@inproceedings{BrugnolottoBhogarajuLiuetal.2019, author = {Brugnolotto, Enrico and Bhogaraju, Sri Krishna and Liu, E and Conti, Fosca and Pedron, Danilo and Signorini, Raffaella and Elger, Gordon}, title = {Investigation of thermomechanical local stress induced in assembled GaN LEDs}, booktitle = {2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-2078-2}, doi = {https://doi.org/10.1109/THERMINIC.2019.8923629}, year = {2019}, language = {en} } @inproceedings{SchmidHermannLiuetal.2022, author = {Schmid, Maximilian and Hermann, Joseph and Liu, E and Elger, Gordon}, title = {Correlation of Scanning Acoustic Microscopy and Transient Thermal Analysis to Identify Crack Growth in Solder Joints}, booktitle = {Proceedings of the Twenty First InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems: ITherm 2022}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-6654-8503-6}, doi = {https://doi.org/10.1109/iTherm54085.2022.9899664}, year = {2022}, language = {en} } @inproceedings{LiuBhogarajuLuxetal.2022, author = {Liu, E and Bhogaraju, Sri Krishna and Lux, Kerstin and Elger, Gordon and Mou, Rokeya Mumtahana}, title = {Investigation Of Stress Generated By Interconnection Processes With Micro-Raman Spectroscopy (μRS)}, booktitle = {Proceedings IEEE 72nd Electronic Components and Technology Conference: ECTC 2022}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-6654-7943-1}, doi = {https://doi.org/10.1109/ECTC51906.2022.00123}, pages = {739 -- 745}, year = {2022}, language = {en} } @article{HanssSchmidLiuetal.2015, author = {Hanss, Alexander and Schmid, Maximilian and Liu, E and Elger, Gordon}, title = {Transient thermal analysis as measurement method for IC package structural integrity}, volume = {24}, pages = {068105}, journal = {Chinese Physics B}, number = {6}, publisher = {IOP Publishing}, address = {Bristol}, issn = {2058-3834}, doi = {https://doi.org/10.1088/1674-1056/24/6/068105}, year = {2015}, language = {en} } @inproceedings{BhogarajuSchmidLiuetal.2022, author = {Bhogaraju, Sri Krishna and Schmid, Maximilian and Liu, E and Saccon, Rodolfo and Elger, Gordon and Klassen, Holger and M{\"u}ller, Klaus and Pirzer, Georg}, title = {Low cost copper based sintered interconnect material for optoelectronics packaging}, booktitle = {2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-6654-7943-1}, doi = {https://doi.org/10.1109/ECTC51906.2022.00270}, pages = {1720 -- 1725}, year = {2022}, language = {en} } @article{LiuBhogarajuWunderleetal.2022, author = {Liu, E and Bhogaraju, Sri Krishna and Wunderle, Bernhard and Elger, Gordon}, title = {Investigation of stress relaxation in SAC305 with micro-Raman spectroscopy}, volume = {2022}, pages = {114664}, journal = {Microelectronics Reliability}, number = {138}, publisher = {Elsevier}, address = {Amsterdam}, issn = {0026-2714}, doi = {https://doi.org/10.1016/j.microrel.2022.114664}, year = {2022}, language = {en} } @inproceedings{ContiLuxBhogarajuetal.2021, author = {Conti, Fosca and Lux, Kerstin and Bhogaraju, Sri Krishna and Liu, E and Lenz, Christoph and Seitz, Roland and Elger, Gordon}, title = {Raman spectroscopy to investigate gallium nitride light emitting diodes after assembling onto copper substrates}, booktitle = {Optical Sensors 2021}, editor = {Baldini, Francesco and Homola, Jiri and Lieberman, Robert A.}, publisher = {SPIE}, address = {Bellingham}, isbn = {978-1-5106-4379-6}, doi = {https://doi.org/10.1117/12.2591947}, year = {2021}, language = {en} } @inproceedings{LiuMohdSteinbergeretal.2024, author = {Liu, E and Mohd, Zubair Akhtar and Steinberger, Fabian and Wunderle, Bernhard and Elger, Gordon}, title = {Using µ-RAMAN Spectroscopy to Inspect Sintered Interconnects}, booktitle = {2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), Proceedings}, publisher = {IEEE}, address = {Piscataway}, isbn = {979-8-3503-9036-0}, doi = {https://doi.org10.1109/ESTC60143.2024.10712149}, year = {2024}, language = {en} }