@inproceedings{SchneiderLugnerBrandmeier2019, author = {Schneider, Kilian and Lugner, Robert and Brandmeier, Thomas}, title = {LiDAR-based contour estimation of oncoming vehicles in pre-crash scenarios}, booktitle = {2019 IEEE Intelligent Vehicles Symposium (IV)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-0560-4}, doi = {https://doi.org/10.1109/IVS.2019.8813825}, pages = {2272 -- 2277}, year = {2019}, language = {en} } @inproceedings{HeldSteinhauserKamannetal.2019, author = {Held, Patrick and Steinhauser, Dagmar and Kamann, Alexander and Koch, Andreas and Brandmeier, Thomas and Schwarz, Ulrich}, title = {Micro-Doppler extraction of bicycle pedaling movements using automotive radar}, booktitle = {2019 IEEE Intelligent Vehicles Symposium (IV)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-0560-4}, doi = {https://doi.org/10.1109/IVS.2019.8813828}, pages = {744 -- 749}, year = {2019}, language = {en} } @inproceedings{SteinhauserHeldKamannetal.2019, author = {Steinhauser, Dagmar and Held, Patrick and Kamann, Alexander and Koch, Andreas and Brandmeier, Thomas}, title = {Micro-Doppler extraction of pedestrian limbs for high resolution automotive radar}, booktitle = {2019 IEEE Intelligent Vehicles Symposium (IV)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-0560-4}, issn = {2642-7214}, doi = {https://doi.org/10.1109/IVS.2019.8813850}, pages = {764 -- 769}, year = {2019}, language = {en} } @inproceedings{ZaumseilSteinhauserHeldetal.2019, author = {Zaumseil, Patrick and Steinhauser, Dagmar and Held, Patrick and Kamann, Alexander and Brandmeier, Thomas}, title = {Radar-based near field environment perception using back projection algorithm}, booktitle = {European Microwave Week 2019: "Universality Through Microwaves" Conference Proceedings}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-2-87487-057-6}, url = {https://ieeexplore.ieee.org/document/8904568}, pages = {257 -- 260}, year = {2019}, language = {en} } @inproceedings{BhogarajuContiSchmidetal.2020, author = {Bhogaraju, Sri Krishna and Conti, Fosca and Schmid, Maximilian and Meier, Markus and Schweigart, Helmut and Elger, Gordon}, title = {Development of sinter paste with surface modified copper alloy particles for die-attach bonding}, booktitle = {ETG-Fachbericht 161, CIPS 2020, 11th International Conference on Integrated Power Electronics Systems}, publisher = {VDE Verlag}, address = {Berlin}, isbn = {978-3-8007-5226-3}, url = {https://www.vde-verlag.de/proceedings-de/455225100.html}, pages = {582 -- 587}, year = {2020}, language = {en} } @inproceedings{ZippeliusHanssLiuetal.2020, author = {Zippelius, Andreas and Hanss, Alexander and Liu, E and Schmid, Maximilian and P{\´e}rez-Vel{\´a}zquez, Judith and Elger, Gordon}, title = {Comparing prediction methods for LED failure measured with Transient Thermal Analysis}, booktitle = {2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-6049-8}, doi = {https://doi.org/10.1109/EuroSimE48426.2020.9152657}, year = {2020}, language = {en} } @inproceedings{PandeyKuehnErdoganetal.2020, author = {Pandey, Amit and K{\"u}hn, Stephan and Erdogan, H{\"u}seyin and Schneider, Klaus and Elger, Gordon}, title = {Finite Element Analysis: A Tool for Investigation of Sharpness Changes in Automotive Cameras}, booktitle = {2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-6049-8}, doi = {https://doi.org/10.1109/EuroSimE48426.2020.9152716}, year = {2020}, language = {en} } @inproceedings{LiuSchmidBhogarajuetal.2021, author = {Liu, E and Schmid, Maximilian and Bhogaraju, Sri Krishna and Elger, Gordon}, title = {Advanced location resolved transient thermal analysis}, booktitle = {2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-7643-7}, doi = {https://doi.org/10.1109/THERMINIC49743.2020.9420538}, pages = {191 -- 196}, year = {2021}, language = {en} } @inproceedings{SchmidBhogarajuRiedeletal.2021, author = {Schmid, Maximilian and Bhogaraju, Sri Krishna and Riedel, Andreas and Elger, Gordon}, title = {Development of an in-line capable transient thermal