Cluster Mikrosystemtechnik
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In this paper, we report the recent research and development at the Technische Hochschule Ingolstadt (THI) on Cu based sinter pastes and conductive inks for applications in the field of high power electronics packaging and printed electronics. Cu based sinter pastes have been developed for low temperature (250-275°C), rapid (3-5 min) and low pressure (≤20 MPa) die-attach bonding process in an open bond chamber under N2 flow. A simple two-step sintering process similar to industrialized Ag sintering processes is implemented, thereby offering an attractive, cost-effective alternative that can be used on the same equipment currently used for Ag sintering under pressure. The average shear strength of 60 MPa which is comparable to commercial micro-scale Ag sinter pastes under same processing conditions is reported. Based on the development of Cu die-attach materials, also Cu inks for printed electronics were developed by complexing Cu(II) formate salt with an alkanol amine generating in-situ nanoparticles (ranging from 100-500 nm) after decomposition at lower temperatures (<160°C). Fine Cu traces of ~100 µm width are realized through ink-jet printing. The sintered inkjet printed traces gave a bulk resistivity value of 102 µΩcm for a trace of thickness 2.5±0.5 µm.
The Transport Layer Security (TLS) protocol is used to cryptographically secure network connections. To ensure authenticity, TLS uses certificates that are exchanged at the beginning of each new connection. Due to expiration or early revocation of certificates, the deployment of new certificates to devices in the field is necessary. In addition, a device must identify revoked certificates during connection establishment to abort the connection. This paper presents the implementation of these two functionalities within a Security Gateway for the power grid. The nature of embedded systems with their limited resources and requirements regarding dependability impact the device-specific implementation. With these features, the Security Gateway can be integrated into an existing Public-Key Infrastructure System.
We present a Pirani vacuum gauge with an actively temperature-stabilized environment. The heated sensor element is surrounded by two elements that are temperaturecontrolled to a certain level below the temperature of the heated sensor element. The idea is to create a homogeneous temperature distribution, which allows keeping the ambient temperature constant, thus increasing the accuracy and repeatability of vacuum measurements.
Within the scope of this project, a portable measuring device has been developed which enables a cost-effective analysis of organic substances from ppm to sub-ppm range, such as drug residues in groundwater. The measurement is carried out by means of a surface-enhanced Raman scattering effect (SERS effect) and an exchangeable sensor head. The sensor head used is a nanostructured optical glass fiber glued into a fiber cannula. The tip of the fiber has been processed to act as a SERS cell. The fiber cannula is connected to a freely movable patch cable by using an adapter. Para-thiocresol is used to characterize the SERS cells.
In order to increase reliability, scalability and fail safety of battery management systems (BMSs), a decentralized BMS consisting of peer nodes is proposed. To ensure complete autonomy each node is equipped with its own microcontroller. Each manages the charge and discharge processes and enables communication with other nodes in the system. The proposed system is a multi-microcomputer system. Changing requirements, software development and bug fixes require the ability to update system software of microcontrollers. In this paper, a specific boot concept is proposed to increase the testability of the system. First, the requirements for the software update process are analyzed. Subsequently, a boot concept using Controller Area Network (CAN) is introduced and its advantages and limitations are shown. Finally, the boot concept is evaluated and possible alternative boot concepts with optical data transmission via a polymer optical fiber (POF) or with dual CAN design are proposed.
The user interface of automation systems can sometimes be ambiguous and difficult to correlate with the right components of the system located in the real environment. In addition, inexperienced personnel is required to go through large documentation reports, to call an expert on site or even to require training in order to solve an issue. As such, this could be costly and inefficient for small and medium sized enterprises (SME). Here we show that an augmented reality (AR) based user interface can ease the interaction of a user/worker with a machine. In addition, by projecting virtual information on an image stream from a camera, the interaction between them can become more intuitive. Furthermore, we compare two kinds of devices which can be used with augmented reality – a head-mounted device and a hand-held device. Our results demonstrate that the user is able to understand faster the current system and interact with it without requiring any professional experience. Finally, we expect to expand our application to interact with more complex and large systems and enhanced features in respect with the user interface.
We present new micro processing and connecting processes with state-of-the-art ultrashort pulse laser systems with pulse durations in the femtosecond to picosecond timescale. Laser processes like shock-wave induced thin-film delamination (SWIFD), laser patterning of conductive thin films, fabrication of interconnection lines and laser-induced forward transfer (LIFT) of functional materials for the fabrication of microelectronic elements such as interconnects and embedded circuits are discussed in detail. These laser-induced processes and fabrication methods offer new possibilities for the packaging of semiconductor, surface mounted and/or hybrid systems and subsystems. Additionally, processing methods with these laser systems for innovative applications in the microelectronics field like the laser-lift-off for flexible displays and printed circuits, welding of brittle glass materials like sapphire and gorilla glass used in the communication area and micro machining of ceramic substrates with compact workstations equipped with high speed manufacturing tools are also presented.