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Copper sintering for microelectronics application

  • In this paper, we report the recent research and development at the Technische Hochschule Ingolstadt (THI) on Cu based sinter pastes and conductive inks for applications in the field of high power electronics packaging and printed electronics. Cu based sinter pastes have been developed for low temperature (250-275°C), rapid (3-5 min) and low pressure (≤20 MPa) die-attach bonding process in an open bond chamber under N2 flow. A simple two-step sintering process similar to industrialized Ag sintering processes is implemented, thereby offering an attractive, cost-effective alternative that can be used on the same equipment currently used for Ag sintering under pressure. The average shear strength of 60 MPa which is comparable to commercial micro-scale Ag sinter pastes under same processing conditions is reported. Based on the development of Cu die-attach materials, also Cu inks for printed electronics were developed by complexing Cu(II) formate salt with an alkanol amine generating in-situ nanoparticles (ranging from 100-500 nm) after decomposition at lower temperatures (<160°C). Fine Cu traces of ~100 µm width are realized through ink-jet printing. The sintered inkjet printed traces gave a bulk resistivity value of 102 µΩcm for a trace of thickness 2.5±0.5 µm.

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Metadaten
Verfasserangaben:Nihesh Mohan, Sri Krishna Bhogaraju, Rodolfo Saccon, Elger Gordon
URN:urn:nbn:de:bvb:860-opus4-3683
DOI:https://doi.org/10.57688/368
ISBN:978-3-9818439-6-5
Titel des übergeordneten Werkes (Englisch):Tagungsband 3. Symposium Elektronik und Systemintegration ESI
Herausgeber*in:Ivanov Artem, Bicker Marc, Patzelt Peter
Dokumentart:Konferenzveröffentlichung
Sprache:Englisch
Jahr der Fertigstellung:2022
Veröffentlichende Institution:Hochschule für Angewandte Wissenschaften Landshut
Datum der Freischaltung:23.06.2023
Erste Seite:118
Letzte Seite:126
Fakultät / Institut:Cluster Mikrosystemtechnik
Sammlungen:Symposium Elektronik und Systemintegration / Tagungsband 3. Symposium Elektronik und Systemintegration ESI 2022: Fachbeiträge; ISBN 978-3-9818439-4-1
Lizenz (Deutsch):Keine Creative Commons Lizenz (es gilt das deutsche Urheberrecht)