TY - CONF A1 - Schmid, Maximilian A1 - Hermann, Joseph A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Reliability of SAC Solders under Low and High Stress Conditions BT - 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) KW - reliability KW - solder joint cracking KW - SAC solder KW - transient thermal analysis KW - SAM Y1 - 2022 UR - https://opus4.kobv.de/opus4-haw/frontdoor/index/index/docId/2966 UR - https://doi.org/10.1109/ESTC55720.2022.9939394 SN - 978-1-6654-8947-8 SP - 553 EP - 559 PB - IEEE CY - Piscataway ER -