@inproceedings{StenzelSchmidKoelleetal.2024, author = {Stenzel, Gerhard and Schmid, Kyrill and K{\"o}lle, Michael and Altmann, Philipp and Lingsch-Rosenfeld, Marian and Zorn, Maximilian and B{\"u}cher, Tim and Gabor, Thomas and Wirsing, Martin and Belzner, Lenz}, title = {SEGym: Optimizing Large Language Model Assisted Software Engineering Agents with Reinforcement Learning}, booktitle = {Bridging the Gap Between AI and Reality, Second International Conference, AISoLA 2024, Crete, Greece, October 30 - November 3, 2024, Proceedings}, editor = {Steffen, Bernhard}, publisher = {Springer}, address = {Cham}, isbn = {978-3-031-75434-0}, doi = {https://doi.org/10.1007/978-3-031-75434-0_8}, pages = {107 -- 124}, year = {2024}, language = {en} } @inproceedings{BhogarajuSchmidHufnageletal.2021, author = {Bhogaraju, Sri Krishna and Schmid, Maximilian and Hufnagel, Elias and Conti, Fosca and Kotadia, Hiren R. and Elger, Gordon}, title = {Low temperature and low pressure die-attach bonding of high power light emitting diodes with self reducing copper complex paste}, booktitle = {IEEE 71st Electronic Components and Technology Conference ECTC 2021, Proceedings}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-6654-4097-4}, doi = {https://doi.org/10.1109/ECTC32696.2021.00094}, pages = {526 -- 531}, year = {2021}, language = {en} } @inproceedings{SchmidBhogarajuElger2021, author = {Schmid, Maximilian and Bhogaraju, Sri Krishna and Elger, Gordon}, title = {Characterization of copper sintered interconnects by transient thermal analysis}, booktitle = {2021 International Conference on Electronics Packaging (ICEP 2021)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-4-9911-9111-4}, doi = {https://doi.org/10.23919/ICEP51988.2021.9451966}, pages = {71 -- 72}, year = {2021}, language = {en} } @inproceedings{SchmidBhogarajuRiedeletal.2021, author = {Schmid, Maximilian and Bhogaraju, Sri Krishna and Riedel, Andreas and Elger, Gordon}, title = {Development of an in-line capable transient thermal analysis equipment for a power module with five half bridges}, booktitle = {2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-7643-7}, doi = {https://doi.org/10.1109/THERMINIC49743.2020.9420493}, pages = {268 -- 273}, year = {2021}, language = {en} } @inproceedings{LiuSchmidBhogarajuetal.2021, author = {Liu, E and Schmid, Maximilian and Bhogaraju, Sri Krishna and Elger, Gordon}, title = {Advanced location resolved transient thermal analysis}, booktitle = {2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-7643-7}, doi = {https://doi.org/10.1109/THERMINIC49743.2020.9420538}, pages = {191 -- 196}, year = {2021}, language = {en} } @article{SchmidBhogarajuHanssetal.2021, author = {Schmid, Maximilian and Bhogaraju, Sri Krishna and Hanss, Alexander and Elger, Gordon}, title = {A new noise-suppression algorithm for transient thermal analysis in semiconductors over pulse superposition}, volume = {70}, pages = {6500409}, journal = {IEEE Transactions on Instrumentation and Measurement}, publisher = {IEEE}, address = {New York}, issn = {0018-9456}, doi = {https://doi.org/10.1109/TIM.2020.3011818}, year = {2021}, language = {en} } @inproceedings{ZippeliusHanssLiuetal.2020, author = {Zippelius, Andreas and Hanss, Alexander and Liu, E and Schmid, Maximilian and P{\´e}rez-Vel{\´a}zquez, Judith and Elger, Gordon}, title = {Comparing prediction methods for LED failure measured with Transient Thermal Analysis}, booktitle = {2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-6049-8}, doi = {https://doi.org/10.1109/EuroSimE48426.2020.9152657}, year = {2020}, language = {en} } @inproceedings{BhogarajuContiSchmidetal.2020, author = {Bhogaraju, Sri Krishna and Conti, Fosca and Schmid, Maximilian and Meier, Markus and Schweigart, Helmut and Elger, Gordon}, title = {Development of sinter paste with surface modified copper alloy particles for die-attach bonding}, booktitle = {ETG-Fachbericht 161, CIPS 2020, 11th International Conference on Integrated Power Electronics Systems}, publisher = {VDE Verlag}, address = {Berlin}, isbn = {978-3-8007-5226-3}, url = {https://www.vde-verlag.de/proceedings-de/455225100.html}, pages = {582 -- 587}, year = {2020}, language = {en} } @inproceedings{SchmidHanssBhogarajuetal.2019, author = {Schmid, Maximilian and Hanss, Alexander and Bhogaraju, Sri Krishna and Elger, Gordon}, title = {Time saving averaging algorithm for transient thermal analyses over deterministic pulse superposition}, booktitle = {2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-2078-2}, doi = {https://doi.org/10.1109/THERMINIC.2019.8923548}, year = {2019}, language = {en} } @inproceedings{SchmidBhogarajuElger2019, author = {Schmid, Maximilian and Bhogaraju, Sri Krishna and Elger, Gordon}, title = {Automatic transient thermal impedance tester for quality inspection of soldered and sintered power electronic devices on panel and tile level}, booktitle = {2019 IEEE 69th