<?xml version="1.0" encoding="utf-8"?>
<export-example>
  <doc>
    <id>3381</id>
    <completedYear>2023</completedYear>
    <publishedYear>2022</publishedYear>
    <thesisYearAccepted/>
    <language>deu</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>97</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <articleNumber/>
    <type>bachelorthesis</type>
    <publisherName/>
    <publisherPlace>Ingolstadt</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>2023-04-03</completedDate>
    <publishedDate>2022-02-16</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="deu">Korrelation der mittels Akustikmikroskopie und Transient Thermischer Analyse detektierten Rissbildung in Lötverbindungen mit Finite-Element Simulation</title>
    <abstract language="deu">Ausschlaggebend für die Lebensdauer von High-Power LEDs ist meist die Lötverbindung. Um eine möglichst gute Kühlung von High-Power LEDs zu ermöglichen, werden diese meist auf Aluminiumleiterplatten gelötet. Hierdurch bildet sich eine Diskrepanz der Wärmeausdehnungskoeffizienten der LED sowie der Aluminiumleiterplatte, was bei Erwärmung des Aufbaus zu mechanischen Spannungen in der Lötverbindung führt. Durch wiederholtes Erwärmen und Abkühlen der Baugruppe entstehen so mit der Zeit Risse im Lot, was eine höhere Betriebstemperatur, und somit auch verkürzten Lebensdauer, schlechteren Wirkungsgrad und Farbdrift der LED zur Folge hat. Um ein besseres Verständnis der Auswirkungen dieser Risse in der Lötverbindung auf das thermische Verhalten der LED zu erlangen, wurde in dieser Arbeit, auf Basis von transient thermischen Messdaten, ein thermisches FE-Modell (Finite Element Modell) einer High Power LED erstellt. Mittels Parameteranpassung des Modells konnte ein CoD (Bestimmtheitsmaß) zwischen dem Modell und den Messdaten von 0.9999 erreicht werden. Dieses angepasste Modell ermöglichte es anschließend Untersuchungen bezüglich des thermischen Verhaltens während der Rissbildung durchzuführen. Hierbei galt es insbesondere gemessene thermische Daten in LEDs mit Rissen im Lot mit Daten der Akustikmikroskopie zu vergleichen. Aus weiteren Analysen anhand des erstellten Modells ergab sich, dass das thermische Pad der LED wichtiger für die Kühlung der LED ist, als durch seine Fläche zu vermuten wäre. Es konnte auch gezeigt werden, dass es im Rahmen der Simulation möglich ist, anhand von TTA (Transienter Thermischer Analyse) die Region der Rissbildung zu bestimmen. Dieses Ergebnis der Simulation konnte auch mit Mess- Und Analysedaten verifiziert werden.</abstract>
    <identifier type="urn">urn:nbn:de:bvb:573-33810</identifier>
    <enrichment key="opus.import.date">2023-04-03T12:48:47+00:00</enrichment>
    <enrichment key="opus.source">sword</enrichment>
    <enrichment key="opus.import.user">primuss</enrichment>
    <enrichment key="opus.doi.autoCreate">false</enrichment>
    <enrichment key="opus.urn.autoCreate">true</enrichment>
    <licence>Urheberrechtsschutz</licence>
    <advisor>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </advisor>
    <author>
      <first_name>Joseph</first_name>
      <last_name>Hermann</last_name>
    </author>
    <advisor>
      <first_name>Robert</first_name>
      <last_name>Hermann</last_name>
    </advisor>
    <collection role="institutes" number="19311">Fakultät Elektro- und Informationstechnik</collection>
    <collection role="degree_programme" number="19344">Elektrotechnik und Elektromobilität (B. Eng.)</collection>
    <collection role="Import" number="deepgreen">DeepGreen</collection>
    <thesisPublisher>Technische Hochschule Ingolstadt</thesisPublisher>
    <thesisGrantor>Technische Hochschule Ingolstadt</thesisGrantor>
    <file>https://opus4.kobv.de/opus4-haw/files/3381/I001074533Abschlussarbeit.pdf</file>
  </doc>
  <doc>
    <id>2949</id>
    <completedYear/>
    <publishedYear>2022</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>6</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <articleNumber/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace>Piscataway</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>2022-11-10</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Correlation of Scanning Acoustic Microscopy and Transient Thermal Analysis to Identify Crack Growth in Solder Joints</title>
    <parentTitle language="eng">Proceedings of the Twenty First InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems: ITherm 2022</parentTitle>
    <identifier type="isbn">978-1-6654-8503-6</identifier>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.1109/iTherm54085.2022.9899664</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <enrichment key="THI_conferenceName">2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), San Diego (USA), 31.05. - 03.06.2022</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <author>
      <first_name>Maximilian</first_name>
      <last_name>Schmid</last_name>
    </author>
    <author>
      <first_name>Joseph</first_name>
      <last_name>Hermann</last_name>
    </author>
    <author>
      <first_name>E</first_name>
      <last_name>Liu</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>reliability</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>transient thermal analysis (TTA)</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>scanning acoustic microscopy (SAM)</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>finite element simulation</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>finite element optimization</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>LED</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>solder</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>crack</value>
    </subject>
    <collection role="institutes" number="19311">Fakultät Elektro- und Informationstechnik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
    <collection role="persons" number="26880">Schmid, Maximilian</collection>
  </doc>
  <doc>
    <id>2965</id>
    <completedYear/>
    <publishedYear>2022</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>566</pageFirst>
