@article{BhogarajuContiKotadiaetal.2020, author = {Bhogaraju, Sri Krishna and Conti, Fosca and Kotadia, Hiren R. and Keim, Simon and Tetzlaff, Ulrich and Elger, Gordon}, title = {Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging}, volume = {2020}, pages = {156043}, journal = {Journal of Alloys and Compounds}, number = {844}, publisher = {Elsevier}, address = {Amsterdam}, issn = {1873-4669}, doi = {https://doi.org/10.1016/j.jallcom.2020.156043}, year = {2020}, language = {en} } @article{MokhtariContiBhogarajuetal.2019, author = {Mokhtari, Omid and Conti, Fosca and Bhogaraju, Sri Krishna and Meier, Markus and Schweigart, Helmut and Tetzlaff, Ulrich and Elger, Gordon}, title = {Characterization of tin-oxides and tin-formate crystals obtained from SnAgCu solder alloy under formic acid vapor}, volume = {43}, journal = {New Journal of Chemistry}, number = {26}, publisher = {RSC}, address = {London}, issn = {1369-9261}, doi = {https://doi.org/10.1039/C9NJ02135C}, pages = {10227 -- 10231}, year = {2019}, language = {en} } @inproceedings{BhogarajuContiSchmidetal.2020, author = {Bhogaraju, Sri Krishna and Conti, Fosca and Schmid, Maximilian and Meier, Markus and Schweigart, Helmut and Elger, Gordon}, title = {Development of sinter paste with surface modified copper alloy particles for die-attach bonding}, booktitle = {ETG-Fachbericht 161, CIPS 2020, 11th International Conference on Integrated Power Electronics Systems}, publisher = {VDE Verlag}, address = {Berlin}, isbn = {978-3-8007-5226-3}, url = {https://www.vde-verlag.de/proceedings-de/455225100.html}, pages = {582 -- 587}, year = {2020}, language = {en} } @inproceedings{ElgerLiuContietal.2019, author = {Elger, Gordon and Liu, E and Conti, Fosca and Signorini, Raffaella and Brugnolotto, Enrico and Bhogaraju, Sri Krishna}, title = {Modelling Thermo-Mechanical Stress in GaN-LEDs Soldered on Copper Substrate with Simulations Validated by Raman Experiments}, booktitle = {2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-5386-8040-7}, doi = {https://doi.org/10.1109/EuroSimE.2019.8724533}, year = {2019}, language = {en} } @inproceedings{ElgerMokhtariBhogarajuetal.2020, author = {Elger, Gordon and Mokhtari, Omid and Bhogaraju, Sri Krishna and Conti, Fosca and Meier, Markus and Schweigart, Helmut}, title = {Analyse der Reaktionsprodukte von Metall-Formiaten im r{\"u}ckstandfreien L{\"o}tprozess}, booktitle = {GMM-Fb. 94: EBL 2020 - Elektronische Baugruppen und Leiterplatten}, publisher = {VDE Verlag}, address = {Berlin}, isbn = {978-3-8007-5185-3}, doi = {https://www.vde-verlag.de/proceedings-de/455185053.html}, year = {2020}, language = {de} } @inproceedings{BhogarajuMokhtariPascuccietal.2019, author = {Bhogaraju, Sri Krishna and Mokhtari, Omid and Pascucci, Jacopo and Conti, Fosca and Kotadia, Hiren R. and Elger, Gordon}, title = {A multi-pronged approach to low-pressure Cu sintering using surface-modified particles, substrate and chip metallization}, volume = {2019}, booktitle = {International Symposium on Microelectronics}, number = {1}, publisher = {IMAPS}, address = {Pittsburgh}, issn = {2380-4505}, doi = {https://doi.org/10.4071/2380-4505-2019.1.000387}, pages = {387 -- 392}, year = {2019}, language = {en} } @inproceedings{BhogarajuMokhtariPascuccietal.2019, author = {Bhogaraju, Sri Krishna and Mokhtari, Omid and Pascucci, Jacopo and Conti, Fosca and Elger, Gordon}, title = {Improved sinterability of particles to substrates by surface modifications on substrate metallization}, volume = {2019}, booktitle = {Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)}, number = {HiTen}, publisher = {IMAPS}, address = {Pittsburgh (PA)}, issn = {2380-4491}, doi = {https://doi.org/10.4071/2380-4491.2019.HiTen.000066}, pages = {66 -- 70}, year = {2019}, language = {en} } @inproceedings{SignoriniContiBrugnolottoetal.2019, author = {Signorini, Raffaella and Conti, Fosca and Brugnolotto, Enrico and Pedron, Danilo and Liu, E and Bhogaraju, Sri Krishna and Elger, Gordon}, title = {Thermomechanical local stress in assembled GaN LEDs investigated by Raman optical spectroscopy}, booktitle = {Integrated Optics: Design, Devices, Systems, and Applications V}, editor = {Cheben, Pavel and Čtyrok{\´y}, Jiř{\´i} and Molina-Fern{\´a}ndez, I{\~n}igo}, publisher = {SPIE}, address = {Bellingham}, isbn = {978-1-5106-2729-1}, doi = {https://doi.org/10.1117/12.2520992}, year = {2019}, language = {en} } @inproceedings{BrugnolottoBhogarajuLiuetal.2019, author = {Brugnolotto, Enrico and Bhogaraju, Sri Krishna and Liu, E and Conti, Fosca and Pedron, Danilo and Signorini, Raffaella and Elger, Gordon}, title = {Investigation of thermomechanical local stress induced in assembled GaN LEDs}, booktitle = {2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-2078-2}, doi = {https://doi.org/10.1109/THERMINIC.2019.8923629}, year = {2019}, language = {en} } @inproceedings{HanssSchmidBhogarajuetal.2018, author = {Hanss, Alexander and Schmid, Maximilian and Bhogaraju, Sri Krishna and Conti, Fosca and Elger, Gordon}, title = {Reliability of sintered and soldered high power chip size packages and flip chip LEDs}, booktitle = {ECTC - The 2018 IEEE 68th Electronic Components and Technology Conference: Proceedings}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-5386-5000-4}, doi = {https://doi.org/10.1109/ECTC.2018.00312}, pages = {2080 -- 2088}, year = {2018}, language = {en} }