<?xml version="1.0" encoding="utf-8"?>
<export-example>
  <doc>
    <id>943</id>
    <completedYear>2020</completedYear>
    <publishedYear>2020</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>2083</pageFirst>
    <pageLast>2094</pageLast>
    <pageNumber/>
    <edition/>
    <issue>10</issue>
    <volume>51</volume>
    <articleNumber/>
    <type>article</type>
    <publisherName>Wiley</publisherName>
    <publisherPlace>Chichester</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>2020-07-27</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Thermomechanical stress in GaN-LEDs soldered onto Cu substrates studied using finite element method and Raman spectroscopy</title>
    <abstract language="eng">Local thermomechanical stress can cause failures in semiconductor packages during long-time operation under harsh environmental conditions. This study helps to explain the packaging-induced stress in blue GaN-LEDs soldered onto copper substrates using AuSn alloy as lead-free interconnect material. Based on the finite element method, a virtual prototype is developed to simulate the thermomechanical behavior and stress in the LED and in the complete LED/AuSn/Cu assembly considering plastic and viscoplastic strain. The investigations were performed by varying the temperature between −50°C and 180°C. To validate the model, the simulation results are compared to experimental data collected with Raman spectroscopy. Studies of the urn:x-wiley:03770486:media:jrs5947:jrs5947-math-0003 phonon mode of GaN semiconductor are elaborated to understand the induced thermomechanical stress. The model enables evaluation of the stress in the interfaces of the assembly, which otherwise cannot be accessed by measurements. It serves to predict how assemblies would perform, before committing resources to build a physical prototype.</abstract>
    <parentTitle language="eng">Journal of Raman Spectroscopy</parentTitle>
    <identifier type="issn">1097-4555</identifier>
    <identifier type="urn">urn:nbn:de:bvb:573-9438</identifier>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.1002/jrs.5947</enrichment>
    <enrichment key="THI_articleversion">published</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <licence>Creative Commons BY 4.0</licence>
    <author>
      <first_name>E</first_name>
      <last_name>Liu</last_name>
    </author>
    <author>
      <first_name>Fosca</first_name>
      <last_name>Conti</last_name>
    </author>
    <author>
      <first_name>Sri Krishna</first_name>
      <last_name>Bhogaraju</last_name>
    </author>
    <author>
      <first_name>Raffaella</first_name>
      <last_name>Signorini</last_name>
    </author>
    <author>
      <first_name>Danilo</first_name>
      <last_name>Pedron</last_name>
    </author>
    <author>
      <first_name>Bernhard</first_name>
      <last_name>Wunderle</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>finite element method</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>gallium nitride (GaN)</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>LED</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>semiconductor</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>thermomechanical stress</value>
    </subject>
    <collection role="open_access" number="">open_access</collection>
    <collection role="institutes" number="19311">Fakultät Elektro- und Informationstechnik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
    <thesisPublisher>Technische Hochschule Ingolstadt</thesisPublisher>
    <file>https://opus4.kobv.de/opus4-haw/files/943/jrs.5947.pdf</file>
  </doc>
  <doc>
    <id>1322</id>
    <completedYear/>
    <publishedYear>2021</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>5</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <articleNumber/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace>Piscataway</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>2022-02-21</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Simulations and experiments to analyze stress phenomena in soldered and sintered interconnections between silicon nitride chips and copper substrates</title>
    <parentTitle language="eng">2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</parentTitle>
    <identifier type="isbn">978-1-6654-1373-2</identifier>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.1109/EuroSimE52062.2021.9410869</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <enrichment key="THI_conferenceName">2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), St. Julian (Malta), 19.-21.04.2021</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <author>
      <first_name>E</first_name>
      <last_name>Liu</last_name>
    </author>
    <author>
      <first_name>Fosca</first_name>
      <last_name>Conti</last_name>
    </author>
    <author>
      <first_name>Sri Krishna</first_name>
      <last_name>Bhogaraju</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Performance evaluation</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Analytical models</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Compressive stress</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Thermomechanical processes</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Data models</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Microelectronics</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Finite element analysis</value>
    </subject>
    <collection role="institutes" number="19311">Fakultät Elektro- und Informationstechnik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
  </doc>
  <doc>
    <id>1251</id>
    <completedYear/>
    <publishedYear>2020</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>19</pageNumber>
    <edition/>
    <issue>23</issue>
    <volume>10</volume>
    <articleNumber>8516</articleNumber>
