@inproceedings{MohanBhogarajuLysienetal.2021, author = {Mohan, Nihesh and Bhogaraju, Sri Krishna and Lysien, Mateusz and Schneider, Ludovic and Granek, Filip and Lux, Kerstin and Elger, Gordon}, title = {Drop feature optimization for fine trace inkjet printing}, booktitle = {2021 23rd European Microelectronics and Packaging Conference \& Exhibition (EMPC): Technical Papers}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-0-9568086-7-7}, doi = {https://doi.org/10.23919/EMPC53418.2021.9585004}, year = {2021}, language = {en} } @inproceedings{BhogarajuSchmidKotadiaetal.2021, author = {Bhogaraju, Sri Krishna and Schmid, Maximilian and Kotadia, Hiren R. and Conti, Fosca and Elger, Gordon}, title = {Highly reliable die-attach bonding with etched brass flakes}, booktitle = {2021 23rd European Microelectronics and Packaging Conference \& Exhibition (EMPC): Technical Papers}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-0-9568086-7-7}, doi = {https://doi.org/10.23919/EMPC53418.2021.9584967}, year = {2021}, language = {en} } @inproceedings{SteinbergerBhogarajuElger2023, author = {Steinberger, Fabian and Bhogaraju, Sri Krishna and Elger, Gordon}, title = {Correlation between the characteristics of printed sinter paste and the quality of sintered interconnects through non-destructive analysis techniques}, booktitle = {NordPac 2023 Annual Microelectronics and Packaging Conference and Exhibition: Reviewed Papers}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-91-89821-06-4}, doi = {https://doi.org/10.23919/NordPac58023.2023.10186250}, year = {2023}, language = {en} } @inproceedings{KettelgerdesElger2022, author = {Kettelgerdes, Marcel and Elger, Gordon}, title = {Modeling Methodology and In-field Measurement Setup to Develop Empiric Weather Models for Solid-State LiDAR Sensors}, booktitle = {2022 IEEE 2nd International Conference on Digital Twins and Parallel Intelligence (DTPI)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-6654-9227-0}, doi = {https://doi.org/10.1109/DTPI55838.2022.9998918}, year = {2022}, language = {en} } @inproceedings{TavakolibastiMeszmerKettelgerdesetal.2022, author = {Tavakolibasti, M. and Meszmer, P. and Kettelgerdes, Marcel and B{\"o}ttger, Gunnar and Elger, Gordon and Erdogan, H{\"u}seyin and Seshaditya, A. and Wunderle, Bernhard}, title = {Structural-thermal-optical-performance (STOP) analysis of a lens stack for realization of a digital twin of an automotive LiDAR}, booktitle = {2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, publisher = {IEEE}, address = {Piscataway, NJ}, isbn = {978-1-6654-5836-8}, doi = {https://doi.org/10.1109/EuroSimE54907.2022.9758897}, year = {2022}, language = {en} } @inproceedings{HermannSchmidElger2022, author = {Hermann, Joseph and Schmid, Maximilian and Elger, Gordon}, title = {Crack Growth Prediction in High-Power LEDs from TTA, SAM and Simulated Data}, booktitle = {THERMINIC 2022: Proceedings 2022}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-6654-9229-4}, doi = {https://doi.org/10.1109/THERMINIC57263.2022.9950673}, year = {2022}, language = {en} } @inproceedings{MohanAhuirTorresBhogarajuetal.2024, author = {Mohan, Nihesh and Ahuir-Torres, Juan Ignacio and Bhogaraju, Sri Krishna and Kotadia, Hiren R. and Elger, Gordon}, title = {Rapid Sintering of Inkjet Printed Cu Complex Inks Using Laser in Air}, booktitle = {2023 24th European Microelectronics and Packaging Conference \& Exhibition (EMPC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-0-9568086-9-1}, doi = {https://doi.org/10.23919/EMPC55870.2023.10418323}, year = {2024}, language = {en} } @inproceedings{BhogarajuUgoliniBelponeretal.2024, author = {Bhogaraju, Sri Krishna and Ugolini, Francesco and Belponer, Federico and Greci, Alessio and Elger, Gordon}, title = {Reliability of Copper Sintered Interconnects Under Extreme Thermal Shock Conditions}, booktitle = {2023 24th European Microelectronics and Packaging Conference \& Exhibition (EMPC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-0-9568086-9-1}, doi = {https://doi.org/10.23919/EMPC55870.2023.10418348}, year = {2024}, language = {en} } @inproceedings{BhogarajuMohanSteinbergeretal.2024, author = {Bhogaraju, Sri Krishna and Mohan, Nihesh and Steinberger, Fabian and Erdogan, H{\"u}seyin and Hadrava, Philipp and Elger, Gordon}, title = {Novel Low Temperature and Low Pressure Sintering of ADAS Radar Sensor Antenna Stack}, booktitle = {2023 24th European Microelectronics and Packaging Conference \& Exhibition (EMPC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-0-9568086-9-1}, doi = {https://doi.org/10.23919/EMPC55870.2023.10418277}, year = {2024}, language = {en} } @inproceedings{AhuirTorresBhogarajuWestetal.2024, author = {Ahuir-Torres, Juan Ignacio and Bhogaraju, Sri Krishna and West, Geoff and Elger, Gordon and Kotadia, Hiren R.}, title = {Understanding Cu Sintering and Its Role on Corrosion Behaviour for High-Temperature Microelectronic Application}, booktitle = {2023 24th European Microelectronics and Packaging Conference \& Exhibition (EMPC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-0-9568086-9-1}, doi = {https://doi.org/10.23919/EMPC55870.2023.10418365}, year = {2024}, language = {en} } @inproceedings{HanKefferpuetzElgeretal.2024, author = {Han, Longfei and Kefferp{\"u}tz, Klaus and Elger, Gordon and Beyerer, J{\"u}rgen}, title = {FlexSense: Flexible Infrastructure Sensors for Traffic Perception}, booktitle = {2023 IEEE 26th International Conference on Intelligent Transportation Systems (ITSC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {979-8-3503-9946-2}, doi = {https://doi.org/10.1109/ITSC57777.2023.10422616}, pages = {3810 -- 3816}, year = {2024}, language = {en} } @inproceedings{HanXuKefferpuetzetal.2024, author = {Han, Longfei and Xu, Qiuyu and Kefferp{\"u}tz, Klaus and Lu, Ying and Elger, Gordon and Beyerer, J{\"u}rgen}, title = {Scalable Radar-based Roadside Perception: Self-localization and Occupancy Heat Map for Traffic Analysis}, booktitle = {2024 IEEE Intelligent Vehicles Symposium (IV)}, publisher = {IEEE}, address = {Piscataway}, isbn = {979-8-3503-4881-1}, doi = {https://doi.org/10.1109/iv55156.2024.10588397}, pages = {1651 -- 1657}, year = {2024}, language = {en} } @inproceedings{OlcayMeessElger2024, author = {Olcay, Ertug and Meeß, Henri and Elger, Gordon}, title = {Dynamic Obstacle Avoidance for UAVs using MPC and GP-Based Motion Forecast}, booktitle = {2024 European Control Conference (ECC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-3-9071-4410-7}, doi = {https://doi.org/10.23919/ECC64448.2024.10591083}, pages = {1024 -- 1031}, year = {2024}, language = {en} } @inproceedings{ParetBhogarajuBusseetal.2024, author = {Paret, Paul and Bhogaraju, Sri Krishna and Busse, Dirk and Dahlb{\"u}dding, Alexander and Elger, Gordon and Narumanchi, Sreekant}, title = {Thermomechanical Degradation of Sintered Copper under High-Temperature Thermal Shock}, booktitle = {Proceedings: IEEE 74th Electronic Components and Technology Conference, ECTC 2024}, publisher = {IEEE}, address = {Piscataway}, isbn = {979-8-3503-7598-5}, doi = {https://doi.org/10.1109/ECTC51529.2024.00196}, pages = {1219 -- 1224}, year = {2024}, language = {en} } @inproceedings{SteinbergerMohanRaemeretal.2024, author = {Steinberger, Fabian and Mohan, Nihesh and R{\"a}mer, Olaf and Elger, Gordon}, title = {Low temperature die-attach bonding using copper particle free inks}, booktitle = {2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), Proceedings}, publisher = {IEEE}, address = {Piscataway}, isbn = {979-8-3503-9036-0}, doi = {https://doi.org/10.1109/ESTC60143.2024.10712150}, year = {2024}, language = {en} } @inproceedings{AgrawalSongKohlietal.2022, author = {Agrawal, Shiva and Song, Rui and Kohli, Akhil and Korb, Andreas and Andre, Maximilian and Holzinger, Erik and Elger, Gordon}, title = {Concept of Smart Infrastructure for Connected Vehicle Assist and Traffic Flow Optimization}, booktitle = {Proceedings of the 8th International Conference on Vehicle Technology and Intelligent Transport Systems}, editor = {Ploeg, Jeroen