10.1021\/acsami.8b17164","volume":"10","author":"Kwon","year":"2018","journal-title":"ACS Appl. Mater. Interfaces"},{"key":"D3NJ05185D\/cit34\/1","doi-asserted-by":"crossref","first-page":"138248","DOI":"10.1016\/j.cplett.2020.138248","volume":"763","author":"Kang","year":"2021","journal-title":"Chem. Phys. Lett."},{"key":"D3NJ05185D\/cit35\/1","doi-asserted-by":"crossref","first-page":"114743","DOI":"10.1016\/j.mseb.2020.114743","volume":"262","author":"Yabuki","year":"2020","journal-title":"Mater. Sci. Eng., B"},{"key":"D3NJ05185D\/cit36\/1","doi-asserted-by":"crossref","first-page":"2218","DOI":"10.3390\/ma14092218","volume":"14","author":"Shabanov","year":"2021","journal-title":"Materials"},{"key":"D3NJ05185D\/cit37\/1","doi-asserted-by":"crossref","first-page":"1237","DOI":"10.1039\/C5NR07681A","volume":"8","author":"Wu","year":"2016","journal-title":"Nanoscale"},{"key":"D3NJ05185D\/cit38\/1","doi-asserted-by":"crossref","first-page":"5740","DOI":"10.1021\/la0635092","volume":"23","author":"Mott","year":"2007","journal-title":"Langmuir"},{"key":"D3NJ05185D\/cit39\/1","doi-asserted-by":"crossref","first-page":"3189","DOI":"10.1039\/C4NR06893A","volume":"7","author":"Ben Aissa","year":"2015","journal-title":"Nanoscale"},{"key":"D3NJ05185D\/cit40\/1","doi-asserted-by":"crossref","first-page":"3254","DOI":"10.1039\/C7CE00750G","volume":"19","author":"Wei","year":"2017","journal-title":"CrystEngComm"},{"key":"D3NJ05185D\/cit41\/1","doi-asserted-by":"crossref","first-page":"7740","DOI":"10.1039\/c1cc12346g","volume":"47","author":"Kawasaki","year":"2011","journal-title":"Chem. Commun."},{"key":"D3NJ05185D\/cit42\/1","unstructured":"FUJIFILM Dimatix Materials Printer DMP 2850 User Manual, 2016"},{"key":"D3NJ05185D\/cit43\/1","first-page":"295","author":"Guti\u00e9rrez","year":"2002","journal-title":"Surf. Thin Film Anal."},{"key":"D3NJ05185D\/cit44\/1","doi-asserted-by":"crossref","first-page":"57","DOI":"10.1016\/0022-2860(87)85022-6","volume":"162","author":"Heyns","year":"1987","journal-title":"J. Mol. Struct."},{"key":"D3NJ05185D\/cit45\/1","doi-asserted-by":"crossref","first-page":"3624","DOI":"10.1039\/c2jm15124c","volume":"22","author":"Choi","year":"2012","journal-title":"J. Mater. Chem."},{"key":"D3NJ05185D\/cit46\/1","doi-asserted-by":"crossref","first-page":"6406","DOI":"10.1039\/C8TC01849A","volume":"6","author":"Dong","year":"2018","journal-title":"J. Mater. Chem. C"},{"key":"D3NJ05185D\/cit47\/1","doi-asserted-by":"crossref","first-page":"1467","DOI":"10.1039\/tf9716701467","volume":"67","author":"Fichte","year":"1971","journal-title":"Trans. Faraday Soc."},{"key":"D3NJ05185D\/cit48\/1","doi-asserted-by":"crossref","first-page":"181","DOI":"10.1016\/S0040-6031(00)00448-2","volume":"355","author":"Galwey","year":"2000","journal-title":"Thermochim. Acta"},{"key":"D3NJ05185D\/cit49\/1","doi-asserted-by":"crossref","first-page":"1420","DOI":"10.1002\/cphc.201900095","volume":"20","author":"Pascher","year":"2019","journal-title":"ChemPhysChem"},{"key":"D3NJ05185D\/cit50\/1","doi-asserted-by":"crossref","first-page":"2605","DOI":"10.1039\/C5CC07737K","volume":"52","author":"Paquet","year":"2016","journal-title":"Chem. Commun."},{"key":"D3NJ05185D\/cit51\/1","doi-asserted-by":"crossref","first-page":"33039","DOI":"10.1021\/acsami.0c08645","volume":"12","author":"Shin","year":"2020","journal-title":"ACS Appl. Mater. Interfaces"},{"key":"D3NJ05185D\/cit52\/1","doi-asserted-by":"crossref","first-page":"102162","DOI":"10.1016\/j.cis.2020.102162","volume":"279","author":"Shrestha","year":"2020","journal-title":"Adv. Colloid Interface Sci."