analysis equipment for a power module with five half bridges}, booktitle = {2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-7643-7}, doi = {https://doi.org/10.1109/THERMINIC49743.2020.9420493}, pages = {268 -- 273}, year = {2021}, language = {en} } @inproceedings{ContiLiuBhogarajuetal.2021, author = {Conti, Fosca and Liu, E and Bhogaraju, Sri Krishna and Lenz, Christoph and Seitz, Roland and Elger, Gordon}, title = {Stress evaluations of silicon nitride chips bonded onto copper substrates via SAC soldering, AuSn soldering, and copper sintering}, booktitle = {2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-7643-7}, doi = {https://doi.org/10.1109/THERMINIC49743.2020.9420523}, pages = {204 -- 208}, year = {2021}, language = {en} } @inproceedings{KeimTetzlaffElger2020, author = {Keim, Simon and Tetzlaff, Ulrich and Elger, Gordon}, title = {The influence of different-sized Ni micro- and nanopowders on the processing and microstructural properties of Sn-Ag-Cu-solder with low Ag content}, booktitle = {Proceedings: IEEE 70th Electronic Components and Technology Conference, ECTC 2020}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-6180-8}, issn = {2377-5726}, doi = {https://doi.org/10.1109/ECTC32862.2020.00312}, pages = {2005 -- 2012}, year = {2020}, language = {en} } @inproceedings{BhogarajuContiElger2020, author = {Bhogaraju, Sri Krishna and Conti, Fosca and Elger, Gordon}, title = {Copper die bonding using copper formate based pastes with α-terpineol, amino-2-propanol and hexylamine as binders}, booktitle = {2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-6293-5}, doi = {https://doi.org/10.1109/ESTC48849.2020.9229801}, year = {2020}, language = {en} } @inproceedings{ContiLiuBhogarajuetal.2020, author = {Conti, Fosca and Liu, E and Bhogaraju, Sri Krishna and Wunderle, Bernhard and Elger, Gordon}, title = {Finite Element simulations and Raman measurements to investigate thermomechanical stress in GaN-LEDs}, booktitle = {2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-6293-5}, doi = {https://doi.org/10.1109/ESTC48849.2020.9229843}, year = {2020}, language = {en} } @inproceedings{KuehnPandeyZippeliusetal.2020, author = {K{\"u}hn, Stephan and Pandey, Amit and Zippelius, Andreas and Schneider, Klaus and Erdogan, H{\"u}seyin and Elger, Gordon}, title = {Analysis of package design of optic modules for automotive cameras to realize reliable image sharpness}, booktitle = {2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-6293-5}, doi = {https://doi.org/10.1109/ESTC48849.2020.9229786}, year = {2020}, language = {en} } @article{HanzlHartmannHoelzleetal.2021, author = {Hanzl, Christian and Hartmann, Christoph and H{\"o}lzle, Markus and Liebhart, Bernhard and Schmid, Michael and Endisch, Christian}, title = {Current commutation in a switched lithium-ion cell used in cascaded half-bridge multilevel inverters}, volume = {14}, journal = {IET Power Electronics}, number = {6}, publisher = {Wiley}, address = {Hoboken}, issn = {1755-4543}, doi = {https://doi.org/10.1049/pel2.12088}, pages = {1073 -- 1088}, year = {2021}, abstract = {In order to improve the efficiency of battery electric vehicles, the utilization of reconfigurable batteries and multilevel inverters based on low-voltage Si MOSFETs gains growing attention. Focusing on the half-bridge as basic switching unit, this paper examines voltage and current waveforms during switching. It is shown that the current commutation speed depends on various factors such as sign and amplitude of the current as well as the particular switching scenario. For instance, turning off a positive cell current takes 0.21 𝜇s while turning it on takes 0.9 𝜇s. In addition, it is revealed that depending on the switching scenario and current direction, the lithium-ion cell supports or opposes the remagnetization of the parasitic inductances and therefore the switching losses of the MOSFETs. Switching a positive load current of 125 A from active to bypass converts 276 𝜇J into heat while switching from bypass to active converts merely 32.5 𝜇J into heat.