@article{MokhtariContiSacconetal.2021, author = {Mokhtari, Omid and Conti, Fosca and Saccon, Rodolfo and Bhogaraju, Sri Krishna and Elger, Gordon}, title = {Formic acid and formate salts for chemical vapor deposition of copper on glass substrates at atmospheric pressure}, volume = {45}, journal = {New Journal of Chemistry}, number = {43}, publisher = {RSC}, address = {London}, issn = {1369-9261}, doi = {https://doi.org/10.1039/D1NJ02476K}, pages = {20133 -- 20139}, year = {2021}, language = {en} } @inproceedings{SacconBeninBhogarajuetal.2022, author = {Saccon, Rodolfo and Benin, Alice and Bhogaraju, Sri Krishna and Elger, Gordon}, title = {Effect of binders on the performance of copper sintering pastes}, booktitle = {2022 International Conference on Electronics Packaging (ICEP 2022)}, publisher = {IEEE}, address = {Piscataway (NJ)}, isbn = {978-4-9911911-3-8}, doi = {https://doi.org/10.23919/ICEP55381.2022.9795555}, pages = {71 -- 72}, year = {2022}, language = {en} } @inproceedings{BhogarajuSchmidLiuetal.2022, author = {Bhogaraju, Sri Krishna and Schmid, Maximilian and Liu, E and Saccon, Rodolfo and Elger, Gordon and Klassen, Holger and M{\"u}ller, Klaus and Pirzer, Georg}, title = {Low cost copper based sintered interconnect material for optoelectronics packaging}, booktitle = {2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-6654-7943-1}, doi = {https://doi.org/10.1109/ECTC51906.2022.00270}, pages = {1720 -- 1725}, year = {2022}, language = {en} }