@inproceedings{PascucciContiBhogarajuetal.2021, author = {Pascucci, Jacopo and Conti, Fosca and Bhogaraju, Sri Krishna and Signorini, Raffaella and Liu, E and Pedron, Danilo and Elger, Gordon}, title = {Micro-Raman to detect stress phenomena in Si-chips bonded onto Cu substrates}, booktitle = {Integrated Optics: Design, Devices, Systems and Applications VI}, editor = {Cheben, Pavel and Čtyrok{\´y}, Jiř{\´i} and Molina-Fern{\´a}ndez, I{\~n}igo}, publisher = {SPIE}, address = {Bellingham}, isbn = {978-1-5106-4385-7}, doi = {https://doi.org/10.1117/12.2576414}, year = {2021}, language = {en} } @inproceedings{BhogarajuMokhtariPascuccietal.2019, author = {Bhogaraju, Sri Krishna and Mokhtari, Omid and Pascucci, Jacopo and Conti, Fosca and Kotadia, Hiren R. and Elger, Gordon}, title = {A multi-pronged approach to low-pressure Cu sintering using surface-modified particles, substrate and chip metallization}, volume = {2019}, booktitle = {International Symposium on Microelectronics}, number = {1}, publisher = {IMAPS}, address = {Pittsburgh}, issn = {2380-4505}, doi = {https://doi.org/10.4071/2380-4505-2019.1.000387}, pages = {387 -- 392}, year = {2019}, language = {en} } @inproceedings{BhogarajuMokhtariPascuccietal.2019, author = {Bhogaraju, Sri Krishna and Mokhtari, Omid and Pascucci, Jacopo and Conti, Fosca and Elger, Gordon}, title = {Improved sinterability of particles to substrates by surface modifications on substrate metallization}, volume = {2019}, booktitle = {Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)}, number = {HiTen}, publisher = {IMAPS}, address = {Pittsburgh (PA)}, issn = {2380-4491}, doi = {https://doi.org/10.4071/2380-4491.2019.HiTen.000066}, pages = {66 -- 70}, year = {2019}, language = {en} } @inproceedings{BhogarajuMokhtariPascuccietal.2020, author = {Bhogaraju, Sri Krishna and Mokhtari, Omid and Pascucci, Jacopo and Hanss, Alexander and Schmid, Maximilian and Conti, Fosca and Elger, Gordon}, title = {Hybrid Cu particle paste with surface-modified particles for high temperature electronics packaging}, booktitle = {Proceedings 22nd European Microelectronics and Packaging Conference, EMPC}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-6291-1}, doi = {https://doi.org/10.23919/EMPC44848.2019.8951887}, year = {2020}, language = {en} }