    <type>article</type>
    <publisherName>MDPI</publisherName>
    <publisherPlace>Basel</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>2022-02-15</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Comparison of Nondestructive Testing Methods for Solder, Sinter, and Adhesive Interconnects in Power and Opto-Electronics</title>
    <abstract language="eng">Reliability is one of the major requirements for power and opto-electronic devices across all segments. High operation temperature and/or high thermomechanical stress cause defects and degradation of materials and interconnects, which may lead to malfunctions with costly or even life-threatening consequences. To avoid or at least reduce failures, nondestructive testing (NDT) methods are common within development and production of power and opto-electronics. Currently, the dominating NDT methods are X-ray, scanning acoustic microscopy (SAM), and transient thermal analysis (TTA). However, they have different strengths and weaknesses with respect to materials and mechanical designs. This paper compares these NDT methods for different interconnect technologies, i.e., reflow soldering, adhesive, and sintered interconnection. While X-ray provided adequate results for soldered interfaces, inspection of adhesives and sintered interconnects was not possible. With SAM, evaluation of adhesives and sintered interconnects was also feasible, but quality depended strongly on the sample under test. TTA enabled sufficiently detailed results for all the interconnect applications. Automated TTA equipment, as the in-house developed tester used within this investigation, enabled measurement times compatible with SAM and X-ray. In the investigations, all methods revealed their pros and cons, and their selection has to depend on the sample under tests and the required analysis depth and data details. In the paper, guidelines are formulated for an appropriate decision on the NDT method depending on sample and requirements.</abstract>
    <parentTitle language="eng">Applied Sciences</parentTitle>
    <identifier type="issn">2076-3417</identifier>
    <identifier type="urn">urn:nbn:de:bvb:573-12518</identifier>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.3390/app10238516</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <enrichment key="THI_openaccess">ja</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="THI_articleversion">published</enrichment>
    <licence>Creative Commons BY 4.0</licence>
    <author>
      <first_name>Maximilian</first_name>
      <last_name>Schmid</last_name>
    </author>
    <author>
      <first_name>Sri Krishna</first_name>
      <last_name>Bhogaraju</last_name>
    </author>
    <author>
      <first_name>E</first_name>
      <last_name>Liu</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>reliability</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>nondestructive testing</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>power electronics</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>X-ray</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>scanning acoustic microscopy</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>transient thermal analysis</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>TTA</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>sintering</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>LED</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>MOSFET</value>
    </subject>
    <collection role="open_access" number="">open_access</collection>
    <collection role="institutes" number="19311">Fakultät Elektro- und Informationstechnik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
    <collection role="persons" number="26880">Schmid, Maximilian</collection>
    <thesisPublisher>Technische Hochschule Ingolstadt</thesisPublisher>
    <file>https://opus4.kobv.de/opus4-haw/files/1251/applsci-10-08516.pdf</file>
  </doc>
  <doc>
    <id>1327</id>
    <completedYear/>
    <publishedYear>2021</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>10</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <articleNumber/>
    <type>conferenceobject</type>
    <publisherName>SPIE</publisherName>
    <publisherPlace>Bellingham</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>2022-02-21</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Micro-Raman to detect stress phenomena in Si-chips bonded onto Cu substrates</title>
    <parentTitle language="eng">Integrated Optics: Design, Devices, Systems and Applications VI</parentTitle>
    <identifier type="isbn">978-1-5106-4385-7</identifier>
    <note>Poster + Paper</note>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.1117/12.2576414</enrichment>
    <enrichment key="THI_review">editorial review</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <enrichment key="THI_conferenceName">SPIE Optics + Optoelectronics, online, 19.-23.04.2021</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <author>
      <first_name>Jacopo</first_name>
      <last_name>Pascucci</last_name>
    </author>
    <editor>
      <first_name>Pavel</first_name>
      <last_name>Cheben</last_name>
    </editor>
    <author>
      <first_name>Fosca</first_name>
      <last_name>Conti</last_name>
    </author>
    <editor>
      <first_name>Jiří</first_name>
      <last_name>Čtyroký</last_name>
    </editor>
    <author>
      <first_name>Sri Krishna</first_name>
      <last_name>Bhogaraju</last_name>
    </author>
    <editor>
      <first_name>Iñigo</first_name>
      <last_name>Molina-Fernández</last_name>
    </editor>
    <author>
      <first_name>Raffaella</first_name>
      <last_name>Signorini</last_name>
    </author>
    <author>
      <first_name>E</first_name>
      <last_name>Liu</last_name>
    </author>
    <author>
      <first_name>Danilo</first_name>