},{"key":"D3NJ05185D\/cit53\/1","doi-asserted-by":"crossref","first-page":"2490","DOI":"10.1016\/j.jmrt.2023.10.080","volume":"27","author":"Liu","year":"2023","journal-title":"J. Mater. Res. Technol."},{"key":"D3NJ05185D\/cit54\/1","doi-asserted-by":"crossref","first-page":"905","DOI":"10.1016\/j.jeurceramsoc.2008.07.040","volume":"29","author":"Lejeune","year":"2009","journal-title":"J. Eur. Ceram. Soc."},{"key":"D3NJ05185D\/cit55\/1","doi-asserted-by":"crossref","first-page":"147","DOI":"10.1007\/BF00515199","volume":"8","author":"Tanaka","year":"1987","journal-title":"Int. J. Thermophys."},{"key":"D3NJ05185D\/cit56\/1","doi-asserted-by":"crossref","first-page":"035016","DOI":"10.1088\/0960-1317\/22\/3\/035016","volume":"22","author":"Kim","year":"2012","journal-title":"J. Micromech. Microeng."},{"key":"D3NJ05185D\/cit57\/1","doi-asserted-by":"crossref","first-page":"8101","DOI":"10.1021\/acs.langmuir.5b01207","volume":"31","author":"Choi","year":"2015","journal-title":"Langmuir"},{"key":"D3NJ05185D\/cit58\/1","doi-asserted-by":"crossref","first-page":"10126","DOI":"10.1021\/jp101345n","volume":"114","author":"Sun","year":"2010","journal-title":"J. Phys. Chem. C"},{"key":"D3NJ05185D\/cit59\/1","doi-asserted-by":"crossref","DOI":"10.1142\/p305","volume-title":"Nanostructures and nanomaterials \u2013 synthesis, properties and applications","author":"Cao","year":"2004","unstructured":"G.Cao ,  Nanostructures and nanomaterials \u2013 synthesis, properties and applications ,  2004"}],"container-title":["New Journal of Chemistry"],"original-title":[],"language":"en","link":[{"URL":"http:\/\/pubs.rsc.org\/en\/content\/articlepdf\/2024\/NJ\/D3NJ05185D","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,4,15]],"date-time":"2024-04-15T15:55:49Z","timestamp":1713196549000},"score":1,"resource":{"primary":{"URL":"https:\/\/xlink.rsc.org\/?DOI=D3NJ05185D"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024]]},"references-count":59,"journal-issue":{"issue":"15","published-print":{"date-parts":[[2024,4,15]]}},"URL":"http:\/\/dx.doi.org\/10.1039\/d3nj05185d","relation":{},"ISSN":["1144-0546","1369-9261"],"issn-type":[{"value":"1144-0546","type":"print"},{"value":"1369-9261","type":"electronic"}],"subject":["Materials Chemistry","General Chemistry","Catalysis"],"published":{"date-parts":[[2024]]}}}</enrichment>
    <enrichment key="local_crossrefDocumentType">journal-article</enrichment>
    <enrichment key="local_crossrefLicence">http://rsc.li/journals-terms-of-use</enrichment>
    <enrichment key="local_import_origin">crossref</enrichment>
    <enrichment key="local_doiImportPopulated">SubjectUncontrolled_1,SubjectUncontrolled_2,SubjectUncontrolled_3,PersonAuthorFirstName_1,PersonAuthorLastName_1,PersonAuthorIdentifierOrcid_1,PersonAuthorFirstName_2,PersonAuthorLastName_2,PersonAuthorIdentifierOrcid_2,PersonAuthorFirstName_3,PersonAuthorLastName_3,PersonAuthorIdentifierOrcid_3,PersonAuthorFirstName_4,PersonAuthorLastName_4,PersonAuthorFirstName_5,PersonAuthorLastName_5,PersonAuthorIdentifierOrcid_5,PersonAuthorFirstName_6,PersonAuthorLastName_6,PersonAuthorFirstName_7,PersonAuthorLastName_7,PersonAuthorIdentifierOrcid_7,PublisherName,TitleMain_1,Language,TitleAbstract_1,TitleParent_1,PageNumber,PageFirst,PageLast,Issue,Volume,CompletedYear,IdentifierIssn,Enrichmentlocal_crossrefLicence</enrichment>
    <enrichment key="opus.source">doi-import</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <enrichment key="THI_articleversion">published</enrichment>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.1039/D3NJ05185D</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <author>
      <first_name>Nihesh</first_name>
