@inproceedings{KeimTetzlaffElger2020, author = {Keim, Simon and Tetzlaff, Ulrich and Elger, Gordon}, title = {The influence of different-sized Ni micro- and nanopowders on the processing and microstructural properties of Sn-Ag-Cu-solder with low Ag content}, booktitle = {Proceedings: IEEE 70th Electronic Components and Technology Conference, ECTC 2020}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-6180-8}, issn = {2377-5726}, doi = {https://doi.org/10.1109/ECTC32862.2020.00312}, pages = {2005 -- 2012}, year = {2020}, language = {en} } @article{BhogarajuContiKotadiaetal.2020, author = {Bhogaraju, Sri Krishna and Conti, Fosca and Kotadia, Hiren R. and Keim, Simon and Tetzlaff, Ulrich and Elger, Gordon}, title = {Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging}, volume = {2020}, pages = {156043}, journal = {Journal of Alloys and Compounds}, number = {844}, publisher = {Elsevier}, address = {Amsterdam}, issn = {1873-4669}, doi = {https://doi.org/10.1016/j.jallcom.2020.156043}, year = {2020}, language = {en} } @article{ErnstKeimTetzlaff2022, author = {Ernst, Benedikt and Keim, Simon and Tetzlaff, Ulrich}, title = {On the anisotropic indentation modulus and anisotropic creep behavior of β-Sn characterized by nanoindentation methods}, volume = {2022}, pages = {143392}, journal = {Materials Science and Engineering: A}, number = {848}, publisher = {Elsevier}, address = {Amsterdam}, issn = {1873-4936}, doi = {https://doi.org/10.1016/j.msea.2022.143392}, year = {2022}, language = {en} }