@inproceedings{LiuSchmidBhogarajuetal.2021, author = {Liu, E and Schmid, Maximilian and Bhogaraju, Sri Krishna and Elger, Gordon}, title = {Advanced location resolved transient thermal analysis}, booktitle = {2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-7643-7}, doi = {https://doi.org/10.1109/THERMINIC49743.2020.9420538}, pages = {191 -- 196}, year = {2021}, language = {en} } @article{MokhtariContiSacconetal.2021, author = {Mokhtari, Omid and Conti, Fosca and Saccon, Rodolfo and Bhogaraju, Sri Krishna and Elger, Gordon}, title = {Formic acid and formate salts for chemical vapor deposition of copper on glass substrates at atmospheric pressure}, volume = {45}, journal = {New Journal of Chemistry}, number = {43}, publisher = {RSC}, address = {London}, issn = {1369-9261}, doi = {https://doi.org/10.1039/D1NJ02476K}, pages = {20133 -- 20139}, year = {2021}, language = {en} } @article{BhogarajuKotadiaContietal.2021, author = {Bhogaraju, Sri Krishna and Kotadia, Hiren R. and Conti, Fosca and Mauser, Armin and Rubenbauer, Thomas and Bruetting, Robert and Schneider-Ramelow, Martin and Elger, Gordon}, title = {Die-attach bonding with etched micro brass metal pigment flakes for high-power electronics packaging}, volume = {3}, journal = {ACS Applied Electronic Materials}, number = {10}, publisher = {ACS Publications}, address = {Washington}, issn = {2637-6113}, doi = {https://doi.org/10.1021/acsaelm.1c00721}, pages = {4587 -- 4603}, year = {2021}, language = {en} } @article{SchmidBhogarajuHanssetal.2021, author = {Schmid, Maximilian and Bhogaraju, Sri Krishna and Hanss, Alexander and Elger, Gordon}, title = {A new noise-suppression algorithm for transient thermal analysis in semiconductors over pulse superposition}, volume = {70}, pages = {6500409}, journal = {IEEE Transactions on Instrumentation and Measurement}, publisher = {IEEE}, address = {New York}, issn = {0018-9456}, doi = {https://doi.org/10.1109/TIM.2020.3011818}, year = {2021}, language = {en} } @article{BhogarajuMokhtariContietal.2020, author = {Bhogaraju, Sri Krishna and Mokhtari, Omid and Conti, Fosca and Elger, Gordon}, title = {Die-attach bonding for high temperature applications using thermal decomposition of copper(II) formate with polyethylene glycol}, volume = {2020}, journal = {Scripta Materialia}, number = {182}, publisher = {Elsevier}, address = {Amsterdam}, issn = {1359-6462}, doi = {https://doi.org/10.1016/j.scriptamat.2020.02.045}, pages = {74 -- 80}, year = {2020}, language = {en} } @article{BhogarajuContiKotadiaetal.2020, author = {Bhogaraju, Sri Krishna and Conti, Fosca and Kotadia, Hiren R. and Keim, Simon and Tetzlaff, Ulrich and Elger, Gordon}, title = {Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging}, volume = {2020}, pages = {156043}, journal = {Journal of Alloys and Compounds}, number = {844}, publisher = {Elsevier}, address = {Amsterdam}, issn = {1873-4669}, doi = {https://doi.org/10.1016/j.jallcom.2020.156043}, year = {2020}, language = {en} } @article{MokhtariContiBhogarajuetal.2019, author = {Mokhtari, Omid and Conti, Fosca and Bhogaraju, Sri Krishna and Meier, Markus and Schweigart, Helmut and Tetzlaff, Ulrich and Elger, Gordon}, title = {Characterization of tin-oxides and tin-formate crystals obtained from SnAgCu solder alloy under formic acid vapor}, volume = {43}, journal = {New Journal of Chemistry}, number = {26}, publisher = {RSC}, address = {London}, issn = {1369-9261}, doi = {https://doi.org/10.1039/C9NJ02135C}, pages = {10227 -- 10231}, year = {2019}, language = {en} } @inproceedings{BhogarajuContiSchmidetal.2020, author = {Bhogaraju, Sri Krishna and Conti, Fosca and Schmid, Maximilian and Meier, Markus and Schweigart, Helmut and Elger, Gordon}, title = {Development of sinter paste with surface modified copper alloy particles for die-attach bonding}, booktitle = {ETG-Fachbericht 161, CIPS 2020, 11th International Conference on Integrated Power Electronics Systems}, publisher = {VDE Verlag}, address = {Berlin}, isbn = {978-3-8007-5226-3}, url = {https://www.vde-verlag.de/proceedings-de/455225100.html}, pages = {582 -- 587}, year = {2020}, language = {en} } @inproceedings{ElgerLiuContietal.2019, author = {Elger, Gordon and Liu, E and Conti, Fosca and Signorini, Raffaella and Brugnolotto, Enrico and Bhogaraju, Sri Krishna}, title = {Modelling Thermo-Mechanical Stress in GaN-LEDs Soldered on Copper Substrate with Simulations Validated by Raman Experiments}, booktitle = {2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-5386-8040-7}, doi = {https://doi.org/10.1109/EuroSimE.2019.8724533}, year = {2019}, language = {en} } @inproceedings{ElgerMokhtariBhogarajuetal.2020, author = {Elger, Gordon and Mokhtari, Omid and Bhogaraju, Sri Krishna and Conti, Fosca and Meier, Markus and Schweigart, Helmut}, title = {Analyse der Reaktionsprodukte von Metall-Formiaten im r{\"u}ckstandfreien L{\"o}tprozess}, booktitle = {GMM-Fb. 94: EBL 2020 - Elektronische Baugruppen und Leiterplatten}, publisher = {VDE Verlag}, address = {Berlin}, isbn = {978-3-8007-5185-3}, doi = {https://www.vde-verlag.de/proceedings-de/455185053.html}, year = {2020}, language = {de} } @inproceedings{BhogarajuMokhtariPascuccietal.2019, author = {Bhogaraju, Sri Krishna and Mokhtari, Omid and Pascucci, Jacopo and Conti, Fosca and Kotadia, Hiren R. and Elger, Gordon}, title = {A multi-pronged approach to low-pressure Cu sintering using surface-modified particles, substrate and chip metallization}, volume = {2019}, booktitle = {International Symposium on Microelectronics}, number = {1}, publisher = {IMAPS}, address = {Pittsburgh}, issn = {2380-4505}, doi = {https://doi.org/10.4071/2380-4505-2019.1.000387}, pages = {387 -- 392}, year = {2019}, language = {en} } @inproceedings{BhogarajuMokhtariPascuccietal.2019, author = {Bhogaraju, Sri Krishna and Mokhtari, Omid and Pascucci, Jacopo and Conti, Fosca and Elger, Gordon}, title = {Improved sinterability of particles to substrates by surface modifications on substrate metallization}, volume = {2019}, booktitle = {Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)}, number = {HiTen}, publisher = {IMAPS}, address = {Pittsburgh (PA)}, issn = {2380-4491}, doi = {https://doi.org/10.4071/2380-4491.2019.HiTen.000066}, pages = {66 -- 70}, year = {2019}, language = {en} } @inproceedings{SignoriniContiBrugnolottoetal.2019, author = {Signorini, Raffaella and Conti, Fosca and Brugnolotto, Enrico and Pedron, Danilo and Liu, E and Bhogaraju, Sri Krishna and Elger, Gordon}, title = {Thermomechanical local stress in assembled GaN LEDs investigated by Raman optical spectroscopy}, booktitle = {Integrated Optics: Design, Devices, Systems, and Applications V}, editor = {Cheben, Pavel and Čtyrok{\´y}, Jiř{\´i} and Molina-Fern{\´a}ndez, I{\~n}igo}, publisher = {SPIE}, address = {Bellingham}, isbn = {978-1-5106-2729-1}, doi = {https://doi.org/10.1117/12.2520992}, year = {2019}, language = {en} } @inproceedings{SchmidHanssBhogarajuetal.2019, author = {Schmid, Maximilian and Hanss, Alexander and Bhogaraju, Sri Krishna and Elger, Gordon}, title = {Time saving averaging algorithm for transient thermal analyses over deterministic pulse superposition}, booktitle = {2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-2078-2}, doi = {https://doi.org/10.1109/THERMINIC.2019.8923548}, year = {2019}, language = {en} } @inproceedings{BrugnolottoBhogarajuLiuetal.2019, author = {Brugnolotto, Enrico and Bhogaraju, Sri Krishna and Liu, E and Conti, Fosca and Pedron, Danilo and Signorini, Raffaella and Elger, Gordon}, title = {Investigation of thermomechanical local stress induced in assembled GaN LEDs}, booktitle = {2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-2078-2}, doi = {https://doi.org/10.1109/THERMINIC.2019.8923629}, year = {2019}, language = {en} } @inproceedings{SchmidBhogarajuElger2019, author = {Schmid, Maximilian and Bhogaraju, Sri Krishna and Elger, Gordon}, title = {Automatic transient thermal impedance tester for quality inspection of soldered and sintered power electronic devices on panel and tile level}, booktitle = {2019 IEEE 69th Electronic Components and Technology Conference (ECTC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-1499-6}, doi = {https://doi.org/10.1109/ECTC.2019.00320}, pages = {2324 -- 2330}, year = {2019}, language = {en} } @inproceedings{SchmidHermannBhogarajuetal.2022, author = {Schmid, Maximilian and Hermann, Joseph and Bhogaraju, Sri Krishna and Elger, Gordon}, title = {Reliability of SAC Solders under Low and High Stress Conditions}, booktitle = {2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-6654-8947-8}, doi = {https://doi.org/10.1109/ESTC55720.2022.9939394}, pages = {553 -- 559}, year = {2022}, language = {en} } @inproceedings{LiuBhogarajuLuxetal.2022, author = {Liu, E and Bhogaraju, Sri Krishna and Lux, Kerstin and Elger, Gordon and Mou, Rokeya Mumtahana}, title = {Investigation Of Stress Generated By Interconnection Processes With Micro-Raman Spectroscopy (μRS)}, booktitle = {Proceedings IEEE 72nd Electronic Components and Technology Conference: ECTC 2022}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-6654-7943-1}, doi = {https://doi.org/10.1109/ECTC51906.2022.00123}, pages = {739 -- 745}, year = {2022}, language = {en} } @inproceedings{SacconBeninBhogarajuetal.2022, author = {Saccon, Rodolfo and Benin, Alice and Bhogaraju, Sri Krishna and Elger, Gordon}, title = {Effect of binders on the performance of copper sintering pastes}, booktitle = {2022 International Conference on Electronics Packaging (ICEP 2022)}, publisher = {IEEE}, address = {Piscataway (NJ)}, isbn = {978-4-9911911-3-8}, doi = {https://doi.org/10.23919/ICEP55381.2022.9795555}, pages = {71 -- 72}, year = {2022}, language = {en} } @inproceedings{HanssSchmidBhogarajuetal.2018, author = {Hanss, Alexander and Schmid, Maximilian and Bhogaraju, Sri Krishna and Conti, Fosca and Elger, Gordon}, title = {Reliability of sintered and soldered high power chip size packages and flip chip LEDs}, booktitle = {ECTC - The 2018 IEEE 68th Electronic Components and Technology Conference: Proceedings}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-5386-5000-4}, doi = {https://doi.org/10.1109/ECTC.2018.00312}, pages = {2080 -- 2088}, year = {2018}, language = {en} } @inproceedings{BhogarajuMokhtariPascuccietal.2020, author = {Bhogaraju, Sri Krishna and Mokhtari, Omid and Pascucci, Jacopo and Hanss, Alexander and Schmid, Maximilian and Conti, Fosca and Elger, Gordon}, title = {Hybrid Cu particle paste with surface-modified particles for high temperature electronics packaging}, booktitle = {Proceedings 22nd European Microelectronics and Packaging Conference, EMPC}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-6291-1}, doi = {https://doi.org/10.23919/EMPC44848.2019.8951887}, year = {2020}, language = {en} } @inproceedings{HanssSchmidBhogarajuetal.2018, author = {Hanss, Alexander and Schmid, Maximilian and Bhogaraju, Sri Krishna and Conti, Fosca and Elger, Gordon}, title = {Process development and reliability of sintered high power chip size packages and flip chip LEDs}, booktitle = {2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-4-9902-1885-0}, doi = {https://doi.org/10.23919/ICEP.2018.8374351}, pages = {479 -- 484}, year = {2018}, language = {en} } @inproceedings{BhogarajuHanssSchmidetal.2018, author = {Bhogaraju, Sri Krishna and Hanss, Alexander and Schmid, Maximilian and Elger, Gordon and Conti, Fosca}, title = {Evaluation of silver and copper sintering of first level interconnects for high power LEDs}, booktitle = {2018 7th Electronic System-Integration Technology Conference (ESTC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-5386-6814-6}, doi = {https://doi.org/10.1109/ESTC.2018.8546499}, year = {2018}, language = {en} } @article{ContiHanssMokhtarietal.2018, author = {Conti, Fosca and Hanss, Alexander and Mokhtari, Omid and Bhogaraju, Sri Krishna and Elger, Gordon}, title = {Formation of tin-based crystals from a SnAgCu alloy under formic acid vapor}, volume = {42}, journal = {New Journal of Chemistry}, number = {23}, publisher = {RSC}, address = {London}, issn = {1369-9261}, doi = {https://doi.org/10.1039/C8NJ04173C}, pages = {19232 -- 19236}, year = {2018}, language = {en} } @inproceedings{BhogarajuSchmidLiuetal.2022, author = {Bhogaraju, Sri Krishna and Schmid, Maximilian and Liu, E and Saccon, Rodolfo and Elger, Gordon and Klassen, Holger and M{\"u}ller, Klaus and Pirzer, Georg}, title = {Low cost copper based sintered interconnect material for optoelectronics packaging}, booktitle = {2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-6654-7943-1}, doi = {https://doi.org/10.1109/ECTC51906.2022.00270}, pages = {1720 -- 1725}, year = {2022}, language = {en} } @inproceedings{SignoriniPedronContietal.2018, author = {Signorini, Raffaella and Pedron, Danilo and Conti, Fosca and Hanss, Alexander and Bhogaraju, Sri Krishna and Elger, Gordon}, title = {Thermomechanical Stress in GaN LED Soldered on Copper Substrate Evaluated by Raman Measurements and Computer Modelling}, booktitle = {2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-5386-6759-0}, doi = {https://doi.org/10.1109/THERMINIC.2018.8593304}, year = {2018}, language = {en} } @article{LiuBhogarajuWunderleetal.2022, author = {Liu, E and Bhogaraju, Sri Krishna and Wunderle, Bernhard and Elger, Gordon}, title = {Investigation of stress relaxation in SAC305 with micro-Raman spectroscopy}, volume = {2022}, pages = {114664}, journal = {Microelectronics Reliability}, number = {138}, publisher = {Elsevier}, address = {Amsterdam}, issn = {0026-2714}, doi = {https://doi.org/10.1016/j.microrel.2022.114664}, year = {2022}, language = {en} } @inproceedings{MohanBhogarajuLysienetal.2021, author = {Mohan, Nihesh