      <last_name>Mohan</last_name>
    </author>
    <author>
      <first_name>Juan Ignacio</first_name>
      <last_name>Ahuir-Torres</last_name>
    </author>
    <author>
      <first_name>Sri Krishna</first_name>
      <last_name>Bhogaraju</last_name>
    </author>
    <author>
      <first_name>Ralf</first_name>
      <last_name>Webler</last_name>
    </author>
    <author>
      <first_name>Hiren R.</first_name>
      <last_name>Kotadia</last_name>
    </author>
    <author>
      <first_name>Hüseyin</first_name>
      <last_name>Erdogan</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <collection role="institutes" number="19311">Fakultät Elektro- und Informationstechnik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
  </doc>
  <doc>
    <id>4566</id>
    <completedYear/>
    <publishedYear>2024</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>7</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <articleNumber/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace>Piscataway</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Rapid Sintering of Inkjet Printed Cu Complex Inks Using Laser in Air</title>
    <parentTitle language="eng">2023 24th European Microelectronics and Packaging Conference &amp; Exhibition (EMPC)</parentTitle>
    <identifier type="isbn">978-0-9568086-9-1</identifier>
    <enrichment key="opus_doi_flag">true</enrichment>
    <enrichment key="opus_import_data">{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,2,11]],"date-time":"2024-02-11T12:34:58Z","timestamp":1707654898926},"reference-count":0,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,9,11]],"date-time":"2023-09-11T00:00:00Z","timestamp":1694390400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,9,11]],"date-time":"2023-09-11T00:00:00Z","timestamp":1694390400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,9,11]]},"DOI":"10.23919\/empc55870.2023.10418323","type":"proceedings-article","created":{"date-parts":[[2024,2,9]],"date-time":"2024-02-09T18:22:32Z","timestamp":1707502952000},"source":"Crossref","is-referenced-by-count":0,"title":["Rapid Sintering of Inkjet Printed Cu Complex Inks Using Laser in Air"],"prefix":"10.23919","author":[{"given":"Nihesh","family":"Mohan","sequence":"first","affiliation":[{"name":"Institute of Innovative Mobility (IIMo),Technische Hochschule Ingolstadt,Ingolstadt,Germany"}]},{"given":"Juan Ignacio","family":"Ahuir-Torres","sequence":"additional","affiliation":[{"name":"School of Engineering, Liverpool John Moores University,Liverpool,United Kingdom"}]},{"given":"Sri Krishna","family":"Bhogaraju","sequence":"additional","affiliation":[{"name":"Institute of Innovative Mobility (IIMo),Technische Hochschule Ingolstadt,Ingolstadt,Germany"}]},{"given":"Hiren","family":"Kotadia","sequence":"additional","affiliation":[{"name":"School of Engineering, Liverpool John Moores University,Liverpool,United Kingdom"}]},{"given":"Gordon","family":"Elger","sequence":"additional","affiliation":[{"name":"Institute of Innovative Mobility (IIMo),Technische Hochschule Ingolstadt,Ingolstadt,Germany"}]}],"member":"263","event":{"name":"2023 24th European Microelectronics and Packaging Conference &amp; Exhibition (EMPC)","location":"Cambridge, United Kingdom","start":{"date-parts":[[2023,9,11]]},"end":{"date-parts":[[2023,9,14]]}},"container-title":["2023 24th European Microelectronics and Packaging Conference &amp;amp; Exhibition (EMPC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10418252\/10418244\/10418323.pdf?arnumber=10418323","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,2,9]],"date-time":"2024-02-09T18:23:04Z","timestamp":1707502984000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10418323\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,9,11]]},"references-count":0,"URL":"http:\/\/dx.doi.org\/10.23919\/empc55870.2023.10418323","relation":{},"published":{"date-parts":[[2023,9,11]]}}}</enrichment>
