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Integrating artificial intelligence (AI) into decision-making processes is key to improving organizational performance. However, trust in AI-based decision support systems (DSSs), similar to other information systems, is important for successful integration. A disruptive phenomenon, “algorithm aversion”, can impede AI trust and, thus, acceptance. Although AI recommendations outperform human recommendations in different decision-making fields, individuals underweight recommendations from AI-based DSSs compared to human decision-makers due to a lack of AI trust. We conducted a lab experiment to investigate the role of AI recommendations in workplace-related tasks, first focusing on the mediating effect of AI trust and the negative impact of algorithm aversion on decision-making performance and the moderating effect of technical competence. Second, we analyzed the ability of gamification to reduce this phenomenon. We provide evidence regarding how to enhance decision-making performance when AI recommendations are deployed and identify countermeasures against algorithm aversion to facilitate the adoption of AI-based DSSs.
We report on laser drilling borehole arrays using ultrashort pulsed lasers with a particular focus on reducing the inadvertent heat accumulation across the workpiece by optimizing the drilling sequence. For the optimization, evolutionary algorithms are used and their results are verified by thermal simulation using Comsol and experimentally evaluated using a thermal imaging camera. To enhance process efficiency in terms of boreholes drilled per second, multi-spot approaches are employed using a spatial light modulator. However, as higher temperatures occur across the workpiece when using simultaneous multi-spot drilling as compared to a single-spot process, a subtle spatial distribution and sequence of the multi-spot approach has to be selected in order to limit the
resulting local heat input over the processing time. Different optimization approaches based on evolutionary algorithms aid to select those drilling sequences which allow for the combination of a high efficiency of multi-spot profiles, a low-generated process temperature and a high-component quality. In particular, using a 4 x 4 laser spot array allows for the drilling of 40,000 boreholes in less than 76 s (526 boreholes/s) with a reduced temperature increase by about 35%, as compared to a single spot process when employing an optimized drilling sequence.
Multi-Bessel Beams Generated by an Axicon and a Spatial Light Modulator for Drilling Applications
(2023)
We report on an optical setup to generate multi-Bessel beam profiles combining a refractive axicon and a spatial light modulator. Based on their particular beam profile, Bessel beams offer advantageous properties for micro drilling processes and internal volume processing, especially for transparent materials. In addition, the laser power of industrial, ultrashort pulsed lasers has increased significantly over the last few years, offering the possibility for highly efficient processes using multi-spot profiles. Our optical concept combines the dynamic possibilities of beam splitting using a spatial light modulator with the benefits of Bessel beams, which facilitates multi-Bessel beam processing. Beside the simulation and experimental evaluation of the generated multi-Bessel beams, we exemplify the applicability of the developed module for the perforation of thin metal foils by micro drilling.
Axicon generated Bessel beams are a popular tool for high aspect ratio precision laser drilling. Spot diameter and working distance are given by the geometric parameters of the axicon and the wavelength used. Thus, it is difficult to manipulate the beam shape of a Bessel beam for a given setup. Spatial light modulators (SLMs) overcome limitations in flexibility. However, due to the limited phase shift of SLMs, only Bessel beams with flat cone angles and large focal length can be generated. In this contribution, an approach for generating Bessel beams with a shorter, but tunable focal length is presented. A physical axicon was combined with an SLM. A holographic image of a negative axicon is put on the SLM to generate a ring beam, which is focused by a subsequent physical axicon to get a small focal diameter. Thus, different sized high aspect ratio micro holes can be drilled without using any moving components.
In recent years, the demand for sustainable and degradable materials and electronic devices has increased significantly.
Among a range of biodegradable polymers, poly(lactic acid) (PLA) is a good alternative to conventional petrol-based polymers because of its attractive mechanical properties and its easy processability. Recently, PLA has also been described as a promising dielectric material with piezoelectric and electret properties. We expect that PLA—after further optimization— will play an important role as a material for environmentally friendly sensors in the future, where first applications such as air filters and pressure sensors have already been proposed. However, degradation under normal ambient conditions is very slow, and an accelerated and controllable degradation process is highly desirable for any type of PLA-based sensors.
