@inproceedings{BhogarajuUgoliniBelponeretal.2024, author = {Bhogaraju, Sri Krishna and Ugolini, Francesco and Belponer, Federico and Greci, Alessio and Elger, Gordon}, title = {Reliability of Copper Sintered Interconnects Under Extreme Thermal Shock Conditions}, booktitle = {2023 24th European Microelectronics and Packaging Conference \& Exhibition (EMPC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-0-9568086-9-1}, doi = {https://doi.org/10.23919/EMPC55870.2023.10418348}, year = {2024}, language = {en} }