@inproceedings{MohanBhogarajuSacconetal.2022, author = {Mohan, Nihesh and Bhogaraju, Sri Krishna and Saccon, Rodolfo and Gordon, Elger}, title = {Copper sintering for microelectronics application}, series = {Tagungsband 3. Symposium Elektronik und Systemintegration ESI}, booktitle = {Tagungsband 3. Symposium Elektronik und Systemintegration ESI}, editor = {Artem, Ivanov and Marc, Bicker and Peter, Patzelt}, isbn = {978-3-9818439-6-5}, doi = {10.57688/368}, url = {http://nbn-resolving.de/urn:nbn:de:bvb:860-opus4-3683}, pages = {118 -- 126}, year = {2022}, abstract = {In this paper, we report the recent research and development at the Technische Hochschule Ingolstadt (THI) on Cu based sinter pastes and conductive inks for applications in the field of high power electronics packaging and printed electronics. Cu based sinter pastes have been developed for low temperature (250-275°C), rapid (3-5 min) and low pressure (≤20 MPa) die-attach bonding process in an open bond chamber under N2 flow. A simple two-step sintering process similar to industrialized Ag sintering processes is implemented, thereby offering an attractive, cost-effective alternative that can be used on the same equipment currently used for Ag sintering under pressure. The average shear strength of 60 MPa which is comparable to commercial micro-scale Ag sinter pastes under same processing conditions is reported. Based on the development of Cu die-attach materials, also Cu inks for printed electronics were developed by complexing Cu(II) formate salt with an alkanol amine generating in-situ nanoparticles (ranging from 100-500 nm) after decomposition at lower temperatures (<160°C). Fine Cu traces of ~100 µm width are realized through ink-jet printing. The sintered inkjet printed traces gave a bulk resistivity value of 102 µΩcm for a trace of thickness 2.5±0.5 µm.}, language = {en} }