}, language = {en} } @article{SchmidGebauerHanzletal.2020, author = {Schmid, Michael and Gebauer, Emanuel and Hanzl, Christian and Endisch, Christian}, title = {Active model-based fault diagnosis in reconfigurable battery systems}, volume = {36}, journal = {IEEE Transactions on Power Electronics}, number = {3}, publisher = {IEEE}, address = {Piscataway}, issn = {1941-0107}, doi = {https://doi.org/10.1109/TPEL.2020.3012964}, pages = {2584 -- 2597}, year = {2020}, language = {en} } @article{SchmidKneidingerEndisch2020, author = {Schmid, Michael and Kneidinger, Hans-Georg and Endisch, Christian}, title = {Data-driven fault diagnosis in battery systems through cross-cell monitoring}, volume = {21}, journal = {IEEE Sensors Journal}, number = {2}, publisher = {IEEE}, address = {New York}, issn = {1558-1748}, doi = {https://doi.org/10.1109/JSEN.2020.3017812}, pages = {1829 -- 1837}, year = {2020}, language = {en} } @article{RienerJeon2019, author = {Riener, Andreas and Jeon, Myounghoon}, title = {Guest editors' introduction: multimodal technologies and interaction in the era of automated driving}, volume = {3}, pages = {41}, journal = {Multimodal Technologies and Interaction}, number = {2}, publisher = {MDPI}, address = {Basel}, issn = {2414-4088}, doi = {https://doi.org/10.3390/mti3020041}, year = {2019}, language = {en} } @inproceedings{KleinerHeiderHanzletal.2020, author = {Kleiner, Jan and Heider, Alexander and Hanzl, Christian and Komsiyska, Lidiya and Elger, Gordon and Endisch, Christian}, title = {Thermal behavior of an intelligent li-ion cell under vehicle conditions}, booktitle = {Proceedings: IECON 2020 The 46th Annual Conference of the IEEE Industrial Electronics Society}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-1-7281-5414-5}, issn = {2577-1647}, doi = {https://doi.org/10.1109/IECON43393.2020.9254336}, pages = {2081 -- 2086}, year = {2020}, language = {en} } @article{SequeiraBrandmeier2020, author = {Sequeira, Gerald Joy and Brandmeier, Thomas}, title = {Evaluation and characterization of crash-pulses for head-on collisions with varying overlap crash scenarios}, volume = {2020}, journal = {Transportation Research Procedia}, number = {48}, publisher = {Elsevier}, address = {Amsterdam}, issn = {2352-1465}, doi = {https://doi.org/10.1016/j.trpro.2020.08.156}, pages = {1306 -- 1315}, year = {2020}, abstract = {Activation time for activating the occupant restraint systems (airbag and seatbelt) is very critical for an optimal safety action. A crash-pulse is the deceleration of the vehicle measured during in a crash. The shape, slope, maximum deceleration and duration of the crash-pulse provides significant information over the nature of occupant motions during in-crash phase and hence the crash severity. The above parameters of the crash-pulse not only depend on the mass and impact velocity but also on the crash configuration (position of impact, overlap, relative approach angle etc.). This study focuses on analysis and characterization of crash-pulses in head-on collision cases with varying overlap configurations. The paper describes causes for occupant injuries during a crash, crash-pulse and its important physical parameters, and different methodologies used to analyse the crash-pulse. Finite element simulation method is used to study the crash-pulses from different crash configurations. A new severity index that has direct influence on the occupant kinematics is defined. The results show that the steep decrease of crash-pulse for small overlap configurations (less than 25 percent of vehicle width) lags by 20 to 25 milliseconds as compared to configurations with large overlaps. The shape of the crash-pulse also changes for crash scenarios with different overlap configurations. The results, discussion and conclusion sections of this paper provide a summary of crash behaviour of varying overlap crash scenarios and insights that can be used for deployment of restraint systems.}, language = {en} }