      <last_name>Pedron</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <collection role="institutes" number="19311">Fakultät Elektro- und Informationstechnik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
  </doc>
  <doc>
    <id>1338</id>
    <completedYear/>
    <publishedYear>2020</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>7</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <articleNumber/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace>Piscataway</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>2022-02-22</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Finite Element simulations and Raman measurements to investigate thermomechanical stress in GaN-LEDs</title>
    <parentTitle language="eng">2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)</parentTitle>
    <identifier type="isbn">978-1-7281-6293-5</identifier>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.1109/ESTC48849.2020.9229843</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <enrichment key="THI_conferenceName">2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), Tønsberg (Norway), 15.-18.09.2020</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <author>
      <first_name>Fosca</first_name>
      <last_name>Conti</last_name>
    </author>
    <author>
      <first_name>E</first_name>
      <last_name>Liu</last_name>
    </author>
    <author>
      <first_name>Sri Krishna</first_name>
      <last_name>Bhogaraju</last_name>
    </author>
    <author>
      <first_name>Bernhard</first_name>
      <last_name>Wunderle</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>finite element method</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>gallium nitride (GaN)</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>LED</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Raman spectroscopy</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>semiconductor</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>thermomechanical stress</value>
    </subject>
    <collection role="institutes" number="19311">Fakultät Elektro- und Informationstechnik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
  </doc>
  <doc>
    <id>1341</id>
    <completedYear/>
    <publishedYear>2021</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>204</pageFirst>
    <pageLast>208</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <articleNumber/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace>Piscataway</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>2022-02-22</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Stress evaluations of silicon nitride chips bonded onto copper substrates via SAC soldering, AuSn soldering, and copper sintering</title>
    <parentTitle language="eng">2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)</parentTitle>
    <identifier type="isbn">978-1-7281-7643-7</identifier>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.1109/THERMINIC49743.2020.9420523</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <enrichment key="THI_conferenceName">2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), online, 14.09.-09.10.2020</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <author>
      <first_name>Fosca</first_name>
      <last_name>Conti</last_name>
    </author>
    <author>
      <first_name>E</first_name>
      <last_name>Liu</last_name>
    </author>
    <author>
      <first_name>Sri Krishna</first_name>
      <last_name>Bhogaraju</last_name>
    </author>
    <author>
      <first_name>Christoph</first_name>
      <last_name>Lenz</last_name>
    </author>
    <author>
      <first_name>Roland</first_name>
      <last_name>Seitz</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Creep</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Thermomechanical processes</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Silicon nitride</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Copper</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Plastics</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Microstructure</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Soldering</value>
    </subject>
    <collection role="institutes" number="19311">Fakultät Elektro- und Informationstechnik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
  </doc>
  <doc>
    <id>1343</id>
    <completedYear/>
    <publishedYear>2021</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>191</pageFirst>
    <pageLast>196</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <articleNumber/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace>Piscataway</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>2022-02-22</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Advanced location resolved transient thermal analysis</title>
    <parentTitle language="eng">2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)</parentTitle>
    <identifier type="isbn">978-1-7281-7643-7</identifier>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.1109/THERMINIC49743.2020.9420538</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <enrichment key="THI_conferenceName">2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), online, 14.09. - 09.10.2020</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <author>
      <first_name>E</first_name>
      <last_name>Liu</last_name>
    </author>
    <author>
      <first_name>Maximilian</first_name>
      <last_name>Schmid</last_name>
    </author>
    <author>
      <first_name>Sri Krishna</first_name>
      <last_name>Bhogaraju</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Temperature measurement</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Semiconductor device measurement</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Thermal resistance</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Thermal conductivity</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Dielectric measurement</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Thermal analysis</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Dielectrics</value>
