@inproceedings{HanssLiuAbdullahetal.2019, author = {Hanss, Alexander and Liu, E and Abdullah, Muhammad Rizwan and Elger, Gordon}, title = {Failure Identification in LED packages by Transient Thermal Analysis and Calibrated FE Models}, booktitle = {2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-5386-8040-7}, doi = {https://doi.org/10.1109/EuroSimE.2019.8724558}, year = {2019}, language = {en} } @inproceedings{ElgerLiuContietal.2019, author = {Elger, Gordon and Liu, E and Conti, Fosca and Signorini, Raffaella and Brugnolotto, Enrico and Bhogaraju, Sri Krishna}, title = {Modelling Thermo-Mechanical Stress in GaN-LEDs Soldered on Copper Substrate with Simulations Validated by Raman Experiments}, booktitle = {2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-5386-8040-7}, doi = {https://doi.org/10.1109/EuroSimE.2019.8724533}, year = {2019}, language = {en} } @inproceedings{SignoriniContiBrugnolottoetal.2019, author = {Signorini, Raffaella and Conti, Fosca and Brugnolotto, Enrico and Pedron, Danilo and Liu, E and Bhogaraju, Sri Krishna and Elger, Gordon}, title = {Thermomechanical local stress in assembled GaN LEDs investigated by Raman optical spectroscopy}, booktitle = {Integrated Optics: Design, Devices, Systems, and Applications V}, editor = {Cheben, Pavel and Čtyrok{\´y}, Jiř{\´i} and Molina-Fern{\´a}ndez, I{\~n}igo}, publisher = {SPIE}, address = {Bellingham}, isbn = {978-1-5106-2729-1}, doi = {https://doi.org/10.1117/12.2520992}, year = {2019}, language = {en} } @inproceedings{BrugnolottoBhogarajuLiuetal.2019, author = {Brugnolotto, Enrico and Bhogaraju, Sri Krishna and Liu, E and Conti, Fosca and Pedron, Danilo and Signorini, Raffaella and Elger, Gordon}, title = {Investigation of thermomechanical local stress induced in assembled GaN LEDs}, booktitle = {2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-2078-2}, doi = {https://doi.org/10.1109/THERMINIC.2019.8923629}, year = {2019}, language = {en} }