@article{MohanAhuirTorresKotadiaetal.2025, author = {Mohan, Nihesh and Ahuir-Torres, Juan Ignacio and Kotadia, Hiren R. and Elger, Gordon}, title = {Laser sintering of Cu particle-free inks for high-performance printed electronics}, volume = {9}, pages = {18}, journal = {npj Flexible Electronics}, number = {1}, publisher = {Springer}, address = {London}, issn = {2397-4621}, doi = {https://doi.org/10.1038/s41528-025-00389-5}, year = {2025}, abstract = {This study investigates laser sintering of Cu particle-free ink (Cu formate tetrahydrate—amino-2-propanol complex) as an alternative to conventional sintering in an oven (under inert/reducing atmosphere). Utilizing benefits of high-speed localized heating using laser, substrate damage can be prevented for low-melting substrates such as Polyethylene Terephthalate (PET). Firstly, a suitable sintering process window is achieved based on energy density for two different flexible polymeric susbtrates: Polyimide and PET using different laser parameters (laser power, scan rate and spot diameter). Subsequently, characterization of laser sintered traces are also made using different laser optic profiles (Gaussian and top hat). Different methodologies for fabrication of metallized Cu layer were also demonstrated. A very low bulk resistivity of 3.24 µΩcm (1.87 times of bulk Cu) was achieved on trace thickness of 0.85 ± 0.15 µm exhibiting good adherence to polymeric substrates. A promising fabrication process of low-cost and reliable flexible printed electronic devices is demonstrated.}, language = {en} } @article{BhogarajuKotadiaContietal.2021, author = {Bhogaraju, Sri Krishna and Kotadia, Hiren R. and Conti, Fosca and Mauser, Armin and Rubenbauer, Thomas and Bruetting, Robert and Schneider-Ramelow, Martin and Elger, Gordon}, title = {Die-attach bonding with etched micro brass metal pigment flakes for high-power electronics packaging}, volume = {3}, journal = {ACS Applied Electronic Materials}, number = {10}, publisher = {ACS Publications}, address = {Washington}, issn = {2637-6113}, doi = {https://doi.org/10.1021/acsaelm.1c00721}, pages = {4587 -- 4603}, year = {2021}, language = {en} } @article{BhogarajuContiKotadiaetal.2020, author = {Bhogaraju, Sri Krishna and Conti, Fosca and Kotadia, Hiren R. and Keim, Simon and Tetzlaff, Ulrich and Elger, Gordon}, title = {Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging}, volume = {2020}, pages = {156043}, journal = {Journal of Alloys and Compounds}, number = {844}, publisher = {Elsevier}, address = {Amsterdam}, issn = {1873-4669}, doi = {https://doi.org/10.1016/j.jallcom.2020.156043}, year = {2020}, language = {en} } @article{MohanAhuirTorresBhogarajuetal.2024, author = {Mohan, Nihesh and Ahuir-Torres, Juan Ignacio and Bhogaraju, Sri Krishna and Webler, Ralf and Kotadia, Hiren R. and Erdogan, H{\"u}seyin and Elger, Gordon}, title = {Decomposition mechanism and morphological evolution of in situ realized Cu nanoparticles in Cu complex inks}, volume = {48}, journal = {New Journal of Chemistry}, number = {15}, publisher = {RSC}, address = {London}, issn = {1369-9261}, doi = {https://doi.org/10.1039/D3NJ05185D}, pages = {6796 -- 6808}, year = {2024}, language = {en} }