@inproceedings{ElgerLiuContietal.2019, author = {Elger, Gordon and Liu, E and Conti, Fosca and Signorini, Raffaella and Brugnolotto, Enrico and Bhogaraju, Sri Krishna}, title = {Modelling Thermo-Mechanical Stress in GaN-LEDs Soldered on Copper Substrate with Simulations Validated by Raman Experiments}, booktitle = {2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-5386-8040-7}, doi = {https://doi.org/10.1109/EuroSimE.2019.8724533}, year = {2019}, language = {en} } @inproceedings{MayPforr2019, author = {May, Willy and Pforr, Johannes}, title = {Design of integrated inductors in multi-phase buck/boost converters including operation with deactivated phases}, booktitle = {PCIM Europe 2019}, publisher = {VDE}, address = {Berlin}, isbn = {978-3-8007-4938-6}, url = {https://www.vde-verlag.de/proceedings-de/564938051.html}, pages = {392 -- 399}, year = {2019}, language = {en} } @inproceedings{ElgerMokhtariBhogarajuetal.2020, author = {Elger, Gordon and Mokhtari, Omid and Bhogaraju, Sri Krishna and Conti, Fosca and Meier, Markus and Schweigart, Helmut}, title = {Analyse der Reaktionsprodukte von Metall-Formiaten im r{\"u}ckstandfreien L{\"o}tprozess}, booktitle = {GMM-Fb. 94: EBL 2020 - Elektronische Baugruppen und Leiterplatten}, publisher = {VDE Verlag}, address = {Berlin}, isbn = {978-3-8007-5185-3}, doi = {https://www.vde-verlag.de/proceedings-de/455185053.html}, year = {2020}, language = {de} } @inproceedings{BhogarajuMokhtariPascuccietal.2019, author = {Bhogaraju, Sri Krishna and Mokhtari, Omid and Pascucci, Jacopo and Conti, Fosca and Kotadia, Hiren R. and Elger, Gordon}, title = {A multi-pronged approach to low-pressure Cu sintering using surface-modified particles, substrate and chip metallization}, volume = {2019}, booktitle = {International Symposium on Microelectronics}, number = {1}, publisher = {IMAPS}, address = {Pittsburgh}, issn = {2380-4505}, doi = {https://doi.org/10.4071/2380-4505-2019.1.000387}, pages = {387 -- 392}, year = {2019}, language = {en} } @inproceedings{BhogarajuMokhtariPascuccietal.2019, author = {Bhogaraju, Sri Krishna and Mokhtari, Omid and Pascucci, Jacopo and Conti, Fosca and Elger, Gordon}, title = {Improved sinterability of particles to substrates by surface modifications on substrate metallization}, volume = {2019}, booktitle = {Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)}, number = {HiTen}, publisher = {IMAPS}, address = {Pittsburgh (PA)}, issn = {2380-4491}, doi = {https://doi.org/10.4071/2380-4491.2019.HiTen.000066}, pages = {66 -- 70}, year = {2019}, language = {en} } @inproceedings{SignoriniContiBrugnolottoetal.2019, author = {Signorini, Raffaella and Conti, Fosca and Brugnolotto, Enrico and Pedron, Danilo and Liu, E and Bhogaraju, Sri Krishna and Elger, Gordon}, title = {Thermomechanical local stress in assembled GaN LEDs investigated by Raman optical spectroscopy}, booktitle = {Integrated Optics: Design, Devices, Systems, and Applications V}, editor = {Cheben, Pavel and Čtyrok{\´y}, Jiř{\´i} and Molina-Fern{\´a}ndez, I{\~n}igo}, publisher = {SPIE}, address = {Bellingham}, isbn = {978-1-5106-2729-1}, doi = {https://doi.org/10.1117/12.2520992}, year = {2019}, language = {en} } @inproceedings{SchmidHanssBhogarajuetal.2019, author = {Schmid, Maximilian and Hanss, Alexander and Bhogaraju, Sri Krishna and Elger, Gordon}, title = {Time saving averaging algorithm for transient thermal analyses over deterministic pulse superposition}, booktitle = {2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-2078-2}, doi = {https://doi.org/10.1109/THERMINIC.2019.8923548}, year = {2019}, language = {en} } @inproceedings{BrugnolottoBhogarajuLiuetal.2019, author = {Brugnolotto, Enrico and Bhogaraju, Sri Krishna and Liu, E and Conti, Fosca and Pedron, Danilo and Signorini, Raffaella and Elger, Gordon}, title = {Investigation of thermomechanical local stress induced in assembled GaN LEDs}, booktitle = {2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-2078-2}, doi = {https://doi.org/10.1109/THERMINIC.2019.8923629}, year = {2019}, language = {en} } @inproceedings{SchmidBhogarajuElger2019, author = {Schmid, Maximilian and Bhogaraju, Sri Krishna and Elger, Gordon}, title = {Automatic transient thermal impedance tester for quality inspection of soldered and sintered power electronic devices on panel and tile level}, booktitle = {2019 IEEE 69th Electronic Components and Technology Conference (ECTC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-1499-6}, doi = {https://doi.org/10.1109/ECTC.2019.00320}, pages = {2324 -- 2330}, year = {2019}, language = {en} } @inproceedings{BogdanovsKrievsPforr2021, author = {Bogdanovs, Arturs and Krievs, Oskars and Pforr, Johannes}, title = {Indirect Multiple DC Link Current Sensing Using Op-Amp Circuits in a Three-Phase Three-Level PWM Inverter}, booktitle = {PCIM Europe digital days 2021}, publisher = {VDE}, address = {Berlin}, isbn = {978-3-8007-5515-8}, doi = {https://www.vde-verlag.de/proceedings-de/565515217.html}, pages = {1614 -- 1621}, year = {2021}, language = {en} } @inproceedings{BogdanovsKrievsPforr2021, author = {Bogdanovs, Arturs and Krievs, Oskars and Pforr, Johannes}, title = {Fault Detection using Indirect DC Link Current Measurement Technique in Multiphase DC Converter with Coupled Inductor}, booktitle = {2021 23rd European Conference on Power Electronics and Applications (EPE'21 ECCE Europe)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-9-0758-1537-5}, doi = {https://doi.org/10.23919/EPE21ECCEEurope50061.2021.9570190}, year = {2021}, language = {en} }