@inproceedings{SchmidBhogarajuRiedeletal.2021, author = {Schmid, Maximilian and Bhogaraju, Sri Krishna and Riedel, Andreas and Elger, Gordon}, title = {Development of an in-line capable transient thermal analysis equipment for a power module with five half bridges}, booktitle = {2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-7643-7}, doi = {https://doi.org/10.1109/THERMINIC49743.2020.9420493}, pages = {268 -- 273}, year = {2021}, language = {en} } @inproceedings{LiuSchmidBhogarajuetal.2021, author = {Liu, E and Schmid, Maximilian and Bhogaraju, Sri Krishna and Elger, Gordon}, title = {Advanced location resolved transient thermal analysis}, booktitle = {2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-7643-7}, doi = {https://doi.org/10.1109/THERMINIC49743.2020.9420538}, pages = {191 -- 196}, year = {2021}, language = {en} } @article{MokhtariContiSacconetal.2021, author = {Mokhtari, Omid and Conti, Fosca and Saccon, Rodolfo and Bhogaraju, Sri Krishna and Elger, Gordon}, title = {Formic acid and formate salts for chemical vapor deposition of copper on glass substrates at atmospheric pressure}, volume = {45}, journal = {New Journal of Chemistry}, number = {43}, publisher = {RSC}, address = {London}, issn = {1369-9261}, doi = {https://doi.org/10.1039/D1NJ02476K}, pages = {20133 -- 20139}, year = {2021}, language = {en} } @article{BhogarajuKotadiaContietal.2021, author = {Bhogaraju, Sri Krishna and Kotadia, Hiren R. and Conti, Fosca and Mauser, Armin and Rubenbauer, Thomas and Bruetting, Robert and Schneider-Ramelow, Martin and Elger, Gordon}, title = {Die-attach bonding with etched micro brass metal pigment flakes for high-power electronics packaging}, volume = {3}, journal = {ACS Applied Electronic Materials}, number = {10}, publisher = {ACS Publications}, address = {Washington}, issn = {2637-6113}, doi = {https://doi.org/10.1021/acsaelm.1c00721}, pages = {4587 -- 4603}, year = {2021}, language = {en} } @article{SchmidBhogarajuHanssetal.2021, author = {Schmid, Maximilian and Bhogaraju, Sri Krishna and Hanss, Alexander and Elger, Gordon}, title = {A new noise-suppression algorithm for transient thermal analysis in semiconductors over pulse superposition}, volume = {70}, pages = {6500409}, journal = {IEEE Transactions on Instrumentation and Measurement}, publisher = {IEEE}, address = {New York}, issn = {0018-9456}, doi = {https://doi.org/10.1109/TIM.2020.3011818}, year = {2021}, language = {en} } @article{BhogarajuMokhtariContietal.2020, author = {Bhogaraju, Sri Krishna and Mokhtari, Omid and Conti, Fosca and Elger, Gordon}, title = {Die-attach bonding for high temperature applications using thermal decomposition of copper(II) formate with polyethylene glycol}, volume = {2020}, journal = {Scripta Materialia}, number = {182}, publisher = {Elsevier}, address = {Amsterdam}, issn = {1359-6462}, doi = {https://doi.org/10.1016/j.scriptamat.2020.02.045}, pages = {74 -- 80}, year = {2020}, language = {en} } @article{BhogarajuContiKotadiaetal.2020, author = {Bhogaraju, Sri Krishna and Conti, Fosca and Kotadia, Hiren R. and Keim, Simon and Tetzlaff, Ulrich and Elger, Gordon}, title = {Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging}, volume = {2020}, pages = {156043}, journal = {Journal of Alloys and Compounds}, number = {844}, publisher = {Elsevier}, address = {Amsterdam}, issn = {1873-4669}, doi = {https://doi.org/10.1016/j.jallcom.2020.156043}, year = {2020}, language = {en} } @article{MokhtariContiBhogarajuetal.2019, author = {Mokhtari, Omid and Conti, Fosca and Bhogaraju, Sri Krishna and Meier, Markus and Schweigart, Helmut and Tetzlaff, Ulrich and Elger, Gordon}, title = {Characterization of tin-oxides and tin-formate crystals obtained from SnAgCu solder alloy under formic acid vapor}, volume = {43}, journal = {New Journal of Chemistry}, number = {26}, publisher = {RSC}, address = {London}, issn = {1369-9261}, doi = {https://doi.org/10.1039/C9NJ02135C}, pages = {10227 -- 10231}, year = {2019}, language = {en} } @inproceedings{BhogarajuContiSchmidetal.2020, author = {Bhogaraju, Sri Krishna and Conti, Fosca and Schmid, Maximilian and Meier, Markus and Schweigart, Helmut and Elger, Gordon}, title = {Development of sinter paste with surface modified copper alloy particles for die-attach bonding}, booktitle = {ETG-Fachbericht 161, CIPS 2020, 11th International Conference on Integrated Power Electronics Systems}, publisher = {VDE Verlag}, address = {Berlin}, isbn = {978-3-8007-5226-3}, url = {https://www.vde-verlag.de/proceedings-de/455225100.html}, pages = {582 -- 587}, year = {2020}, language = {en} } @inproceedings{ElgerLiuContietal.2019, author = {Elger, Gordon and Liu, E and Conti, Fosca and Signorini, Raffaella and Brugnolotto, Enrico and Bhogaraju, Sri Krishna}, title = {Modelling Thermo-Mechanical Stress in GaN-LEDs Soldered on Copper Substrate with Simulations Validated by Raman Experiments}, booktitle = {2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-5386-8040-7}, doi = {https://doi.org/10.1109/EuroSimE.2019.8724533}, year = {2019}, language = {en} } @inproceedings{ElgerMokhtariBhogarajuetal.2020, author = {Elger, Gordon and Mokhtari, Omid and Bhogaraju, Sri Krishna and Conti, Fosca and Meier, Markus and Schweigart, Helmut}, title = {Analyse der Reaktionsprodukte von Metall-Formiaten im r{\"u}ckstandfreien L{\"o}tprozess}, booktitle = {GMM-Fb. 94: EBL 2020 - Elektronische Baugruppen und Leiterplatten}, publisher = {VDE Verlag}, address = {Berlin}, isbn = {978-3-8007-5185-3}, doi = {https://www.vde-verlag.de/proceedings-de/455185053.html}, year = {2020}, language = {de} }