Enzymatic hydrolysis with embedded enzymes has been proposed as an approach to accelerate and control degradation. In this work, we investigate the properties of PLA in terms of dielectric and mechanical properties with a focus on its ability to store charges after the enzyme proteinase K (Trit. album) has been incorporated. Results reveal that proteinase K has a positive effect on the charge stability of solvent-cast PLA electrets after complete evaporation of the solvent. Furthermore, we observed a concentration-dependent acceleration of mass loss in a Tris-HCl buffer. A fast degradation within only one day occurred at a concentration of 6 wt% proteinase K.
Two different control concepts for the automatic track guidance of forklifts are
proposed. Both approaches are based on Reinforcement Learning (RL), a method of Artificial
Intelligence (AI), and are able to take into account time-variant parameters, such as the vehicle velocity, and to reduce the influence of the path curvature, the most important disturbance variable of lateral vehicle control. In the first approach, both, the path curvature and the vehicle velocity signal, are provided to the controller in addition to the state variables of the controlled system. By varying the corresponding parameters in the training process, both signals can be considered and the control parameters can be optimized accordingly. In the second approach, several controllers (multi-model concept) considering the path curvature are used and the varying vehicle velocity is taken into account using a gain-scheduling concept. Considering time-variant vehicle parameters and the influence of the disturbance variable during operation, a stable track guidance is guaranteed within the whole speed range of the industrial trucks.
We report on a comprehensive study of laser percussion microvia drilling of Ajinomoto build-up film (ABF) material using an ultrashort pulsed laser in MHz burst mode. After laser processing, microvia drilling quality is being evaluated by the fabricated diameter and taper using laser scanning microscopy and metallography. The influences of the incubation effect, heat accumulation and shielding effects as a result of pulse to pulse interactions are being discussed on the ablation threshold, penetration depth and laser microvia drilling quality. We find that an increasing heat accumulation in MHz burst mode processing is responsible for the void formation and delamination of the insulating ABF layer. Therefore, the parameter clearance is introduced to evaluate these effects on the microvia sidewalls. For a comparable clearance, applying 2 intra-burst pulses achieves an average reduced taper of down to 19.5% compared to single pulse mode. At the same time, a reduced laser drilling time of 16.7% per microvia highlights the enormous potential of the MHz burst mode for laser drilling of ABF material in printed circuit board fabrication.
This article discusses the process of the laser turning of rotational symmetric, cylindrical components using ultrashort laser pulses with respect to the geometrical conditions and the resulting energy distribution during the laser turning process. As a result, process predictions and potential process optimizations are feasible. Particular attention is drawn to the laser spot formation on the cylindrical surface of the work piece in conjunction with the positioning of the laser beam relative to the rotation axis of the specimen. Based on fundamental calculations and experimental results, an optimum processing strategy is discussed, whereat the use of a trepanning optic in the laser turning process and the forming of a particular surface structure is additionally being issued.
We report on ultraviolet ultrashort pulsed laser processing of silicon carbide. Laser ablated cavities are evaluated with respect to their ablation rates, surface roughness and overall quality by varying the laser pulse fluence. Using this type of laser, high edge quality and surface roughness down to 107 nm can be achieved with an ablation efficiency of up to 0.228 mm 3 W −1 min −1. Functional surfaces are produced by generating laser induced periodic surface structures. The comparison with infrared wavelength underlines the advantages of the ultraviolet wavelength for laser micro machining this material. Significant differences with respect to the measured ablation depths and roughness as well as generated micro-and nanostructures appear. While infrared ablation is dominated by a chipping mechanism above a critical fluence of 9.93 Jcm −2 , higher ablation rates are observed with strong quality losses at the same time. In comparison to the infrared emission wavelength, in general , a significantly higher processing quality is achieved with the ultraviolet emission wavelength. In addition, the influence of spot size and repetition rate in UV processing is investigated. By increasing these parameters, a process acceleration without quality losses is enabled. The generation of a sophisticated microstructure exemplifies the advantages of processing silicon carbide with the UV laser reported here.