    <pageLast>575</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <articleNumber/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace>Piscataway</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>2022-11-15</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Predicting thermal resistance of solder joints based on Scanning Acoustic Microscopy using Artificial Neural Networks</title>
    <parentTitle language="eng">2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)</parentTitle>
    <identifier type="isbn">978-1-6654-8947-8</identifier>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.1109/ESTC55720.2022.9939465</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <enrichment key="THI_conferenceName">2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), Sibiu (Romania), 13.-16.09.2022</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <author>
      <first_name>Andreas</first_name>
      <last_name>Zippelius</last_name>
    </author>
    <author>
      <first_name>Tobias</first_name>
      <last_name>Strobl</last_name>
    </author>
    <author>
      <first_name>Maximilian</first_name>
      <last_name>Schmid</last_name>
    </author>
    <author>
      <first_name>Joseph</first_name>
      <last_name>Hermann</last_name>
    </author>
    <author>
      <first_name>Alwin</first_name>
      <last_name>Hoffmann</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Solder Joints</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>LED</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>non-destructive testing</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Machine Learning</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Scanning Acoustic Microscopy (SAM)</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Transient Thermal Analysis (TTA), Convolutional Neural Network (CNN)</value>
    </subject>
    <collection role="institutes" number="19311">Fakultät Elektro- und Informationstechnik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
    <collection role="institutes" number="19569">Fraunhofer-Anwendungszentrum "Vernetzte Mobilität und Infrastruktur"</collection>
    <collection role="persons" number="26880">Schmid, Maximilian</collection>
  </doc>
  <doc>
    <id>2966</id>
    <completedYear/>
    <publishedYear>2022</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>553</pageFirst>
    <pageLast>559</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <articleNumber/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace>Piscataway</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>2022-11-15</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Reliability of SAC Solders under Low and High Stress Conditions</title>
    <parentTitle language="eng">2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)</parentTitle>
    <identifier type="isbn">978-1-6654-8947-8</identifier>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.1109/ESTC55720.2022.9939394</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <enrichment key="THI_conferenceName">2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), Sibiu (Romania), 13.-16.09.2022</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <author>
      <first_name>Maximilian</first_name>
      <last_name>Schmid</last_name>
    </author>
    <author>
      <first_name>Joseph</first_name>
      <last_name>Hermann</last_name>
    </author>
    <author>
      <first_name>Sri Krishna</first_name>
      <last_name>Bhogaraju</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>reliability</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>solder joint cracking</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>SAC solder</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>transient thermal analysis</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>SAM</value>
    </subject>
    <collection role="institutes" number="19311">Fakultät Elektro- und Informationstechnik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
    <collection role="institutes" number="19569">Fraunhofer-Anwendungszentrum "Vernetzte Mobilität und Infrastruktur"</collection>
    <collection role="persons" number="26880">Schmid, Maximilian</collection>
  </doc>
  <doc>
    <id>3038</id>
    <completedYear/>
    <publishedYear>2022</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>6</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <articleNumber/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace>Piscataway</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>2022-12-23</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Crack Growth Prediction in High-Power LEDs from TTA, SAM and Simulated Data</title>
    <parentTitle language="eng">THERMINIC 2022: Proceedings 2022</parentTitle>
    <identifier type="isbn">978-1-6654-9229-4</identifier>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.1109/THERMINIC57263.2022.9950673</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <enrichment key="THI_conferenceName">2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Dublin (Ireland), 28.-30.09.2022</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <author>
      <first_name>Joseph</first_name>
      <last_name>Hermann</last_name>
    </author>
    <author>
      <first_name>Maximilian</first_name>
      <last_name>Schmid</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>reliability</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>transient thermal analysis (TTA)</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>scanning acoustic microscopy (SAM)</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>finite element simulation</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>LED</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>solder</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>crack</value>
    </subject>
    <collection role="institutes" number="19311">Fakultät Elektro- und Informationstechnik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
    <collection role="institutes" number="19569">Fraunhofer-Anwendungszentrum "Vernetzte Mobilität und Infrastruktur"</collection>
    <collection role="persons" number="26880">Schmid, Maximilian</collection>
  </doc>
</export-example>
