@inproceedings{KleinerHeiderHanzletal.2020, author = {Kleiner, Jan and Heider, Alexander and Hanzl, Christian and Komsiyska, Lidiya and Elger, Gordon and Endisch, Christian}, title = {Thermal behavior of an intelligent li-ion cell under vehicle conditions}, booktitle = {Proceedings: IECON 2020 The 46th Annual Conference of the IEEE Industrial Electronics Society}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-5414-5}, issn = {2577-1647}, doi = {https://doi.org/10.1109/IECON43393.2020.9254336}, pages = {2081 -- 2086}, year = {2020}, language = {en} } @inproceedings{ContiLiuBhogarajuetal.2020, author = {Conti, Fosca and Liu, E and Bhogaraju, Sri Krishna and Wunderle, Bernhard and Elger, Gordon}, title = {Finite Element simulations and Raman measurements to investigate thermomechanical stress in GaN-LEDs}, booktitle = {2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-6293-5}, doi = {https://doi.org/10.1109/ESTC48849.2020.9229843}, year = {2020}, language = {en} } @inproceedings{BhogarajuContiElger2020, author = {Bhogaraju, Sri Krishna and Conti, Fosca and Elger, Gordon}, title = {Copper die bonding using copper formate based pastes with α-terpineol, amino-2-propanol and hexylamine as binders}, booktitle = {2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-6293-5}, doi = {https://doi.org/10.1109/ESTC48849.2020.9229801}, year = {2020}, language = {en} } @inproceedings{KeimTetzlaffElger2020, author = {Keim, Simon and Tetzlaff, Ulrich and Elger, Gordon}, title = {The influence of different-sized Ni micro- and nanopowders on the processing and microstructural properties of Sn-Ag-Cu-solder with low Ag content}, booktitle = {Proceedings: IEEE 70th Electronic Components and Technology Conference, ECTC 2020}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-6180-8}, issn = {2377-5726}, doi = {https://doi.org/10.1109/ECTC32862.2020.00312}, pages = {2005 -- 2012}, year = {2020}, language = {en} } @inproceedings{ContiLiuBhogarajuetal.2021, author = {Conti, Fosca and Liu, E and Bhogaraju, Sri Krishna and Lenz, Christoph and Seitz, Roland and Elger, Gordon}, title = {Stress evaluations of silicon nitride chips bonded onto copper substrates via SAC soldering, AuSn soldering, and copper sintering}, booktitle = {2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-7643-7}, doi = {https://doi.org/10.1109/THERMINIC49743.2020.9420523}, pages = {204 -- 208}, year = {2021}, language = {en} } @inproceedings{SchmidBhogarajuRiedeletal.2021, author = {Schmid, Maximilian and Bhogaraju, Sri Krishna and Riedel, Andreas and Elger, Gordon}, title = {Development of an in-line capable transient thermal analysis equipment for a power module with five half bridges}, booktitle = {2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-7643-7}, doi = {https://doi.org/10.1109/THERMINIC49743.2020.9420493}, pages = {268 -- 273}, year = {2021}, language = {en} } @inproceedings{LiuSchmidBhogarajuetal.2021, author = {Liu, E and Schmid, Maximilian and Bhogaraju, Sri Krishna and Elger, Gordon}, title = {Advanced location resolved transient thermal analysis}, booktitle = {2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-7643-7}, doi = {https://doi.org/10.1109/THERMINIC49743.2020.9420538}, pages = {191 -- 196}, year = {2021}, language = {en} } @article{MokhtariContiSacconetal.2021, author = {Mokhtari, Omid and Conti, Fosca and Saccon, Rodolfo and Bhogaraju, Sri Krishna and Elger, Gordon}, title = {Formic acid and formate salts for chemical vapor deposition of copper on glass substrates at atmospheric pressure}, volume = {45}, journal = {New Journal of Chemistry}, number = {43}, publisher = {RSC}, address = {London}, issn = {1369-9261}, doi = {https://doi.org/10.1039/D1NJ02476K}, pages = {20133 -- 20139}, year = {2021}, language = {en} } @article{BhogarajuKotadiaContietal.2021, author = {Bhogaraju, Sri Krishna and Kotadia, Hiren R. and Conti, Fosca and Mauser, Armin and Rubenbauer, Thomas and Bruetting, Robert and Schneider-Ramelow, Martin and Elger, Gordon}, title = {Die-attach bonding with etched micro brass metal pigment flakes for high-power electronics packaging}, volume = {3}, journal = {ACS Applied Electronic Materials}, number = {10}, publisher = {ACS Publications}, address = {Washington}, issn = {2637-6113}, doi = {https://doi.org/10.1021/acsaelm.1c00721}, pages = {4587 -- 4603}, year = {2021}, language = {en} } @article{KleinerSinghSchmidetal.2020, author = {Kleiner, Jan and Singh, Randeep and Schmid, Michael and Komsiyska, Lidiya and Elger, Gordon and Endisch, Christian}, title = {Influence of heat pipe assisted terminal cooling on the thermal behavior of a large prismatic lithium-ion cell during fast charging in electric vehicles}, volume = {2021}, pages = {116328}, journal = {Applied Thermal Engineering}, number = {188}, publisher = {Elsevier}, address = {Amsterdam}, issn = {1359-4311}, doi = {https://doi.org/10.1016/j.applthermaleng.2020.116328}, year = {2020}, language = {en} } @article{SchmidBhogarajuHanssetal.2021, author = {Schmid, Maximilian and Bhogaraju, Sri Krishna and Hanss, Alexander and Elger, Gordon}, title = {A new noise-suppression algorithm for transient thermal analysis in semiconductors over pulse superposition}, volume = {70}, pages = {6500409}, journal = {IEEE Transactions on Instrumentation and Measurement}, publisher = {IEEE}, address = {New York}, issn = {0018-9456}, doi = {https://doi.org/10.1109/TIM.2020.3011818}, year = {2021}, language = {en} } @article{BhogarajuMokhtariContietal.2020, author = {Bhogaraju, Sri Krishna and Mokhtari, Omid and Conti, Fosca and Elger, Gordon}, title = {Die-attach bonding for high temperature applications using thermal decomposition of copper(II) formate with polyethylene glycol}, volume = {2020}, journal = {Scripta Materialia}, number = {182}, publisher = {Elsevier}, address = {Amsterdam}, issn = {1359-6462}, doi = {https://doi.org/10.1016/j.scriptamat.2020.02.045}, pages = {74 -- 80}, year = {2020}, language = {en} } @article{BhogarajuContiKotadiaetal.2020, author = {Bhogaraju, Sri Krishna and Conti, Fosca and Kotadia, Hiren R. and Keim, Simon and Tetzlaff, Ulrich and Elger, Gordon}, title = {Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging}, volume = {2020}, pages = {156043}, journal = {Journal of Alloys and Compounds}, number = {844}, publisher = {Elsevier}, address = {Amsterdam}, issn = {1873-4669}, doi = {https://doi.org/10.1016/j.jallcom.2020.156043}, year = {2020}, language = {en} } @article{MokhtariContiBhogarajuetal.2019, author = {Mokhtari, Omid and Conti, Fosca and Bhogaraju, Sri Krishna and Meier, Markus and Schweigart, Helmut and Tetzlaff, Ulrich and Elger, Gordon}, title = {Characterization of tin-oxides and tin-formate crystals obtained from SnAgCu solder alloy under formic acid vapor}, volume = {43}, journal = {New Journal of Chemistry}, number = {26}, publisher = {RSC}, address = {London}, issn = {1369-9261}, doi = {https://doi.org/10.1039/C9NJ02135C}, pages = {10227 -- 10231}, year = {2019}, language = {en} } @inproceedings{KleinerKomsiyskaElgeretal.2019, author = {Kleiner, Jan and Komsiyska, Lidiya and Elger, Gordon and Endisch, Christian}, title = {Modelling of 3D temperature behavior of prismatic lithium-ion cell with focus on experimental validation under battery electric vehicle conditions}, booktitle = {2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-2078-2}, doi = {https://doi.org/10.1109/THERMINIC.2019.8923604}, year = {2019}, language = {en} } @inproceedings{ZippeliusHanssLiuetal.2020, author = {Zippelius, Andreas and Hanss, Alexander and Liu, E and Schmid, Maximilian and P{\´e}rez-Vel{\´a}zquez, Judith and Elger, Gordon}, title = {Comparing prediction methods for LED failure measured with Transient Thermal Analysis}, booktitle = {2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-6049-8}, doi = {https://doi.org/10.1109/EuroSimE48426.2020.9152657}, year = {2020}, language = {en} } @inproceedings{BhogarajuContiSchmidetal.2020, author = {Bhogaraju, Sri Krishna and Conti, Fosca and Schmid, Maximilian and Meier, Markus and Schweigart, Helmut and Elger, Gordon}, title = {Development of sinter paste with surface modified copper alloy particles for die-attach bonding}, booktitle = {ETG-Fachbericht 161, CIPS 2020, 11th International Conference on Integrated Power Electronics Systems}, publisher = {VDE Verlag}, address = {Berlin}, isbn = {978-3-8007-5226-3}, url = {https://www.vde-verlag.de/proceedings-de/455225100.html}, pages = {582 -- 587}, year = {2020}, language = {en} } @inproceedings{HanssLiuAbdullahetal.2019, author = {Hanss, Alexander and Liu, E and Abdullah, Muhammad Rizwan and Elger, Gordon}, title = {Failure Identification in LED packages by Transient Thermal Analysis and Calibrated FE Models}, booktitle = {2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-5386-8040-7}, doi = {https://doi.org/10.1109/EuroSimE.2019.8724558}, year = {2019}, language = {en} } @inproceedings{ElgerLiuContietal.2019, author = {Elger, Gordon and Liu, E and Conti, Fosca and Signorini, Raffaella and Brugnolotto, Enrico and Bhogaraju, Sri Krishna}, title = {Modelling Thermo-Mechanical Stress in GaN-LEDs Soldered on Copper Substrate with Simulations Validated by Raman Experiments}, booktitle = {2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-5386-8040-7}, doi = {https://doi.org/10.1109/EuroSimE.2019.8724533}, year = {2019}, language = {en} } @inproceedings{ElgerMokhtariBhogarajuetal.2020, author = {Elger, Gordon and Mokhtari, Omid and Bhogaraju, Sri Krishna and Conti, Fosca and Meier, Markus and Schweigart, Helmut}, title = {Analyse der Reaktionsprodukte von Metall-Formiaten im r{\"u}ckstandfreien L{\"o}tprozess}, booktitle = {GMM-Fb. 94: EBL 2020 - Elektronische Baugruppen und Leiterplatten}, publisher = {VDE Verlag}, address = {Berlin}, isbn = {978-3-8007-5185-3}, doi = {https://www.vde-verlag.de/proceedings-de/455185053.html}, year = {2020}, language = {de} }