    </subject>
    <collection role="institutes" number="19311">Fakultät Elektro- und Informationstechnik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
    <collection role="persons" number="26880">Schmid, Maximilian</collection>
  </doc>
  <doc>
    <id>1345</id>
    <completedYear/>
    <publishedYear>2020</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>8</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <articleNumber/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace>Piscataway</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>2022-02-22</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Comparing prediction methods for LED failure measured with Transient Thermal Analysis</title>
    <parentTitle language="eng">2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</parentTitle>
    <identifier type="isbn">978-1-7281-6049-8</identifier>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.1109/EuroSimE48426.2020.9152657</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <enrichment key="THI_conferenceName">2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), online, 05.-08.07.2020</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <author>
      <first_name>Andreas</first_name>
      <last_name>Zippelius</last_name>
    </author>
    <author>
      <first_name>Alexander</first_name>
      <last_name>Hanss</last_name>
    </author>
    <author>
      <first_name>E</first_name>
      <last_name>Liu</last_name>
    </author>
    <author>
      <first_name>Maximilian</first_name>
      <last_name>Schmid</last_name>
    </author>
    <author>
      <first_name>Judith</first_name>
      <last_name>Pérez-Velázquez</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Temperature measurement</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Artificial neural networks</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Light emitting diodes</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Aging</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Current measurement</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Training</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Heating systems</value>
    </subject>
    <collection role="institutes" number="19311">Fakultät Elektro- und Informationstechnik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
    <collection role="persons" number="26880">Schmid, Maximilian</collection>
  </doc>
  <doc>
    <id>1900</id>
    <completedYear/>
    <publishedYear>2019</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>7</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <articleNumber/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace>Piscataway</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>2022-03-10</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Failure Identification in LED packages by Transient Thermal Analysis and Calibrated FE Models</title>
    <parentTitle language="eng">2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</parentTitle>
    <identifier type="isbn">978-1-5386-8040-7</identifier>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.1109/EuroSimE.2019.8724558</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <enrichment key="THI_conferenceName">2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Hannover (Germany), 24.-27.03.2019</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <author>
      <first_name>Alexander</first_name>
      <last_name>Hanss</last_name>
    </author>
    <author>
      <first_name>E</first_name>
      <last_name>Liu</last_name>
    </author>
    <author>
      <first_name>Muhammad Rizwan</first_name>
      <last_name>Abdullah</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Conferences</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Microelectronics</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Micromechanical devices</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Light emitting diodes</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Aluminum nitride</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>III-V semiconductor materials</value>
    </subject>
    <collection role="institutes" number="15984">Fakultät Elektrotechnik und Informatik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
  </doc>
  <doc>
    <id>1903</id>
    <completedYear/>
    <publishedYear>2019</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>8</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <articleNumber/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace>Piscataway</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>2022-03-10</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Modelling Thermo-Mechanical Stress in GaN-LEDs Soldered on Copper Substrate with Simulations Validated by Raman Experiments</title>
    <parentTitle language="eng">2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</parentTitle>
    <identifier type="isbn">978-1-5386-8040-7</identifier>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.1109/EuroSimE.2019.8724533</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <enrichment key="THI_conferenceName">2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Hannover (Germany), 24.-27.03.2019</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <author>
      <first_name>E</first_name>
      <last_name>Liu</last_name>
    </author>
    <author>
      <first_name>Fosca</first_name>
      <last_name>Conti</last_name>
    </author>
    <author>
      <first_name>Raffaella</first_name>
      <last_name>Signorini</last_name>
    </author>
    <author>
      <first_name>Enrico</first_name>
