@inproceedings{BhogarajuSchmidLiuetal.2022, author = {Bhogaraju, Sri Krishna and Schmid, Maximilian and Liu, E and Saccon, Rodolfo and Elger, Gordon and Klassen, Holger and M{\"u}ller, Klaus and Pirzer, Georg}, title = {Low cost copper based sintered interconnect material for optoelectronics packaging}, booktitle = {2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-6654-7943-1}, doi = {https://doi.org/10.1109/ECTC51906.2022.00270}, pages = {1720 -- 1725}, year = {2022}, language = {en} }