and Bhogaraju, Sri Krishna and Lysien, Mateusz and Schneider, Ludovic and Granek, Filip and Lux, Kerstin and Elger, Gordon}, title = {Drop feature optimization for fine trace inkjet printing}, booktitle = {2021 23rd European Microelectronics and Packaging Conference \& Exhibition (EMPC): Technical Papers}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-0-9568086-7-7}, doi = {https://doi.org/10.23919/EMPC53418.2021.9585004}, year = {2021}, language = {en} } @inproceedings{BhogarajuSchmidKotadiaetal.2021, author = {Bhogaraju, Sri Krishna and Schmid, Maximilian and Kotadia, Hiren R. and Conti, Fosca and Elger, Gordon}, title = {Highly reliable die-attach bonding with etched brass flakes}, booktitle = {2021 23rd European Microelectronics and Packaging Conference \& Exhibition (EMPC): Technical Papers}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-0-9568086-7-7}, doi = {https://doi.org/10.23919/EMPC53418.2021.9584967}, year = {2021}, language = {en} } @inproceedings{SteinbergerBhogarajuElger2023, author = {Steinberger, Fabian and Bhogaraju, Sri Krishna and Elger, Gordon}, title = {Correlation between the characteristics of printed sinter paste and the quality of sintered interconnects through non-destructive analysis techniques}, booktitle = {NordPac 2023 Annual Microelectronics and Packaging Conference and Exhibition: Reviewed Papers}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-91-89821-06-4}, doi = {https://doi.org/10.23919/NordPac58023.2023.10186250}, year = {2023}, language = {en} } @article{MohanAhuirTorresBhogarajuetal.2024, author = {Mohan, Nihesh and Ahuir-Torres, Juan Ignacio and Bhogaraju, Sri Krishna and Webler, Ralf and Kotadia, Hiren R. and Erdogan, H{\"u}seyin and Elger, Gordon}, title = {Decomposition mechanism and morphological evolution of in situ realized Cu nanoparticles in Cu complex inks}, volume = {48}, journal = {New Journal of Chemistry}, number = {15}, publisher = {RSC}, address = {London}, issn = {1369-9261}, doi = {https://doi.org/10.1039/D3NJ05185D}, pages = {6796 -- 6808}, year = {2024}, language = {en} } @inproceedings{MohanAhuirTorresBhogarajuetal.2024, author = {Mohan, Nihesh and Ahuir-Torres, Juan Ignacio and Bhogaraju, Sri Krishna and Kotadia, Hiren R. and Elger, Gordon}, title = {Rapid Sintering of Inkjet Printed Cu Complex Inks Using Laser in Air}, booktitle = {2023 24th European Microelectronics and Packaging Conference \& Exhibition (EMPC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-0-9568086-9-1}, doi = {https://doi.org/10.23919/EMPC55870.2023.10418323}, year = {2024}, language = {en} } @inproceedings{BhogarajuUgoliniBelponeretal.2024, author = {Bhogaraju, Sri Krishna and Ugolini, Francesco and Belponer, Federico and Greci, Alessio and Elger, Gordon}, title = {Reliability of Copper Sintered Interconnects Under Extreme Thermal Shock Conditions}, booktitle = {2023 24th European Microelectronics and Packaging Conference \& Exhibition (EMPC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-0-9568086-9-1}, doi = {https://doi.org/10.23919/EMPC55870.2023.10418348}, year = {2024}, language = {en} } @inproceedings{BhogarajuMohanSteinbergeretal.2024, author = {Bhogaraju, Sri Krishna and Mohan, Nihesh and Steinberger, Fabian and Erdogan, H{\"u}seyin and Hadrava, Philipp and Elger, Gordon}, title = {Novel Low Temperature and Low Pressure Sintering of ADAS Radar Sensor Antenna Stack}, booktitle = {2023 24th European Microelectronics and Packaging Conference \& Exhibition (EMPC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-0-9568086-9-1}, doi = {https://doi.org/10.23919/EMPC55870.2023.10418277}, year = {2024}, language = {en} } @inproceedings{AhuirTorresBhogarajuWestetal.2024, author = {Ahuir-Torres, Juan Ignacio and Bhogaraju, Sri Krishna and West, Geoff and Elger, Gordon and Kotadia, Hiren R.