@article{ThambiSchiesslWaltzetal.2017, author = {Thambi, Joel Luther and Schiessl, Andreas and Waltz, Manuela and Lang, Klaus-Dieter and Tetzlaff, Ulrich}, title = {Modified Constitutive Creep Laws With Micromechanical Modeling of Pb-Free Solder Alloys}, volume = {139}, pages = {031002}, journal = {Journal of Electronic Packaging}, number = {3}, publisher = {The American Society of Mechanical Engineers}, address = {New York}, issn = {1528-9044}, doi = {https://doi.org/10.1115/1.4035850}, year = {2017}, language = {en} }