@inproceedings{ZippeliusStroblSchmidetal.2022, author = {Zippelius, Andreas and Strobl, Tobias and Schmid, Maximilian and Hermann, Joseph and Hoffmann, Alwin and Elger, Gordon}, title = {Predicting thermal resistance of solder joints based on Scanning Acoustic Microscopy using Artificial Neural Networks}, booktitle = {2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-6654-8947-8}, doi = {https://doi.org/10.1109/ESTC55720.2022.9939465}, pages = {566 -- 575}, year = {2022}, language = {en} }