    <enrichment key="local_crossrefDocumentType">proceedings-article</enrichment>
    <enrichment key="local_crossrefLicence">https://doi.org/10.15223/policy-029</enrichment>
    <enrichment key="local_import_origin">crossref</enrichment>
    <enrichment key="local_doiImportPopulated">PersonAuthorFirstName_1,PersonAuthorLastName_1,PersonAuthorFirstName_2,PersonAuthorLastName_2,PersonAuthorFirstName_3,PersonAuthorLastName_3,PersonAuthorFirstName_4,PersonAuthorLastName_4,PersonAuthorFirstName_5,PersonAuthorLastName_5,Enrichmentconference_title,Enrichmentconference_place,PublisherName,TitleMain_1,TitleParent_1,CompletedYear,Enrichmentlocal_crossrefLicence</enrichment>
    <enrichment key="conference_title">2023 24th European Microelectronics and Packaging Conference &amp; Exhibition (EMPC)</enrichment>
    <enrichment key="conference_place">Cambridge, United Kingdom</enrichment>
    <enrichment key="opus.source">doi-import</enrichment>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.23919/EMPC55870.2023.10418323</enrichment>
    <enrichment key="THI_conferenceName">24th European Microelectronics Packaging Conference (EMPC 2023), Cambridge (UK), 11.-14.09.2023</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <author>
      <first_name>Nihesh</first_name>
      <last_name>Mohan</last_name>
    </author>
    <author>
      <first_name>Juan Ignacio</first_name>
      <last_name>Ahuir-Torres</last_name>
    </author>
    <author>
      <first_name>Sri Krishna</first_name>
      <last_name>Bhogaraju</last_name>
    </author>
    <author>
      <first_name>Hiren R.</first_name>
      <last_name>Kotadia</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <collection role="institutes" number="19311">Fakultät Elektro- und Informationstechnik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
  </doc>
  <doc>
    <id>4570</id>
    <completedYear/>
    <publishedYear>2024</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>5</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <articleNumber/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace>Piscataway</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Understanding Cu Sintering and Its Role on Corrosion Behaviour for High-Temperature Microelectronic Application</title>
    <parentTitle language="eng">2023 24th European Microelectronics and Packaging Conference &amp; Exhibition (EMPC)</parentTitle>
    <identifier type="isbn">978-0-9568086-9-1</identifier>
    <enrichment key="opus_doi_flag">true</enrichment>
    <enrichment key="opus_import_data">{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,2,11]],"date-time":"2024-02-11T11:07:58Z","timestamp":1707649678174},"reference-count":0,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,9,11]],"date-time":"2023-09-11T00:00:00Z","timestamp":1694390400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,9,11]],"date-time":"2023-09-11T00:00:00Z","timestamp":1694390400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,9,11]]},"DOI":"10.23919\/empc55870.2023.10418365","type":"proceedings-article","created":{"date-parts":[[2024,2,9]],"date-time":"2024-02-09T18:22:32Z","timestamp":1707502952000},"source":"Crossref","is-referenced-by-count":0,"title":["Understanding Cu Sintering and Its Role on Corrosion Behaviour for High-Temperature Microelectronic Application"],"prefix":"10.23919","author":[{"given":"Juan