@inproceedings{PascucciContiBhogarajuetal.2021, author = {Pascucci, Jacopo and Conti, Fosca and Bhogaraju, Sri Krishna and Signorini, Raffaella and Liu, E and Pedron, Danilo and Elger, Gordon}, title = {Micro-Raman to detect stress phenomena in Si-chips bonded onto Cu substrates}, booktitle = {Integrated Optics: Design, Devices, Systems and Applications VI}, editor = {Cheben, Pavel and Čtyrok{\´y}, Jiř{\´i} and Molina-Fern{\´a}ndez, I{\~n}igo}, publisher = {SPIE}, address = {Bellingham}, isbn = {978-1-5106-4385-7}, doi = {https://doi.org/10.1117/12.2576414}, year = {2021}, language = {en} } @inproceedings{SignoriniContiBrugnolottoetal.2019, author = {Signorini, Raffaella and Conti, Fosca and Brugnolotto, Enrico and Pedron, Danilo and Liu, E and Bhogaraju, Sri Krishna and Elger, Gordon}, title = {Thermomechanical local stress in assembled GaN LEDs investigated by Raman optical spectroscopy}, booktitle = {Integrated Optics: Design, Devices, Systems, and Applications V}, editor = {Cheben, Pavel and Čtyrok{\´y}, Jiř{\´i} and Molina-Fern{\´a}ndez, I{\~n}igo}, publisher = {SPIE}, address = {Bellingham}, isbn = {978-1-5106-2729-1}, doi = {https://doi.org/10.1117/12.2520992}, year = {2019}, language = {en} } @inproceedings{BrugnolottoBhogarajuLiuetal.2019, author = {Brugnolotto, Enrico and Bhogaraju, Sri Krishna and Liu, E and Conti, Fosca and Pedron, Danilo and Signorini, Raffaella and Elger, Gordon}, title = {Investigation of thermomechanical local stress induced in assembled GaN LEDs}, booktitle = {2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-2078-2}, doi = {https://doi.org/10.1109/THERMINIC.2019.8923629}, year = {2019}, language = {en} } @inproceedings{SignoriniPedronContietal.2018, author = {Signorini, Raffaella and Pedron, Danilo and Conti, Fosca and Hanss, Alexander and Bhogaraju, Sri Krishna and Elger, Gordon}, title = {Thermomechanical Stress in GaN LED Soldered on Copper Substrate Evaluated by Raman Measurements and Computer Modelling}, booktitle = {2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-5386-6759-0}, doi = {https://doi.org/10.1109/THERMINIC.2018.8593304}, year = {2018}, language = {en} }