@inproceedings{ParetBhogarajuBusseetal.2024, author = {Paret, Paul and Bhogaraju, Sri Krishna and Busse, Dirk and Dahlb{\"u}dding, Alexander and Elger, Gordon and Narumanchi, Sreekant}, title = {Thermomechanical Degradation of Sintered Copper under High-Temperature Thermal Shock}, booktitle = {Proceedings: IEEE 74th Electronic Components and Technology Conference, ECTC 2024}, publisher = {IEEE}, address = {Piscataway}, isbn = {979-8-3503-7598-5}, doi = {https://doi.org/10.1109/ECTC51529.2024.00196}, pages = {1219 -- 1224}, year = {2024}, language = {en} }