      <last_name>Brugnolotto</last_name>
    </author>
    <author>
      <first_name>Sri Krishna</first_name>
      <last_name>Bhogaraju</last_name>
    </author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Conferences</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Microelectronics</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Micromechanical devices</value>
    </subject>
    <collection role="institutes" number="15984">Fakultät Elektrotechnik und Informatik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
  </doc>
  <doc>
    <id>1861</id>
    <completedYear/>
    <publishedYear>2019</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>10</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <articleNumber/>
    <type>conferenceobject</type>
    <publisherName>SPIE</publisherName>
    <publisherPlace>Bellingham</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>2022-03-09</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Thermomechanical local stress in assembled GaN LEDs investigated by Raman optical spectroscopy</title>
    <parentTitle language="eng">Integrated Optics: Design, Devices, Systems, and Applications V</parentTitle>
    <identifier type="isbn">978-1-5106-2729-1</identifier>
    <note>Presentation + Paper</note>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.1117/12.2520992</enrichment>
    <enrichment key="THI_conferenceName">SPIE OPTICS + OPTOELECTRONICS, Prague (Czech Republic), 01.-04.04.2019</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <enrichment key="THI_review">editorial review</enrichment>
    <author>
      <first_name>Raffaella</first_name>
      <last_name>Signorini</last_name>
    </author>
    <editor>
      <first_name>Pavel</first_name>
      <last_name>Cheben</last_name>
    </editor>
    <author>
      <first_name>Fosca</first_name>
      <last_name>Conti</last_name>
    </author>
    <editor>
      <first_name>Jiří</first_name>
      <last_name>Čtyroký</last_name>
    </editor>
    <author>
      <first_name>Enrico</first_name>
      <last_name>Brugnolotto</last_name>
    </author>
    <editor>
      <first_name>Iñigo</first_name>
      <last_name>Molina-Fernández</last_name>
    </editor>
    <author>
      <first_name>Danilo</first_name>
      <last_name>Pedron</last_name>
    </author>
    <author>
      <first_name>E</first_name>
      <last_name>Liu</last_name>
    </author>
    <author>
      <first_name>Sri Krishna</first_name>
      <last_name>Bhogaraju</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <collection role="institutes" number="15984">Fakultät Elektrotechnik und Informatik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
  </doc>
  <doc>
    <id>1863</id>
    <completedYear/>
    <publishedYear>2019</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>6</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <articleNumber/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace>Piscataway</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>2022-03-09</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Investigation of thermomechanical local stress induced in assembled GaN LEDs</title>
    <parentTitle language="eng">2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)</parentTitle>
    <identifier type="isbn">978-1-7281-2078-2</identifier>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.1109/THERMINIC.2019.8923629</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <enrichment key="THI_conferenceName">2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Lecco (Italy), 25.-27.09.2019</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <author>
      <first_name>Enrico</first_name>
      <last_name>Brugnolotto</last_name>
    </author>
    <author>
      <first_name>Sri Krishna</first_name>
      <last_name>Bhogaraju</last_name>
    </author>
    <author>
      <first_name>E</first_name>
      <last_name>Liu</last_name>
    </author>
    <author>
      <first_name>Fosca</first_name>
      <last_name>Conti</last_name>
    </author>
    <author>
      <first_name>Danilo</first_name>
      <last_name>Pedron</last_name>
    </author>
    <author>
      <first_name>Raffaella</first_name>
      <last_name>Signorini</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <collection role="institutes" number="15984">Fakultät Elektrotechnik und Informatik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
  </doc>
  <doc>
    <id>2949</id>
    <completedYear/>
    <publishedYear>2022</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>6</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <articleNumber/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace>Piscataway</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>2022-11-10</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Correlation of Scanning Acoustic Microscopy and Transient Thermal Analysis to Identify Crack Growth in Solder Joints</title>
    <parentTitle language="eng">Proceedings of the Twenty First InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems: ITherm 2022</parentTitle>
    <identifier type="isbn">978-1-6654-8503-6</identifier>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.1109/iTherm54085.2022.9899664</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <enrichment key="THI_conferenceName">2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), San Diego (USA), 31.05. - 03.06.2022</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <author>
      <first_name>Maximilian</first_name>
      <last_name>Schmid</last_name>
    </author>
    <author>
      <first_name>Joseph</first_name>
      <last_name>Hermann</last_name>
    </author>
    <author>
      <first_name>E</first_name>
