<?xml version="1.0" encoding="utf-8"?>
<export-example>
  <doc>
    <id>4568</id>
    <completedYear/>
    <publishedYear>2024</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>5</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <articleNumber/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace>Piscataway</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Reliability of Copper Sintered Interconnects Under Extreme Thermal Shock Conditions</title>
    <parentTitle language="eng">2023 24th European Microelectronics and Packaging Conference &amp; Exhibition (EMPC)</parentTitle>
    <identifier type="isbn">978-0-9568086-9-1</identifier>
    <enrichment key="opus_doi_flag">true</enrichment>
    <enrichment key="opus_import_data">{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,2,11]],"date-time":"2024-02-11T12:32:59Z","timestamp":1707654779962},"reference-count":0,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,9,11]],"date-time":"2023-09-11T00:00:00Z","timestamp":1694390400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,9,11]],"date-time":"2023-09-11T00:00:00Z","timestamp":1694390400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,9,11]]},"DOI":"10.23919\/empc55870.2023.10418348","type":"proceedings-article","created":{"date-parts":[[2024,2,9]],"date-time":"2024-02-09T18:22:32Z","timestamp":1707502952000},"source":"Crossref","is-referenced-by-count":0,"title":["Reliability of Copper Sintered Interconnects Under Extreme Thermal Shock Conditions"],"prefix":"10.23919","author":[{"given":"Sri Krishna","family":"Bhogaraju","sequence":"first","affiliation":[{"name":"Institute of Innovative Mobility, Technische Hochschule Ingolstadt,Ingolstadt,Germany,85049"}]},{"given":"Francesco","family":"Ugolini","sequence":"additional","affiliation":[{"name":"AMX Automatrix srl,Gavardo,BS,Italy,25085"}]},{"given":"Federico","family":"Belponer","sequence":"additional","affiliation":[{"name":"AMX Automatrix srl,Gavardo,BS,Italy,25085"}]},{"given":"Alessio","family":"Greci","sequence":"additional","affiliation":[{"name":"AMX Automatrix srl,Gavardo,BS,Italy,25085"}]},{"given":"Gordon","family":"Elger","sequence":"additional","affiliation":[{"name":"Institute of Innovative Mobility, Technische Hochschule Ingolstadt,Ingolstadt,Germany,85049"}]}],"member":"263","event":{"name":"2023 24th European Microelectronics and Packaging Conference &amp; Exhibition (EMPC)","location":"Cambridge, United Kingdom","start":{"date-parts":[[2023,9,11]]},"end":{"date-parts":[[2023,9,14]]}},"container-title":["2023 24th European Microelectronics and Packaging Conference &amp;amp; Exhibition (EMPC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10418252\/10418244\/10418348.pdf?arnumber=10418348","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,2,9]],"date-time":"2024-02-09T18:22:37Z","timestamp":1707502957000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10418348\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,9,11]]},"references-count":0,"URL":"http:\/\/dx.doi.org\/10.23919\/empc55870.2023.10418348","relation":{},"published":{"date-parts":[[2023,9,11]]}}}</enrichment>
    <enrichment key="local_crossrefDocumentType">proceedings-article</enrichment>
    <enrichment key="local_crossrefLicence">https://doi.org/10.15223/policy-029</enrichment>
    <enrichment key="local_import_origin">crossref</enrichment>
    <enrichment key="local_doiImportPopulated">PersonAuthorFirstName_1,PersonAuthorLastName_1,PersonAuthorFirstName_2,PersonAuthorLastName_2,PersonAuthorFirstName_3,PersonAuthorLastName_3,PersonAuthorFirstName_4,PersonAuthorLastName_4,PersonAuthorFirstName_5,PersonAuthorLastName_5,Enrichmentconference_title,Enrichmentconference_place,PublisherName,TitleMain_1,TitleParent_1,CompletedYear,Enrichmentlocal_crossrefLicence</enrichment>
    <enrichment key="conference_title">2023 24th European Microelectronics and Packaging Conference &amp; Exhibition (EMPC)</enrichment>
    <enrichment key="conference_place">Cambridge, United Kingdom</enrichment>
    <enrichment key="opus.source">doi-import</enrichment>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.23919/EMPC55870.2023.10418348</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <enrichment key="THI_conferenceName">24th European Microelectronics Packaging Conference (EMPC 2023), Cambridge (UK), 11.-14.09.2023</enrichment>
    <enrichment key="opus.doi.autoCreate">false</enrichment>
    <enrichment key="opus.urn.autoCreate">true</enrichment>
    <author>
      <first_name>Sri Krishna</first_name>
      <last_name>Bhogaraju</last_name>
    </author>
    <author>
      <first_name>Francesco</first_name>
      <last_name>Ugolini</last_name>
    </author>
    <author>
      <first_name>Federico</first_name>
      <last_name>Belponer</last_name>
    </author>
    <author>
      <first_name>Alessio</first_name>
      <last_name>Greci</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <collection role="institutes" number="19311">Fakultät Elektro- und Informationstechnik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
  </doc>
</export-example>