}, title = {Understanding Cu Sintering and Its Role on Corrosion Behaviour for High-Temperature Microelectronic Application}, booktitle = {2023 24th European Microelectronics and Packaging Conference \& Exhibition (EMPC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-0-9568086-9-1}, doi = {https://doi.org/10.23919/EMPC55870.2023.10418365}, year = {2024}, language = {en} } @article{ElgerBhogarajuSchneiderRamelow2024, author = {Elger, Gordon and Bhogaraju, Sri Krishna and Schneider-Ramelow, Martin}, title = {Hybrid Cu sinter paste for low temperature bonding of bare semiconductors}, volume = {2024}, pages = {136973}, journal = {Materials Letters}, number = {372}, publisher = {Elsevier}, address = {New York}, issn = {1873-4979}, doi = {https://doi.org/10.1016/j.matlet.2024.136973}, year = {2024}, abstract = {A novel hybrid copper paste was developed for low temperature sintering of bare semiconductors. Cu(II) formate (Cu(for)) is complexed in amino-2-propanol (A2P) and added to a paste of etched brass micro flakes. A two-step sintering process is applied: The paste is printed and dried at 120 °C under formic acid (FA) enriched N2 atmosphere (FAN2) for 5 min. Afterwards, bare semiconductors are placed and sintered at 250 °C for 5 min applying a bonding pressure of 20 MPa/10 MPa. By the thermal decomposition of the Cu(for) atomic Cu is released and forms in-situ Cu-nanoparticles. An interconnect is realized with shear strength >100 MPa.}, language = {en} } @inproceedings{ParetBhogarajuBusseetal.2024, author = {Paret, Paul and Bhogaraju, Sri Krishna and Busse, Dirk and Dahlb{\"u}dding, Alexander and Elger, Gordon and Narumanchi, Sreekant}, title = {Thermomechanical Degradation of Sintered Copper under High-Temperature Thermal Shock}, booktitle = {Proceedings: IEEE 74th Electronic Components and Technology Conference, ECTC 2024}, publisher = {IEEE}, address = {Piscataway}, isbn = {979-8-3503-7598-5}, doi = {https://doi.org/10.1109/ECTC51529.2024.00196}, pages = {1219 -- 1224}, year = {2024}, language = {en} } @inproceedings{ContiLuxBhogarajuetal.2021, author = {Conti, Fosca and Lux, Kerstin and Bhogaraju, Sri Krishna and Liu, E and Lenz, Christoph and Seitz, Roland and Elger, Gordon}, title = {Raman spectroscopy to investigate gallium nitride light emitting diodes after assembling onto copper substrates}, booktitle = {Optical Sensors 2021}, editor = {Baldini, Francesco and Homola, Jiri and Lieberman, Robert A.}, publisher = {SPIE}, address = {Bellingham}, isbn = {978-1-5106-4379-6}, doi = {https://doi.org/10.1117/12.2591947}, year = {2021}, language = {en} } @inproceedings{PandeyBhogarajuLuxetal.2022, author = {Pandey, Amit and Bhogaraju, Sri Krishna and Lux, Kerstin and Elger, Gordon}, title = {Analysis of stress in spherically bent thinned image sensors}, booktitle = {2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, publisher = {IEEE}, address = {Piscataway, NJ}, isbn = {978-1-6654-5836-8}, doi = {https://doi.org/10.1109/EuroSimE54907.2022.9758847}, year = {2022}, language = {en} }