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Piezoelectrets fabricated from fluoroethylenepropylene (FEP)-foils have shown drastic increase of their piezoelectric
properties during the last decade. This led to the development of FEP-based energy harvesters, which are about to evolve
into a technology with a power-generation-capacity of milliwatt per square-centimeter at their resonance frequency. Recent
studies focus on piezoelectrets with solely negative charges, as they have a better charge stability and a better suitability for
implementation in rising technologies, like the internet of things (IOT) or portable electronics. With these developments
heading towards applications of piezoelectrets in the near future, there is an urgent need to also address the fabrication
process in terms of scalability, reproducibility and miniaturization. In this study, we firstly present a comprehensive review
of the literature for a deep insight into the research that has been done in the field of FEP-based piezoelectrets. For the first
time, we propose the employment of microsystem-technology and present a process for the fabrication of thermoformed
FEP piezoelectrets based on thermoforming SU-8 templates. Following this process, unipolar piezoelectrets were fabricated with air void dimensions in the range of 300–1000 lm in width and approx. 90 lm in height. For samples with a void
size of 1000 lm, a d33-coefficient up to 26,508 pC/N has been achieved, depending on the applied seismic mass. Finally,
the properties as energy harvester were characterized. At the best, an electrical power output of 0.51 mW was achieved for
an acceleration of 1 g with a seismic mass of 101 g. Such piezoelectrets with highly defined dimensions show good
energy output in relation to volume, with high potential for widespread applications.
This paper presents an optimized laser-bonding process for piezoelectric energy-harvesters based on thin fluorinated-ethylene-propylene (FEP) foils, using an ultra-short-pulse(USP) laser. Due to the minimized thermal stress in the material during bonding, achieved bypulse durations of few picoseconds, we created seams down to 40μm width without generatingholes in the 12.5μm thick FEP-foils. Using a galvanometer scanning system allowed for fastbonding-speed up to several centimeters per second, making the process also suitable for largestructures and areas. The achieved bond strength of the seams under influence of shearingstress was examined using tensile testing, which showed a sufficient strength of about 25 % of the maximum strength of an unbonded, single layer of FEP.