TY - JOUR A1 - Thambi, Joel Luther A1 - Tetzlaff, Ulrich A1 - Schiessl, Andreas A1 - Lang, Klaus-Dieter A1 - Waltz, Manuela T1 - Evaluation of the relationship between stress and lifetime of Pb-free solder joints subjected to vibration load using a generalized local stress approach BT - Microelectronics Reliability KW - SnAgCu KW - High cycle fatigue (HCF) KW - Local stress KW - FKM guideline KW - Stress gradient KW - Roughness KW - Solder alloys KW - Experimental analysis KW - FEA KW - Surface mount technology (SMT) KW - Vibration KW - Harmonic frequency KW - Bulk solder KW - Fatigue KW - Durability KW - Solder joint failure KW - Component testing KW - Material characterisation KW - Chip capacitor KW - Transformer Y1 - 2020 UR - https://opus4.kobv.de/opus4-haw/frontdoor/index/index/docId/1703 UR - https://doi.org/10.1016/j.microrel.2019.113560 SN - 0026-2714 VL - 2020 IS - 106 PB - Elsevier CY - Amsterdam ER -