and Helfert, Markus and Berns, Karsten and Gusikhin, Oleg}, publisher = {SciTePress}, address = {Set{\´u}bal}, isbn = {978-989-758-573-9}, issn = {2184-495X}, doi = {https://doi.org/10.5220/0011068800003191}, pages = {360 -- 367}, year = {2022}, abstract = {The smart infrastructure units can play a vital role to develop smart cities of the future and in assisting automated vehicles on the road by providing extended perception and timely warnings to avoid accidents. This paper focuses on the development of such an infrastructure unit, that is specifically designed for a pedestrian crossing junction. It can control traffic lights at the junction by real-time environment perception through its sensors and can optimize the flow of vehicles and passing vulnerable road users (VRUs). Moreover, it can assist on-road vehicles by providing real-time information and critical warnings via a v2x module. This paper further describes different use-cases of the work, all major hardware components involved in the development of smart infrastructure unit, referred to as an edge, different sensor fusion approaches using the camera, radar, and lidar mounted on the edge for environment perception, various modes of communication including v2x, system design}, language = {en} } @inproceedings{StreckHerschelWallrathetal.2022, author = {Streck, Egor and Herschel, Reinhold and Wallrath, Patrick and Sunderam, M. and Elger, Gordon}, title = {Comparison of Two Different Radar Concepts for Pedestrian Protection on Bus Stops}, booktitle = {Proceedings of the 11th International Conference on Sensor Networks}, editor = {Prasad, Venkatesha and Pesch, Dirk and Ansari, Nirwan and Benavente-Peces, C{\´e}sar}, publisher = {SciTePress}, address = {Set{\´u}bal}, isbn = {978-989-758-551-7}, issn = {2184-4380}, doi = {https://doi.org/10.5220/0010777100003118}, pages = {89 -- 96}, year = {2022}, abstract = {This paper presents the joint work from the "HORIS" project, with a focus on pedestrian detection at bus-stops by radar sensors mounted in the infrastructure to support future autonomous driving and protecting pedestrians in critical situations. Two sensor systems are investigated and evaluated. The first based on single radar sensor phase-sensitive raw data analysis and the second based on sensor data fusion of cluster data with two radar sensors using neural networks to predict the position of pedestrians.}, language = {en} } @inproceedings{ContiLuxBhogarajuetal.2021, author = {Conti, Fosca and Lux, Kerstin and Bhogaraju, Sri Krishna and Liu, E and Lenz, Christoph and Seitz, Roland and Elger, Gordon}, title = {Raman spectroscopy to investigate gallium nitride light emitting diodes after assembling onto copper substrates}, booktitle = {Optical Sensors 2021}, editor = {Baldini, Francesco and Homola, Jiri and Lieberman, Robert A.}, publisher = {SPIE}, address = {Bellingham}, isbn = {978-1-5106-4379-6}, doi = {https://doi.org/10.1117/12.2591947}, year = {2021}, language = {en} } @inproceedings{MohdKreinerSchmidetal.2024, author = {Mohd, Zubair Akhtar and Kreiner, Christian and Schmid, Maximilian and Zippelius, Andreas and Tetzlaff, Ulrich and Elger, Gordon}, title = {Fully Connected Neural Network (FCNN) Based Validation Framework for FEA Post Processing to Improve SAC Solder Reliability Analysis}, booktitle = {2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), Proceedings}, publisher = {IEEE}, address = {Piscataway}, isbn = {979-8-3503-9036-0}, doi = {https://doi.org/10.1109/ESTC60143.2024.10712023}, year = {2024}, language = {en} } @inproceedings{MohdSchmidZippeliusetal.2024, author = {Mohd, Zubair Akhtar and Schmid, Maximilian and Zippelius, Andreas and Elger, Gordon}, title = {LEDs Lifetime Prediction Modeling: Thermomechanical Simulation for SAC305 and SAC105}, booktitle = {2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, publisher = {IEEE}, address = {Piscataway}, isbn = {979-8-3503-9363-7}, doi = {https://doi.org/10.1109/EuroSimE60745.2024.10491530}, year = {2024}, language = {en} }