@inproceedings{ContiLiuBhogarajuetal.2021, author = {Conti, Fosca and Liu, E and Bhogaraju, Sri Krishna and Lenz, Christoph and Seitz, Roland and Elger, Gordon}, title = {Stress evaluations of silicon nitride chips bonded onto copper substrates via SAC soldering, AuSn soldering, and copper sintering}, booktitle = {2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-7643-7}, doi = {https://doi.org/10.1109/THERMINIC49743.2020.9420523}, pages = {204 -- 208}, year = {2021}, language = {en} } @inproceedings{GaborSuenkelRitzetal.2020, author = {Gabor, Thomas and S{\"u}nkel, Leo and Ritz, Fabian and Phan, Thomy and Belzner, Lenz and Roch, Christoph and Feld, Sebastian and Linnhoff-Popien, Claudia}, title = {The Holy Grail of Quantum Artificial Intelligence: Major Challenges in Accelerating the Machine Learning Pipeline}, booktitle = {ICSEW'20 : Proceedings of the IEEE/ACM 42nd International Conference on Software Engineering Workshops}, publisher = {ACM}, address = {New York}, isbn = {978-1-4503-7963-2}, doi = {https://doi.org/10.1145/3387940.3391469}, pages = {456 -- 461}, year = {2020}, language = {en} } @inproceedings{ContiLuxBhogarajuetal.2021, author = {Conti, Fosca and Lux, Kerstin and Bhogaraju, Sri Krishna and Liu, E and Lenz, Christoph and Seitz, Roland and Elger, Gordon}, title = {Raman spectroscopy to investigate gallium nitride light emitting diodes after assembling onto copper substrates}, booktitle = {Optical Sensors 2021}, editor = {Baldini, Francesco and Homola, Jiri and Lieberman, Robert A.}, publisher = {SPIE}, address = {Bellingham}, isbn = {978-1-5106-4379-6}, doi = {https://doi.org/10.1117/12.2591947}, year = {2021}, language = {en} }