      <last_name>Liu</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>reliability</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>transient thermal analysis (TTA)</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>scanning acoustic microscopy (SAM)</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>finite element simulation</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>finite element optimization</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>LED</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>solder</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>crack</value>
    </subject>
    <collection role="institutes" number="19311">Fakultät Elektro- und Informationstechnik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
    <collection role="persons" number="26880">Schmid, Maximilian</collection>
  </doc>
  <doc>
    <id>2859</id>
    <completedYear/>
    <publishedYear>2022</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>739</pageFirst>
    <pageLast>745</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <articleNumber/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace>Piscataway</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>2022-09-30</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Investigation Of Stress Generated By Interconnection Processes With Micro-Raman Spectroscopy (μRS)</title>
    <parentTitle language="eng">Proceedings IEEE 72nd Electronic Components and Technology Conference: ECTC 2022</parentTitle>
    <identifier type="isbn">978-1-6654-7943-1</identifier>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.1109/ECTC51906.2022.00123</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <enrichment key="THI_conferenceName">2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), San Diego (USA), 31.05. - 03.06.2022</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <author>
      <first_name>E</first_name>
      <last_name>Liu</last_name>
    </author>
    <author>
      <first_name>Sri Krishna</first_name>
      <last_name>Bhogaraju</last_name>
    </author>
    <author>
      <first_name>Kerstin</first_name>
      <last_name>Lux</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <author>
      <first_name>Rokeya Mumtahana</first_name>
      <last_name>Mou</last_name>
    </author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>component</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>μ-Raman Spectroscopy</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Au80Sn20</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Cu sintering</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>finite element simultion</value>
    </subject>
    <collection role="institutes" number="19311">Fakultät Elektro- und Informationstechnik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
  </doc>
  <doc>
    <id>2400</id>
    <completedYear/>
    <publishedYear>2015</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber/>
    <edition/>
    <issue>6</issue>
    <volume>24</volume>
    <articleNumber>068105</articleNumber>
    <type>article</type>
    <publisherName>IOP Publishing</publisherName>
    <publisherPlace>Bristol</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>2022-05-18</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Transient thermal analysis as measurement method for IC package structural integrity</title>
    <parentTitle language="eng">Chinese Physics B</parentTitle>
    <identifier type="issn">2058-3834</identifier>
    <identifier type="issn">1674-1056</identifier>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.1088/1674-1056/24/6/068105</enrichment>
    <enrichment key="THI_articleversion">published</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <author>
      <first_name>Alexander</first_name>
      <last_name>Hanss</last_name>
    </author>
    <author>
      <first_name>Maximilian</first_name>
      <last_name>Schmid</last_name>
    </author>
    <author>
      <first_name>E</first_name>
      <last_name>Liu</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <collection role="institutes" number="15984">Fakultät Elektrotechnik und Informatik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
    <collection role="persons" number="26880">Schmid, Maximilian</collection>
  </doc>
  <doc>
    <id>2544</id>
    <completedYear/>
    <publishedYear>2022</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>1720</pageFirst>
    <pageLast>1725</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <articleNumber/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace>Piscataway</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>2022-07-27</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Low cost copper based sintered interconnect material for optoelectronics packaging</title>
    <parentTitle language="eng">2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</parentTitle>
    <identifier type="isbn">978-1-6654-7943-1</identifier>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.1109/ECTC51906.2022.00270</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <enrichment key="THI_conferenceName">2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),  San Diego (USA), 31.05. - 03.06.2022</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <author>
      <first_name>Sri Krishna</first_name>
      <last_name>Bhogaraju</last_name>
    </author>
    <author>
      <first_name>Maximilian</first_name>
      <last_name>Schmid</last_name>
    </author>
    <author>
      <first_name>E</first_name>
      <last_name>Liu</last_name>
    </author>
    <author>
      <first_name>Rodolfo</first_name>
      <last_name>Saccon</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <author>
      <first_name>Holger</first_name>
      <last_name>Klassen</last_name>
    </author>
    <author>
      <first_name>Klaus</first_name>
      <last_name>Müller</last_name>
    </author>
    <author>
      <first_name>Georg</first_name>
      <last_name>Pirzer</last_name>