Ignacio","family":"Ahuir-Torres","sequence":"first","affiliation":[{"name":"School of Engineering, Liverpool John Moores University,Liverpool,UK,L3 3AF"}]},{"given":"Sri Krishna","family":"Bhogaraju","sequence":"additional","affiliation":[{"name":"Institute of Innovative Mobility,Technische Hochschule Ingolstadt,Ingolstadt,Germany,85049"}]},{"given":"Geoff","family":"West","sequence":"additional","affiliation":[{"name":"The University of Warwick,WMG,Coventry,UK,CV4 7AL"}]},{"given":"Gordon","family":"Elger","sequence":"additional","affiliation":[{"name":"Institute of Innovative Mobility, Technische Hochschule Ingolstadt,Ingolstadt,Germany,85049"}]},{"given":"Hiren R.","family":"Kotadia","sequence":"additional","affiliation":[{"name":"School of Engineering, Liverpool John Moores University,Liverpool,UK,L3 3AF"}]}],"member":"263","event":{"name":"2023 24th European Microelectronics and Packaging Conference &amp; Exhibition (EMPC)","location":"Cambridge, United Kingdom","start":{"date-parts":[[2023,9,11]]},"end":{"date-parts":[[2023,9,14]]}},"container-title":["2023 24th European Microelectronics and Packaging Conference &amp;amp; Exhibition (EMPC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10418252\/10418244\/10418365.pdf?arnumber=10418365","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,2,9]],"date-time":"2024-02-09T18:22:52Z","timestamp":1707502972000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10418365\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,9,11]]},"references-count":0,"URL":"http:\/\/dx.doi.org\/10.23919\/empc55870.2023.10418365","relation":{},"published":{"date-parts":[[2023,9,11]]}}}</enrichment>
    <enrichment key="local_crossrefDocumentType">proceedings-article</enrichment>
    <enrichment key="local_crossrefLicence">https://doi.org/10.15223/policy-029</enrichment>
    <enrichment key="local_import_origin">crossref</enrichment>
    <enrichment key="local_doiImportPopulated">PersonAuthorFirstName_1,PersonAuthorLastName_1,PersonAuthorFirstName_2,PersonAuthorLastName_2,PersonAuthorFirstName_3,PersonAuthorLastName_3,PersonAuthorFirstName_4,PersonAuthorLastName_4,PersonAuthorFirstName_5,PersonAuthorLastName_5,Enrichmentconference_title,Enrichmentconference_place,PublisherName,TitleMain_1,TitleParent_1,CompletedYear,Enrichmentlocal_crossrefLicence</enrichment>
    <enrichment key="conference_title">2023 24th European Microelectronics and Packaging Conference &amp; Exhibition (EMPC)</enrichment>
    <enrichment key="conference_place">Cambridge, United Kingdom</enrichment>
    <enrichment key="opus.source">doi-import</enrichment>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.23919/EMPC55870.2023.10418365</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <enrichment key="THI_conferenceName">24th European Microelectronics Packaging Conference (EMPC 2023), Cambridge (UK), 11.-14.09.2023</enrichment>
    <enrichment key="opus.doi.autoCreate">false</enrichment>
    <enrichment key="opus.urn.autoCreate">true</enrichment>
    <author>
      <first_name>Juan Ignacio</first_name>
      <last_name>Ahuir-Torres</last_name>
    </author>
    <author>
      <first_name>Sri Krishna</first_name>
      <last_name>Bhogaraju</last_name>
    </author>
    <author>
      <first_name>Geoff</first_name>
      <last_name>West</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <author>
      <first_name>Hiren R.</first_name>
      <last_name>Kotadia</last_name>
    </author>
    <collection role="institutes" number="19311">Fakultät Elektro- und Informationstechnik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
  </doc>
</export-example>