Electronic Components and Technology Conference (ECTC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-1499-6}, doi = {https://doi.org/10.1109/ECTC.2019.00320}, pages = {2324 -- 2330}, year = {2019}, language = {en} } @inproceedings{SchmidHermannLiuetal.2022, author = {Schmid, Maximilian and Hermann, Joseph and Liu, E and Elger, Gordon}, title = {Correlation of Scanning Acoustic Microscopy and Transient Thermal Analysis to Identify Crack Growth in Solder Joints}, booktitle = {Proceedings of the Twenty First InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems: ITherm 2022}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-6654-8503-6}, doi = {https://doi.org/10.1109/iTherm54085.2022.9899664}, year = {2022}, language = {en} } @inproceedings{ZippeliusStroblSchmidetal.2022, author = {Zippelius, Andreas and Strobl, Tobias and Schmid, Maximilian and Hermann, Joseph and Hoffmann, Alwin and Elger, Gordon}, title = {Predicting thermal resistance of solder joints based on Scanning Acoustic Microscopy using Artificial Neural Networks}, booktitle = {2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-6654-8947-8}, doi = {https://doi.org/10.1109/ESTC55720.2022.9939465}, pages = {566 -- 575}, year = {2022}, language = {en} } @inproceedings{SchmidHermannBhogarajuetal.2022, author = {Schmid, Maximilian and Hermann, Joseph and Bhogaraju, Sri Krishna and Elger, Gordon}, title = {Reliability of SAC Solders under Low and High Stress Conditions}, booktitle = {2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-6654-8947-8}, doi = {https://doi.org/10.1109/ESTC55720.2022.9939394}, pages = {553 -- 559}, year = {2022}, language = {en} } @inproceedings{HanssSchmidBhogarajuetal.2018, author = {Hanss, Alexander and Schmid, Maximilian and Bhogaraju, Sri Krishna and Conti, Fosca and Elger, Gordon}, title = {Reliability of sintered and soldered high power chip size packages and flip chip LEDs}, booktitle = {ECTC - The 2018 IEEE 68th Electronic Components and Technology Conference: Proceedings}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-5386-5000-4}, doi = {https://doi.org/10.1109/ECTC.2018.00312}, pages = {2080 -- 2088}, year = {2018}, language = {en} } @inproceedings{BhogarajuMokhtariPascuccietal.2020, author = {Bhogaraju, Sri Krishna and Mokhtari, Omid and Pascucci, Jacopo and Hanss, Alexander and Schmid, Maximilian and Conti, Fosca and Elger, Gordon}, title = {Hybrid Cu particle paste with surface-modified particles for high temperature electronics packaging}, booktitle = {Proceedings 22nd European Microelectronics and Packaging Conference, EMPC}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-6291-1}, doi = {https://doi.org/10.23919/EMPC44848.2019.8951887}, year = {2020}, language = {en} } @article{HanssSchmidLiuetal.2015, author = {Hanss, Alexander and Schmid, Maximilian and Liu, E and Elger, Gordon}, title = {Transient thermal analysis as measurement method for IC package structural integrity}, volume = {24}, pages = {068105}, journal = {Chinese Physics B}, number = {6}, publisher = {IOP Publishing}, address = {Bristol}, issn = {2058-3834}, doi = {https://doi.org/10.1088/1674-1056/24/6/068105}, year = {2015}, language = {en} } @inproceedings{HanssSchmidBhogarajuetal.2018, author = {Hanss, Alexander and Schmid, Maximilian and Bhogaraju, Sri Krishna and Conti, Fosca and Elger, Gordon}, title = {Process development and reliability of sintered high power chip size packages and flip chip LEDs}, booktitle = {2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-4-9902-1885-0}, doi = {https://doi.org/10.23919/ICEP.2018.8374351}, pages = {479 -- 484}, year = {2018}, language = {en} } @inproceedings{BhogarajuHanssSchmidetal.2018, author = {Bhogaraju, Sri Krishna and Hanss, Alexander and Schmid, Maximilian and Elger, Gordon and Conti, Fosca}, title = {Evaluation of silver and copper sintering of first level interconnects for high power LEDs}, booktitle = {2018 7th Electronic System-Integration Technology Conference (ESTC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-5386-6814-6}, doi = {https://doi.org/10.1109/ESTC.2018.8546499}, year = {2018}, language = {en} } @inproceedings{SchmidElger2018, author = {Schmid, Maximilian and Elger, Gordon}, title = {Measurement of the transient thermal impedance of MOSFETs over the sensitivity of the threshold voltage}, booktitle = {EPE'18 ECCE Europe}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-9-0758-1528-3}, url = {https://ieeexplore.ieee.org/document/8515480}, year = {2018}, language = {en} } @inproceedings{ElgerHanssSchmid2018, author = {Elger, Gordon and Hanss, Alexander and Schmid, Maximilian}, title = {Transient Thermal Analysis as In-Situ Method in Accelerated Stress Tests to Access Package Integrity of LEDs}, booktitle = {2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-5386-6759-0}, doi = {https://doi.org/10.1109/THERMINIC.2018.8593278}, year = {2018}, language = {en} }