    </author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Cu sintering</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>flakes</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>PEG600</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>reliability</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>encapsulation</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>oxidation</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>transient thermal analysis</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Scanning acoustic microscopy</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>μ-Raman spectroscopy</value>
    </subject>
    <collection role="institutes" number="19311">Fakultät Elektro- und Informationstechnik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
    <collection role="persons" number="26880">Schmid, Maximilian</collection>
  </doc>
  <doc>
    <id>3093</id>
    <completedYear/>
    <publishedYear>2022</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>6</pageNumber>
    <edition/>
    <issue>138</issue>
    <volume>2022</volume>
    <articleNumber>114664</articleNumber>
    <type>article</type>
    <publisherName>Elsevier</publisherName>
    <publisherPlace>Amsterdam</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>2023-02-15</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Investigation of stress relaxation in SAC305 with micro-Raman spectroscopy</title>
    <parentTitle language="eng">Microelectronics Reliability</parentTitle>
    <identifier type="issn">0026-2714</identifier>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.1016/j.microrel.2022.114664</enrichment>
    <enrichment key="THI_articleversion">published</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <author>
      <first_name>E</first_name>
      <last_name>Liu</last_name>
    </author>
    <author>
      <first_name>Sri Krishna</first_name>
      <last_name>Bhogaraju</last_name>
    </author>
    <author>
      <first_name>Bernhard</first_name>
      <last_name>Wunderle</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <collection role="institutes" number="19311">Fakultät Elektro- und Informationstechnik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
  </doc>
  <doc>
    <id>1324</id>
    <completedYear/>
    <publishedYear>2021</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>10</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <articleNumber/>
    <type>conferenceobject</type>
    <publisherName>SPIE</publisherName>
    <publisherPlace>Bellingham</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>2022-02-21</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Raman spectroscopy to investigate gallium nitride light emitting diodes after assembling onto copper substrates</title>
    <parentTitle language="eng">Optical Sensors 2021</parentTitle>
    <identifier type="isbn">978-1-5106-4379-6</identifier>
    <note>Poster + Paper</note>
    <enrichment key="THI_review">editorial review</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <enrichment key="THI_conferenceName">SPIE Optics + Optoelectronics 2021: Optical Sensors 2021, online, 19.-23.04.2021</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="THI_relatedIdentifier">https://doi.org/10.1117/12.2591947</enrichment>
    <author>
      <first_name>Fosca</first_name>
      <last_name>Conti</last_name>
    </author>
    <editor>
      <first_name>Francesco</first_name>
      <last_name>Baldini</last_name>
    </editor>
    <author>
      <first_name>Kerstin</first_name>
      <last_name>Lux</last_name>
    </author>
    <editor>
      <first_name>Jiri</first_name>
      <last_name>Homola</last_name>
    </editor>
    <author>
      <first_name>Sri Krishna</first_name>
      <last_name>Bhogaraju</last_name>
    </author>
    <editor>
      <first_name>Robert A.</first_name>
      <last_name>Lieberman</last_name>
    </editor>
    <author>
      <first_name>E</first_name>
      <last_name>Liu</last_name>
    </author>
    <author>
      <first_name>Christoph</first_name>
      <last_name>Lenz</last_name>
    </author>
    <author>
      <first_name>Roland</first_name>
      <last_name>Seitz</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <collection role="institutes" number="19311">Fakultät Elektro- und Informationstechnik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
  </doc>
  <doc>
    <id>5500</id>
    <completedYear/>
    <publishedYear>2024</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>9</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <articleNumber/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace>Piscataway</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>2025-01-28</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Using µ-RAMAN Spectroscopy to Inspect Sintered Interconnects</title>
    <parentTitle language="eng">2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), Proceedings</parentTitle>
    <identifier type="isbn">979-8-3503-9036-0</identifier>
    <enrichment key="opus_doi_flag">true</enrichment>
