@inproceedings{SteinbergerMohanRaemeretal.2024, author = {Steinberger, Fabian and Mohan, Nihesh and R{\"a}mer, Olaf and Elger, Gordon}, title = {Low temperature die-attach bonding using copper particle free inks}, booktitle = {2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), Proceedings}, publisher = {IEEE}, address = {Piscataway}, isbn = {979-8-3503-9036-0}, doi = {https://doi.org/10.1109/ESTC60143.2024.10712150}, year = {2024}, language = {en} }