@article{SchwanMohanSchmidetal.2025, author = {Schwan, Hannes and Mohan, Nihesh and Schmid, Maximilian and Saha, Rocky Kumar and Klassen, Holger and M{\"u}ller, Klaus and Elger, Gordon}, title = {Sintering for High Power Optoelectronic Devices}, volume = {16}, pages = {1164}, journal = {Micromachines}, number = {10}, publisher = {MDPI}, address = {Basel}, issn = {2072-666X}, doi = {https://doi.org/10.3390/mi16101164}, year = {2025}, abstract = {Residual-free eutectic Au80Sn20 soldering is still the dominant assembly technology for optoelectronic devices such as high-power lasers, LEDs, and photodiodes. Due to the high cost of gold, alternatives are desirable. This paper investigates the thermal performance of copper-based sintering for optoelectronic submodules on first and second level to obtain thermally efficient thin bondlines. Sintered interconnects obtained by a new particle-free copper ink, based on complexed copper salt, are compared with copper flake and silver nanoparticle sintered interconnects and benchmarked against AuSn solder interconnects. The copper ink is dispensed and predried at 130 °C to facilitate in situ generation of Cu nanoparticles by thermal decomposition of the metal salt before sintering. Submounts are then sintered at 275 °C for 15 min under nitrogen with 30 MPa pressure, forming uniform 2-5 µm copper layers achieving shear strengths above 31 MPa. Unpackaged LEDs are bonded on first level using the copper ink but applying only 10 MPa to avoid damaging the semiconductor dies. Thermal performance is evaluated via transient thermal analysis. Results show that copper ink interfaces approach the performance of thin AuSn joints and match silver interconnects at second level. However, at first level, AuSn and sintered interconnects of commercial silver and copper pastes remained superior due to the relative inhomogeneous thickness of the thin Cu copper layer after predrying, requiring higher bonding pressure to equalize surface inhomogeneities.}, language = {en} } @inproceedings{SchwanPforr2019, author = {Schwan, Hannes and Pforr, Johannes}, title = {Analysis, design and operation strategy of high-efficient Class E2 wireless power transfer systems for automotive EV battery charging applications}, booktitle = {2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-9-0758-1531-3}, doi = {https://doi.org/10.23919/EPE.2019.8915165}, year = {2019}, language = {en} } @thesis{Schwan2021, author = {Schwan, Hannes}, title = {Entwicklung und Verifikation einer Betriebsstrategie f{\"u}r ein hocheffizientes Push-Pull ZCS Class E² induktives Energie{\"u}bertragungssystem f{\"u}r automobile Anwendungen}, publisher = {Technische Hochschule Ingolstadt}, address = {Ingolstadt}, url = {http://nbn-resolving.de/urn:nbn:de:bvb:573-8550}, pages = {108}, school = {Technische Hochschule Ingolstadt}, year = {2021}, abstract = {In dieser Arbeit wird unter der Ber{\"u}cksichtigung des Einflusses der relativen Position der {\"U}bertragungsspulen eines Push-Pull ZCS Class E2 induktiven Energie{\"u}bertragungssystems f{\"u}r die automobile Anwendung eine Betriebsstrategie entwickelt und experimentell untersucht, ob diese optimales Verhalten unabh{\"a}ngig des Betriebspunktes gew{\"a}hrleisten kann.}, language = {de} } @inproceedings{SchwanSchmidElger2024, author = {Schwan, Hannes and Schmid, Maximilian and Elger, Gordon}, title = {Layer Resolved Thermal Impedance Measurement with Laser Stimulated Transient Thermal Analysis of Semiconductor Modules}, booktitle = {THERMINIC 2024: Proceedings of 2024, 30th International Workshop on Thermal Investigations of ICs and Systems}, publisher = {IEEE}, address = {Piscataway}, isbn = {979-8-3503-8782-7}, doi = {https://doi.org/10.1109/THERMINIC62015.2024.10732233}, year = {2024}, language = {en} } @inproceedings{SchwanPforrElger2022, author = {Schwan, Hannes and Pforr, Johannes and Elger, Gordon}, title = {ZVS Class E2 Wireless Power Transfer System with Self-Resonant Transmission Coils for the Biomedical Application}, pages = {107}, booktitle = {PCIM Europe 2022: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management}, editor = {Mesago Messe Frankfurt GmbH,}, publisher = {VDE Verlag}, address = {Berlin}, isbn = {978-3-8007-5822-7}, doi = {https://doi.org/10.30420/565822107}, year = {2022}, language = {en} } @inproceedings{SchwanSchmidElger2022, author = {Schwan, Hannes and Schmid, Maximilian and Elger, Gordon}, title = {Laser Stimulated Transient Thermal Analysis of Semiconductors}, booktitle = {THERMINIC 2022: Proceedings 2022}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-6654-9229-4}, doi = {https://doi.org/10.1109/THERMINIC57263.2022.9950672}, year = {2022}, language = {en} }