    <enrichment key="opus_import_data">{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,17]],"date-time":"2024-10-17T04:12:39Z","timestamp":1729138359771,"version":"3.27.0"},"reference-count":24,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,9,11]],"date-time":"2024-09-11T00:00:00Z","timestamp":1726012800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,9,11]],"date-time":"2024-09-11T00:00:00Z","timestamp":1726012800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001659","name":"Deutsche Forschungsgemeinschaft (DFG)","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100001659","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,9,11]]},"DOI":"10.1109\/estc60143.2024.10712149","type":"proceedings-article","created":{"date-parts":[[2024,10,15]],"date-time":"2024-10-15T17:19:58Z","timestamp":1729012798000},"page":"1-9","source":"Crossref","is-referenced-by-count":0,"title":["Using \u00b5-RAMAN Spectroscopy to Inspect Sintered Interconnects"],"prefix":"10.1109","author":[{"given":"E","family":"Liu","sequence":"first","affiliation":[{"name":"University of Applied Science Ingolstadt,Ingolstadt,Germany"}]},{"given":"Mohd Zubair","family":"Akhtar","sequence":"additional","affiliation":[{"name":"University of Applied Science Ingolstadt,Ingolstadt,Germany"}]},{"given":"Fabian","family":"Steinberger","sequence":"additional","affiliation":[{"name":"University of Applied Science Ingolstadt,Ingolstadt,Germany"}]},{"given":"Bernhard","family":"Wunderle","sequence":"additional","affiliation":[{"name":"Technische Universit&amp;#x00E4;t Chemnitz,Chemnitz,Germany"}]},{"given":"Gordon","family":"Elger","sequence":"additional","affiliation":[{"name":"University of Applied Science Ingolstadt,Ingolstadt,Germany"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1177\/03093247231190449"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1088\/0268-1242\/11\/2\/001"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1063\/1.125044"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1364\/OL.44.004682"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1063\/1.1808244"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/j.jallcom.2008.09.009"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1007\/s10854-021-07474-1"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ias.1998.730274"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1002\/jrs.5947"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevB.1.638"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1002\/(SICI)1097-4555(199910)30:10&lt;877::AID-JRS464&gt;3.0.CO;2-5"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1016\/0038-1098(93)90294-W"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2021.114045"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1021\/acsaelm.1c00721"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC51906.2022.00270"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/EPTC.2017.8277577"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/6040.861554"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2015.7159854"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/eurosime.2014.6813870"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1177\/1687814017714976"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/tdmr.2015.2443055"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2020.113900"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1016\/j.matdes.2009.04.006"},{"journal-title":"Final Report on IGF Project No. 20460 N, IMTEK, University of Freiburg","article-title":"Montageprozess f\u00fcr Sensoren und Aktoren auf Basis der Niedertemperatur-Verbindungstechnik","year":"2022","author":"Feisst","key":"ref24"}],"event":{"name":"2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)","start":{"date-parts":[[2024,9,11]]},"location":"Berlin, Germany","end":{"date-parts":[[2024,9,13]]}},"container-title":["2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10711924\/10711994\/10712149.pdf?arnumber=10712149","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,10,16]],"date-time":"2024-10-16T05:40:49Z","timestamp":1729057249000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10712149\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,9,11]]},"references-count":24,"URL":"https:\/\/doi.org\/10.1109\/estc60143.2024.10712149","relation":{},"subject":[],"published":{"date-parts":[[2024,9,11]]}}}</enrichment>
    <enrichment key="local_crossrefDocumentType">proceedings-article</enrichment>
    <enrichment key="local_crossrefLicence">https://doi.org/10.15223/policy-029</enrichment>
    <enrichment key="local_import_origin">crossref</enrichment>
    <enrichment key="local_doiImportPopulated">PersonAuthorFirstName_1,PersonAuthorLastName_1,PersonAuthorFirstName_2,PersonAuthorLastName_2,PersonAuthorFirstName_3,PersonAuthorLastName_3,PersonAuthorFirstName_4,PersonAuthorLastName_4,PersonAuthorFirstName_5,PersonAuthorLastName_5,Enrichmentconference_title,Enrichmentconference_place,PublisherName,TitleMain_1,TitleParent_1,PageNumber,PageFirst,PageLast,CompletedYear,Enrichmentlocal_crossrefLicence</enrichment>
    <enrichment key="conference_title">2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)</enrichment>
    <enrichment key="conference_place">Berlin, Germany</enrichment>
    <enrichment key="opus.source">doi-import</enrichment>
    <enrichment key="THI_conferenceName">10th IEEE Electronics System-Integration Technology Conference (ESTC 2024), Berlin (Germany), 11.-13.09.2024</enrichment>
    <enrichment key="THI_openaccess">nein</enrichment>
    <enrichment key="THI_relatedIdentifier">https://doi.org10.1109/ESTC60143.2024.10712149</enrichment>
    <enrichment key="THI_review">peer-review</enrichment>
    <enrichment key="opus.doi.autoCreate">false</enrichment>
    <enrichment key="opus.urn.autoCreate">true</enrichment>
    <author>
      <first_name>E</first_name>
      <last_name>Liu</last_name>
    </author>
    <author>
      <first_name>Zubair Akhtar</first_name>
      <last_name>Mohd</last_name>
    </author>
    <author>
      <first_name>Fabian</first_name>
      <last_name>Steinberger</last_name>
    </author>
    <author>
      <first_name>Bernhard</first_name>
      <last_name>Wunderle</last_name>
    </author>
    <author>
      <first_name>Gordon</first_name>
      <last_name>Elger</last_name>
    </author>
    <collection role="institutes" number="19311">Fakultät Elektro- und Informationstechnik</collection>
    <collection role="institutes" number="19320">Institut für Innovative Mobilität (IIMo)</collection>
    <collection role="persons" number="26589">Elger, Gordon</collection>
  </doc>
</export-example>
